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Patent Assignment Details
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Reel/Frame:036288/0748   Pages: 247
Recorded: 08/06/2015
Attorney Dkt #:70341.00400
Conveyance: SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1836
Page 4 of 19
Pages: 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
1
Patent #:
7589407
Issue Dt:
09/15/2009
Application #:
11396954
Filing Dt:
04/03/2006
Publication #:
US20060226536
Pub Dt:
10/12/2006
Title:
SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING TAPE SUBSTRATE LAND GRID ARRAY PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE
2
Patent #:
7429787
Issue Dt:
09/30/2008
Application #:
11397027
Filing Dt:
03/31/2006
Publication #:
US20060220210
Pub Dt:
10/05/2006
Title:
SEMICONDUCTOR ASSEMBLY INCLUDING CHIP SCALE PACKAGE AND SECOND SUBSTRATE WITH EXPOSED SURFACES ON UPPER AND LOWER SIDES
3
Patent #:
7728417
Issue Dt:
06/01/2010
Application #:
11419748
Filing Dt:
05/22/2006
Publication #:
US20070108582
Pub Dt:
05/17/2007
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING SHIELD
4
Patent #:
9129826
Issue Dt:
09/08/2015
Application #:
11420853
Filing Dt:
05/30/2006
Publication #:
US20060267609
Pub Dt:
11/30/2006
Title:
Epoxy Bump for Overhang Die
5
Patent #:
7528474
Issue Dt:
05/05/2009
Application #:
11420873
Filing Dt:
05/30/2006
Publication #:
US20060267175
Pub Dt:
11/30/2006
Title:
STACKED SEMICONDUCTOR PACKAGE ASSEMBLY HAVING HOLLOWED SUBSTRATE
6
Patent #:
7732907
Issue Dt:
06/08/2010
Application #:
11421051
Filing Dt:
05/30/2006
Publication #:
US20070278660
Pub Dt:
12/06/2007
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH EDGE CONNECTION SYSTEM
7
Patent #:
7550680
Issue Dt:
06/23/2009
Application #:
11424202
Filing Dt:
06/14/2006
Publication #:
US20070289777
Pub Dt:
12/20/2007
Title:
PACKAGE-ON-PACKAGE SYSTEM
8
Patent #:
7394148
Issue Dt:
07/01/2008
Application #:
11424480
Filing Dt:
06/15/2006
Publication #:
US20060284299
Pub Dt:
12/21/2006
Title:
MODULE HAVING STACKED CHIP SCALE SEMICONDUCTOR PACKAGES
9
Patent #:
7556987
Issue Dt:
07/07/2009
Application #:
11428272
Filing Dt:
06/30/2006
Publication #:
US20080001263
Pub Dt:
01/03/2008
Title:
METHOD OF FABRICATING AN INTEGRATED CIRCUIT WITH ETCHED RING AND DIE PADDLE
10
Patent #:
7736950
Issue Dt:
06/15/2010
Application #:
11435305
Filing Dt:
05/15/2006
Publication #:
US20090045507
Pub Dt:
02/19/2009
Title:
FLIP CHIP INTERCONNECTION
11
Patent #:
NONE
Issue Dt:
Application #:
11435555
Filing Dt:
05/16/2006
Publication #:
US20060255473
Pub Dt:
11/16/2006
Title:
Flip chip interconnect solder mask
12
Patent #:
7563647
Issue Dt:
07/21/2009
Application #:
11456532
Filing Dt:
07/10/2006
Publication #:
US20070108569
Pub Dt:
05/17/2007
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERCONNECT SUPPORT
13
Patent #:
7545032
Issue Dt:
06/09/2009
Application #:
11456544
Filing Dt:
07/10/2006
Publication #:
US20080006926
Pub Dt:
01/10/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STIFFENER
14
Patent #:
8124520
Issue Dt:
02/28/2012
Application #:
11456551
Filing Dt:
07/10/2006
Publication #:
US20080014738
Pub Dt:
01/17/2008
Title:
INTEGRATED CIRCUIT MOUNT SYSTEM WITH SOLDER MASK PAD
15
Patent #:
8581380
Issue Dt:
11/12/2013
Application #:
11456554
Filing Dt:
07/10/2006
Publication #:
US20080006921
Pub Dt:
01/10/2008
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ULTRA-THIN DIE
16
Patent #:
8039365
Issue Dt:
10/18/2011
Application #:
11456845
Filing Dt:
07/11/2006
Publication #:
US20080012095
Pub Dt:
01/17/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING WAFER LEVEL SPACER
17
Patent #:
7759169
Issue Dt:
07/20/2010
Application #:
11456846
Filing Dt:
07/11/2006
Publication #:
US20080012122
Pub Dt:
01/17/2008
Title:
INTEGRATED CIRCUIT HEAT SPREADER STACKING METHOD
18
Patent #:
NONE
Issue Dt:
Application #:
11458065
Filing Dt:
07/17/2006
Publication #:
US20070108583
Pub Dt:
05/17/2007
Title:
INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM
19
Patent #:
8124460
Issue Dt:
02/28/2012
Application #:
11458078
Filing Dt:
07/17/2006
Publication #:
US20080012098
Pub Dt:
01/17/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING AN EXPOSED THERMALLY CONDUCTIVE COATING
20
Patent #:
7727816
Issue Dt:
06/01/2010
Application #:
11459305
Filing Dt:
07/21/2006
Publication #:
US20080017955
Pub Dt:
01/24/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OFFSET STACKED DIE
21
Patent #:
7399658
Issue Dt:
07/15/2008
Application #:
11459317
Filing Dt:
07/21/2006
Publication #:
US20070111379
Pub Dt:
05/17/2007
Title:
PRE-MOLDED LEADFRAME AND METHOD THEREFOR
22
Patent #:
7683461
Issue Dt:
03/23/2010
Application #:
11459320
Filing Dt:
07/21/2006
Publication #:
US20080096401
Pub Dt:
04/24/2008
Title:
INTEGRATED CIRCUIT LEADLESS PACKAGE SYSTEM
23
Patent #:
7993939
Issue Dt:
08/09/2011
Application #:
11459325
Filing Dt:
07/21/2006
Publication #:
US20080017960
Pub Dt:
01/24/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LAMINATE BASE
24
Patent #:
7495321
Issue Dt:
02/24/2009
Application #:
11459557
Filing Dt:
07/24/2006
Publication #:
US20080017994
Pub Dt:
01/24/2008
Title:
LEADED STACKED PACKAGES HAVING ELEVATED DIE PADDLE
25
Patent #:
7667308
Issue Dt:
02/23/2010
Application #:
11459568
Filing Dt:
07/24/2006
Publication #:
US20080017957
Pub Dt:
01/24/2008
Title:
LEADED STACKED PACKAGES HAVING INTEGRATED UPPER LEAD
26
Patent #:
7833840
Issue Dt:
11/16/2010
Application #:
11462247
Filing Dt:
08/03/2006
Publication #:
US20080032456
Pub Dt:
02/07/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DOWN-SET DIE PAD AND METHOD OF MANUFACTURE THEREOF
27
Patent #:
7705475
Issue Dt:
04/27/2010
Application #:
11462303
Filing Dt:
08/03/2006
Publication #:
US20080029911
Pub Dt:
02/07/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM
28
Patent #:
7535086
Issue Dt:
05/19/2009
Application #:
11462320
Filing Dt:
08/03/2006
Publication #:
US20080029858
Pub Dt:
02/07/2008
Title:
INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM
29
Patent #:
8293584
Issue Dt:
10/23/2012
Application #:
11462509
Filing Dt:
08/04/2006
Publication #:
US20080029847
Pub Dt:
02/07/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FILLED WAFER RECESS
30
Patent #:
7439620
Issue Dt:
10/21/2008
Application #:
11462537
Filing Dt:
08/04/2006
Publication #:
US20080029905
Pub Dt:
02/07/2008
Title:
INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
31
Patent #:
7700458
Issue Dt:
04/20/2010
Application #:
11462545
Filing Dt:
08/04/2006
Publication #:
US20080029859
Pub Dt:
02/07/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING WAFER LEVEL CHIP SCALE PACKAGING
32
Patent #:
7645638
Issue Dt:
01/12/2010
Application #:
11462568
Filing Dt:
08/04/2006
Publication #:
US20080029866
Pub Dt:
02/07/2008
Title:
STACKABLE MULTI-CHIP PACKAGE SYSTEM WITH SUPPORT STRUCTURE
33
Patent #:
7622333
Issue Dt:
11/24/2009
Application #:
11462588
Filing Dt:
08/04/2006
Publication #:
US20080029867
Pub Dt:
02/07/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING AND MANUFACTURING METHOD THEREOF
34
Patent #:
8432026
Issue Dt:
04/30/2013
Application #:
11462607
Filing Dt:
08/04/2006
Publication #:
US20080029868
Pub Dt:
02/07/2008
Title:
STACKABLE MULTI-CHIP PACKAGE SYSTEM
35
Patent #:
7687892
Issue Dt:
03/30/2010
Application #:
11463072
Filing Dt:
08/08/2006
Publication #:
US20080036051
Pub Dt:
02/14/2008
Title:
QUAD FLAT PACKAGE
36
Patent #:
7618848
Issue Dt:
11/17/2009
Application #:
11463505
Filing Dt:
08/09/2006
Publication #:
US20080036052
Pub Dt:
02/14/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORTED STACKED DIE
37
Patent #:
7687919
Issue Dt:
03/30/2010
Application #:
11463855
Filing Dt:
08/10/2006
Publication #:
US20070108621
Pub Dt:
05/17/2007
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ARCHED PEDESTAL
38
Patent #:
7678611
Issue Dt:
03/16/2010
Application #:
11464631
Filing Dt:
08/15/2006
Publication #:
US20060292831
Pub Dt:
12/28/2006
Title:
SPACER DIE STRUCTURE AND METHOD FOR ATTACHING
39
Patent #:
7901956
Issue Dt:
03/08/2011
Application #:
11464726
Filing Dt:
08/15/2006
Publication #:
US20080042275
Pub Dt:
02/21/2008
Title:
STRUCTURE FOR BUMPED WAFER TEST
40
Patent #:
8211749
Issue Dt:
07/03/2012
Application #:
11465706
Filing Dt:
08/18/2006
Publication #:
US20080042245
Pub Dt:
02/21/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WAFERSCALE SPACER
41
Patent #:
8901439
Issue Dt:
12/02/2014
Application #:
11465744
Filing Dt:
08/18/2006
Publication #:
US20080041964
Pub Dt:
02/21/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WINDOW OPENING
42
Patent #:
8632112
Issue Dt:
01/21/2014
Application #:
11465769
Filing Dt:
08/18/2006
Publication #:
US20080066511
Pub Dt:
03/20/2008
Title:
WORKPIECE DISPLACEMENT SYSTEM
43
Patent #:
7936055
Issue Dt:
05/03/2011
Application #:
11466748
Filing Dt:
08/23/2006
Publication #:
US20080054421
Pub Dt:
03/06/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERLOCK
44
Patent #:
NONE
Issue Dt:
Application #:
11469307
Filing Dt:
08/31/2006
Publication #:
US20070001296
Pub Dt:
01/04/2007
Title:
BUMP FOR OVERHANG DEVICE
45
Patent #:
8134196
Issue Dt:
03/13/2012
Application #:
11469576
Filing Dt:
09/01/2006
Publication #:
US20070108615
Pub Dt:
05/17/2007
Title:
INTEGRATED CIRCUIT SYSTEM WITH METAL-INSULATOR-METAL CIRCUIT ELEMENT
46
Patent #:
7622811
Issue Dt:
11/24/2009
Application #:
11521974
Filing Dt:
09/14/2006
Publication #:
US20080067695
Pub Dt:
03/20/2008
Title:
SEMICONDUCTOR ASSEMBLY WITH COMPONENT ATTACHED ON DIE BACK SIDE
47
Patent #:
7713782
Issue Dt:
05/11/2010
Application #:
11525493
Filing Dt:
09/22/2006
Publication #:
US20080122117
Pub Dt:
05/29/2008
Title:
FUSIBLE I/O INTERCONNECTION SYSTEMS AND METHODS FOR FLIP-CHIP PACKAGING INVOLVING SUBSTRATE-MOUNTED STUD-BUMPS
48
Patent #:
7541222
Issue Dt:
06/02/2009
Application #:
11530802
Filing Dt:
09/11/2006
Publication #:
US20070063354
Pub Dt:
03/22/2007
Title:
WIRE SWEEP RESISTANT SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
49
Patent #:
8623704
Issue Dt:
01/07/2014
Application #:
11530841
Filing Dt:
09/11/2006
Publication #:
US20070015314
Pub Dt:
01/18/2007
Title:
ADHESIVE/SPACER ISLAND STRUCTURE FOR MULTIPLE DIE PACKAGE
50
Patent #:
7659608
Issue Dt:
02/09/2010
Application #:
11532387
Filing Dt:
09/15/2006
Publication #:
US20080067658
Pub Dt:
03/20/2008
Title:
STACKED DIE SEMICONDUCTOR DEVICE HAVING CIRCUIT TAPE
51
Patent #:
7786551
Issue Dt:
08/31/2010
Application #:
11532455
Filing Dt:
09/15/2006
Publication #:
US20070108557
Pub Dt:
05/17/2007
Title:
INTEGRATED CIRCUIT SYSTEM WITH WAFER TRIMMING
52
Patent #:
NONE
Issue Dt:
Application #:
11532508
Filing Dt:
09/15/2006
Publication #:
US20080067639
Pub Dt:
03/20/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ENCAPSULATION LOCK
53
Patent #:
8067271
Issue Dt:
11/29/2011
Application #:
11532509
Filing Dt:
09/15/2006
Publication #:
US20080067640
Pub Dt:
03/20/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ENCAPSULATION LOCK
54
Patent #:
8093693
Issue Dt:
01/10/2012
Application #:
11532510
Filing Dt:
09/15/2006
Publication #:
US20080067698
Pub Dt:
03/20/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ENCAPSULATION LOCK
55
Patent #:
7952209
Issue Dt:
05/31/2011
Application #:
11536242
Filing Dt:
09/28/2006
Publication #:
US20080079173
Pub Dt:
04/03/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PAD TO PAD BONDING
56
Patent #:
8030134
Issue Dt:
10/04/2011
Application #:
11536424
Filing Dt:
09/28/2006
Publication #:
US20070018296
Pub Dt:
01/25/2007
Title:
STACKED SEMICONDUCTOR PACKAGE HAVING ADHESIVE/SPACER STRUCTURE AND INSULATION
57
Patent #:
8642383
Issue Dt:
02/04/2014
Application #:
11536502
Filing Dt:
09/28/2006
Publication #:
US20080079130
Pub Dt:
04/03/2008
Title:
DUAL-DIE PACKAGE STRUCTURE HAVING DIES EXTERNALLY AND SIMULTANEOUSLY CONNECTED VIA BUMP ELECTRODES AND BOND WIRES
58
Patent #:
7700404
Issue Dt:
04/20/2010
Application #:
11536544
Filing Dt:
09/28/2006
Publication #:
US20070018290
Pub Dt:
01/25/2007
Title:
LARGE DIE PACKAGE STRUCTURES AND FABRICATION METHOD THEREFOR
59
Patent #:
7700404
Issue Dt:
04/20/2010
Application #:
11536544
Filing Dt:
09/28/2006
Publication #:
US20070018290
Pub Dt:
01/25/2007
Title:
LARGE DIE PACKAGE STRUCTURES AND FABRICATION METHOD THEREFOR
60
Patent #:
7851257
Issue Dt:
12/14/2010
Application #:
11538806
Filing Dt:
10/04/2006
Publication #:
US20070114651
Pub Dt:
05/24/2007
Title:
INTEGRATED CIRCUIT STACKING SYSTEM WITH INTEGRATED PASSIVE COMPONENTS
61
Patent #:
8669637
Issue Dt:
03/11/2014
Application #:
11553949
Filing Dt:
10/27/2006
Publication #:
US20070114634
Pub Dt:
05/24/2007
Title:
INTEGRATED PASSIVE DEVICE SYSTEM
62
Patent #:
7994619
Issue Dt:
08/09/2011
Application #:
11555682
Filing Dt:
11/01/2006
Publication #:
US20080111222
Pub Dt:
05/15/2008
Title:
BRIDGE STACK INTEGRATED CIRCUIT PACKAGE SYSTEM
63
Patent #:
8008770
Issue Dt:
08/30/2011
Application #:
11556035
Filing Dt:
11/02/2006
Publication #:
US20070114639
Pub Dt:
05/24/2007
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BUMP PAD
64
Patent #:
7936053
Issue Dt:
05/03/2011
Application #:
11558387
Filing Dt:
11/09/2006
Publication #:
US20070114645
Pub Dt:
05/24/2007
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEAD STRUCTURES INCLUDING A DUMMY TIE BAR
65
Patent #:
7582957
Issue Dt:
09/01/2009
Application #:
11558404
Filing Dt:
11/09/2006
Publication #:
US20080111218
Pub Dt:
05/15/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ENCAPSULATION LOCK
66
Patent #:
7479692
Issue Dt:
01/20/2009
Application #:
11558413
Filing Dt:
11/09/2006
Publication #:
US20080111217
Pub Dt:
05/15/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH HEAT SINK
67
Patent #:
7928540
Issue Dt:
04/19/2011
Application #:
11558589
Filing Dt:
11/10/2006
Publication #:
US20080111215
Pub Dt:
05/15/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM
68
Patent #:
7352055
Issue Dt:
04/01/2008
Application #:
11562957
Filing Dt:
11/22/2006
Publication #:
US20070090537
Pub Dt:
04/26/2007
Title:
SEMICONDUCTOR PACKAGE WITH CONTROLLED SOLDER BUMP WETTING
69
Patent #:
8174119
Issue Dt:
05/08/2012
Application #:
11595638
Filing Dt:
11/10/2006
Publication #:
US20080111233
Pub Dt:
05/15/2008
Title:
SEMICONDUCTOR PACKAGE WITH EMBEDDED DIE
70
Patent #:
8115301
Issue Dt:
02/14/2012
Application #:
11601103
Filing Dt:
11/17/2006
Publication #:
US20080116586
Pub Dt:
05/22/2008
Title:
METHODS FOR MANUFACTURING THERMALLY ENHANCED FLIP-CHIP BALL GRID ARRAYS
71
Patent #:
7759783
Issue Dt:
07/20/2010
Application #:
11608123
Filing Dt:
12/07/2006
Publication #:
US20080137312
Pub Dt:
06/12/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING THIN PROFILE TECHNIQUES
72
Patent #:
7608921
Issue Dt:
10/27/2009
Application #:
11608164
Filing Dt:
12/07/2006
Publication #:
US20080136003
Pub Dt:
06/12/2008
Title:
MULTI-LAYER SEMICONDUCTOR PACKAGE
73
Patent #:
8304874
Issue Dt:
11/06/2012
Application #:
11608826
Filing Dt:
12/09/2006
Publication #:
US20080136005
Pub Dt:
06/12/2008
Title:
STACKABLE INTEGRATED CIRCUIT PACKAGE SYSTEM
74
Patent #:
7772683
Issue Dt:
08/10/2010
Application #:
11608827
Filing Dt:
12/09/2006
Publication #:
US20080136006
Pub Dt:
06/12/2008
Title:
STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
75
Patent #:
7635913
Issue Dt:
12/22/2009
Application #:
11608829
Filing Dt:
12/09/2006
Publication #:
US20080136007
Pub Dt:
06/12/2008
Title:
STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
76
Patent #:
7479409
Issue Dt:
01/20/2009
Application #:
11610304
Filing Dt:
12/13/2006
Publication #:
US20080142934
Pub Dt:
06/19/2008
Title:
INTEGRATED CIRCUIT PACKAGE WITH ELEVATED EDGE LEADFRAME
77
Patent #:
8422243
Issue Dt:
04/16/2013
Application #:
11610401
Filing Dt:
12/13/2006
Publication #:
US20080142938
Pub Dt:
06/19/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING A SUPPORT STRUCTURE WITH A RECESS
78
Patent #:
8252615
Issue Dt:
08/28/2012
Application #:
11615919
Filing Dt:
12/22/2006
Publication #:
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Pub Dt:
06/26/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING MOLD FLASH PREVENTION TECHNOLOGY
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Patent #:
7537962
Issue Dt:
05/26/2009
Application #:
11615922
Filing Dt:
12/22/2006
Publication #:
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Pub Dt:
06/26/2008
Title:
METHOD OF FABRICATING A SHIELDED STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM
80
Patent #:
8114771
Issue Dt:
02/14/2012
Application #:
11615923
Filing Dt:
12/22/2006
Publication #:
US20070164422
Pub Dt:
07/19/2007
Title:
SEMICONDUCTOR WAFER SCALE PACKAGE SYSTEM
81
Patent #:
8017502
Issue Dt:
09/13/2011
Application #:
11615929
Filing Dt:
12/22/2006
Publication #:
US20080153262
Pub Dt:
06/26/2008
Title:
WAFER SYSTEM WITH PARTIAL CUTS
82
Patent #:
8163600
Issue Dt:
04/24/2012
Application #:
11616878
Filing Dt:
12/28/2006
Publication #:
US20080157318
Pub Dt:
07/03/2008
Title:
BRIDGE STACK INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM
83
Patent #:
7687897
Issue Dt:
03/30/2010
Application #:
11617413
Filing Dt:
12/28/2006
Publication #:
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Pub Dt:
07/03/2008
Title:
MOUNTABLE INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH ADHESIVE SPACING STRUCTURES
84
Patent #:
8012867
Issue Dt:
09/06/2011
Application #:
11618647
Filing Dt:
12/29/2006
Publication #:
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Pub Dt:
08/02/2007
Title:
WAFER LEVEL CHIP SCALE PACKAGE SYSTEM
85
Patent #:
8089166
Issue Dt:
01/03/2012
Application #:
11618805
Filing Dt:
12/30/2006
Publication #:
US20080157401
Pub Dt:
07/03/2008
Title:
INTEGRATED CIRCUIT PACKAGE WITH TOP PAD
86
Patent #:
8178982
Issue Dt:
05/15/2012
Application #:
11618806
Filing Dt:
12/30/2006
Publication #:
US20080157402
Pub Dt:
07/03/2008
Title:
DUAL MOLDED MULTI-CHIP PACKAGE SYSTEM
87
Patent #:
8035207
Issue Dt:
10/11/2011
Application #:
11618807
Filing Dt:
12/30/2006
Publication #:
US20080157321
Pub Dt:
07/03/2008
Title:
STACKABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH RECESS
88
Patent #:
7550828
Issue Dt:
06/23/2009
Application #:
11619563
Filing Dt:
01/03/2007
Publication #:
US20080157301
Pub Dt:
07/03/2008
Title:
LEADFRAME PACKAGE FOR MEMS MICROPHONE ASSEMBLY
89
Patent #:
7612444
Issue Dt:
11/03/2009
Application #:
11620553
Filing Dt:
01/05/2007
Publication #:
US20080164618
Pub Dt:
07/10/2008
Title:
SEMICONDUCTOR PACKAGE WITH FLOW CONTROLLER
90
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8035205
Issue Dt:
10/11/2011
Application #:
11620561
Filing Dt:
01/05/2007
Publication #:
US20080164587
Pub Dt:
07/10/2008
Title:
MOLDING COMPOUND FLOW CONTROLLER
91
Patent #:
7351610
Issue Dt:
04/01/2008
Application #:
11622993
Filing Dt:
01/12/2007
Publication #:
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Pub Dt:
05/17/2007
Title:
METHOD OF FABRICATING A SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING A SECOND PACKAGE SUBSTRATE WITH AN EXPOSED METAL LAYER WIRE BONDED TO A FIRST PACKAGE SUBSTRATE
92
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7364946
Issue Dt:
04/29/2008
Application #:
11626272
Filing Dt:
01/23/2007
Publication #:
US20070117267
Pub Dt:
05/24/2007
Title:
METHOD OF FABRICATING A SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED LAND GRID ARRAY (LGA) PACKAGE STACKED OVER BALL GRID ARRAY (BGA) PACKAGE
93
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8037918
Issue Dt:
10/18/2011
Application #:
11633701
Filing Dt:
12/04/2006
Publication #:
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Pub Dt:
06/05/2008
Title:
PICK-UP HEADS AND SYSTEMS FOR DIE BONDING AND RELATED APPLICATIONS
94
Patent #:
7683467
Issue Dt:
03/23/2010
Application #:
11635941
Filing Dt:
12/07/2006
Publication #:
US20080135989
Pub Dt:
06/12/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING STRUCTURAL SUPPORT
95
Patent #:
7659633
Issue Dt:
02/09/2010
Application #:
11640534
Filing Dt:
12/14/2006
Publication #:
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Pub Dt:
10/18/2007
Title:
SOLDER JOINT FLIP CHIP INTERCONNECTION HAVING RELIEF STRUCTURE
96
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8198735
Issue Dt:
06/12/2012
Application #:
11670714
Filing Dt:
02/02/2007
Publication #:
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Pub Dt:
07/03/2008
Title:
INTEGRATED CIRCUIT PACKAGE WITH MOLDED CAVITY
97
Patent #:
7777310
Issue Dt:
08/17/2010
Application #:
11670862
Filing Dt:
02/02/2007
Publication #:
US20080185693
Pub Dt:
08/07/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTEGRAL INNER LEAD AND PADDLE
98
Patent #:
8207597
Issue Dt:
06/26/2012
Application #:
11670899
Filing Dt:
02/02/2007
Publication #:
US20080012100
Pub Dt:
01/17/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLASHLESS LEADS
99
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7518226
Issue Dt:
04/14/2009
Application #:
11671684
Filing Dt:
02/06/2007
Publication #:
US20080185719
Pub Dt:
08/07/2008
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER
100
Patent #:
7723225
Issue Dt:
05/25/2010
Application #:
11671900
Filing Dt:
02/06/2007
Publication #:
US20070184578
Pub Dt:
08/09/2007
Title:
SOLDER BUMP CONFINEMENT SYSTEM FOR AN INTEGRATED CIRCUIT PACKAGE
Assignors
1
STATS CHIPPAC, INC.
Exec Dt:
08/06/2015
2
STATS CHIPPAC LTD.
Exec Dt:
08/06/2015
Assignee
1
CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
39TH FLOOR, CITIBANK TOWER, CITIBANK PLAZA, 3 GARDEN ROAD
ATTENTION: AGENCY AND TRUST
CENTRAL, HONG KONG
Correspondence name and address
LAWRENCE KASS
28 LIBERTY STREET
C/O LAWRENCE KASS
NEW YORK, NY 10005

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