Patent Assignment Details
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Reel/Frame: | 024045/0739 | |
| Pages: | 9 |
| | Recorded: | 03/09/2010 | | |
Attorney Dkt #: | 21260-001AA1 (ASSIGNMENT) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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02/27/2001
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Application #:
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09159120
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Filing Dt:
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09/23/1998
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Title:
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WARP-RESISTENT ULTRA-THIN INTEGRATED CIRCUIT PACKAGE FABRICATION METHOD
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Patent #:
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Issue Dt:
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06/03/2003
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Application #:
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10101039
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Filing Dt:
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03/19/2002
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Publication #:
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Pub Dt:
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08/01/2002
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Title:
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FLEXIBLE CIRCUIT CONNECTOR FOR STACKED CHIP MODULE
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Assignee
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8900 SHOAL CREEK BLVD., SUITE 125 |
AUSTIN, TEXAS 78758 |
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Correspondence name and address
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STEVEN LAUFF
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CIVINS DENKO COBURN & LAUFF LLP
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816 CONGRESS AVE., SUITE 1205
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AUSTIN, TX 78701
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