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Reel/Frame:027038/0726   Pages: 5
Recorded: 10/10/2011
Attorney Dkt #:0120177
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
13270012
Filing Dt:
10/10/2011
Publication #:
Pub Dt:
04/11/2013
Title:
Copper Stud Bump Wafer Level Package
Assignors
1
Exec Dt:
10/07/2011
2
Exec Dt:
10/05/2011
3
Exec Dt:
10/07/2011
Assignee
1
4000 MACARTHUR BOULEVARD
NEWPORT BEACH, CALIFORNIA 92660
Correspondence name and address
FARSHAD FARJAMI
26522 LA ALAMEDA AVE., SUITE 360
MISSION VIEJO, CA 92691

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