Patent Assignment Details
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| Reel/Frame: | 009598/0747 | |
| Pages: | 4 |
| | Recorded: | 11/16/1998 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/20/2001
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Application #:
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09146949
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Filing Dt:
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09/03/1998
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Title:
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METHODS, APPARATUSES AND SUBSTRATE ASSEMBLY STRUCTURES FOR FABRICATING MICROELECTRONIC COMPONENTS USING MECHANICAL AND CHEMICAL-MECHANICAL PLANARIZATION PROCESSES
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Assignee
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| 8000 SOUTH FEDERAL WAY |
| BOISE, IDAHO 83706 |
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Correspondence name and address
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SEED AND BERRY LLP
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PAUL T. PARKER
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6300 COLUMBIA CENTER
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701 FIFTH AVENUE
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SEATTLE, WA 98104-7092
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