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Patent #:
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|
Issue Dt:
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07/06/2010
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Application #:
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11672164
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Filing Dt:
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02/07/2007
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|
Publication #:
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Pub Dt:
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08/07/2008
| | | | |
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Title:
|
MULTI-CHIP PACKAGE SYSTEM WITH MULTIPLE SUBSTRATES
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11672910
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Filing Dt:
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02/08/2007
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Publication #:
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Pub Dt:
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08/14/2008
| | | | |
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Title:
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SEMICONDUCTOR PACKAGE WIRE BONDING
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Patent #:
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Issue Dt:
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11/26/2013
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Application #:
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11673558
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Filing Dt:
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02/09/2007
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Publication #:
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Pub Dt:
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08/14/2008
| | | | |
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BUMP OVER VIA
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Patent #:
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Issue Dt:
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04/29/2014
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Application #:
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11677477
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Filing Dt:
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02/21/2007
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Publication #:
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Pub Dt:
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08/23/2007
| | | | |
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BONDING LANDS
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Patent #:
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Issue Dt:
|
06/25/2013
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Application #:
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11677487
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Filing Dt:
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02/21/2007
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Publication #:
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Pub Dt:
|
08/23/2007
| | | | |
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH L-SHAPED LEADFINGERS
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Patent #:
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Issue Dt:
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12/29/2009
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Application #:
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11684265
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Filing Dt:
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03/09/2007
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|
Publication #:
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Pub Dt:
|
07/05/2007
| | | | |
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Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
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Patent #:
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Issue Dt:
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10/14/2008
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Application #:
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11686010
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Filing Dt:
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03/14/2007
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Publication #:
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Pub Dt:
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07/05/2007
| | | | |
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Title:
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MULTICHIP LEADFRAME PACKAGE
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Patent #:
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Issue Dt:
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12/17/2013
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Application #:
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11687357
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Filing Dt:
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03/16/2007
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Publication #:
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Pub Dt:
|
09/18/2008
| | | | |
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING MULTI-PACKAGE MODULE TECHNIQUES
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Patent #:
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Issue Dt:
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09/04/2012
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Application #:
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11689229
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Filing Dt:
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03/21/2007
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Publication #:
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Pub Dt:
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09/25/2008
| | | | |
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEAD SUPPORT
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Patent #:
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Issue Dt:
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03/23/2010
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Application #:
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11689282
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Filing Dt:
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03/21/2007
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Publication #:
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Pub Dt:
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09/25/2008
| | | | |
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Title:
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METHOD OF FORMING SOLDER BUMP ON HIGH TOPOGRAPHY PLATED CU
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Patent #:
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Issue Dt:
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01/20/2015
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Application #:
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11689317
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Filing Dt:
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03/21/2007
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Publication #:
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Pub Dt:
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09/25/2008
| | | | |
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOLDED STRIP PROTRUSION
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Patent #:
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Issue Dt:
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06/01/2010
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Application #:
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11689319
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Filing Dt:
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03/21/2007
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Publication #:
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Pub Dt:
|
09/25/2008
| | | | |
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Title:
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METHOD OF FORMING TOP ELECTRODE FOR CAPACITOR AND INTERCONNECTION IN INTEGRATED PASSIVE DEVICE (IPD)
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Patent #:
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Issue Dt:
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04/14/2009
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Application #:
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11689645
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Filing Dt:
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03/22/2007
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Publication #:
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Pub Dt:
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09/25/2008
| | | | |
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Title:
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LEADFRAME DESIGN FOR QFN PACKAGE WITH TOP TERMINAL LEADS
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Patent #:
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Issue Dt:
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09/30/2008
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Application #:
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11690703
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Filing Dt:
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03/23/2007
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Publication #:
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Pub Dt:
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07/12/2007
| | | | |
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Title:
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INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
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Patent #:
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Issue Dt:
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09/27/2011
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Application #:
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11694907
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Filing Dt:
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03/30/2007
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Publication #:
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Pub Dt:
|
10/02/2008
| | | | |
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PROTECTED CONDUCTIVE LAYERS FOR PADS AND METHOD OF MANUFACTURING THEREOF
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Patent #:
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Issue Dt:
|
04/07/2015
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Application #:
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11694912
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Filing Dt:
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03/30/2007
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Publication #:
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Pub Dt:
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10/02/2008
| | | | |
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BONDING IN VIA
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Patent #:
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Issue Dt:
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06/26/2012
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Application #:
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11694921
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Filing Dt:
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03/30/2007
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Publication #:
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Pub Dt:
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10/02/2008
| | | | |
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ENCAPSULATING FEATURES
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Patent #:
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Issue Dt:
|
03/13/2012
|
Application #:
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11694927
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Filing Dt:
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03/30/2007
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Publication #:
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Pub Dt:
|
10/02/2008
| | | | |
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Title:
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STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONDUCTIVE SPACER
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Patent #:
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Issue Dt:
|
02/09/2010
|
Application #:
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11694933
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Filing Dt:
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03/30/2007
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Publication #:
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Pub Dt:
|
10/02/2008
| | | | |
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Title:
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INTEGRATED CIRCUIT SYSTEM WITH A DEBRIS TRAPPING SYSTEM
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Patent #:
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Issue Dt:
|
10/04/2011
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Application #:
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11697433
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Filing Dt:
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04/06/2007
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Publication #:
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Pub Dt:
|
08/02/2007
| | | | |
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Title:
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PLASTIC BALL GRID ARRAY PACKAGE WITH INTEGRAL HEATSINK
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Patent #:
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Issue Dt:
|
08/19/2008
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Application #:
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11697779
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Filing Dt:
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04/09/2007
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Publication #:
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Pub Dt:
|
08/16/2007
| | | | |
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Title:
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INTEGRATED CIRCUIT PACKAGE WITH LEADFRAME LOCKED ENCAPSULATION AND METHOD OF MANUFACTURE THEREFOR
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Patent #:
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Issue Dt:
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03/30/2010
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Application #:
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11734410
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Filing Dt:
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04/12/2007
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Publication #:
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Pub Dt:
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10/16/2008
| | | | |
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Title:
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COMPACT COILS FOR HIGH PERFORMANCE FILTERS
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Patent #:
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Issue Dt:
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07/26/2011
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Application #:
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11735397
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Filing Dt:
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04/13/2007
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Publication #:
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Pub Dt:
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11/15/2007
| | | | |
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONTOURED ENCAPSULATION
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Patent #:
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Issue Dt:
|
01/20/2015
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Application #:
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11744062
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Filing Dt:
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05/03/2007
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Publication #:
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Pub Dt:
|
11/06/2008
| | | | |
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DEVICE CAVITY
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Patent #:
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Issue Dt:
|
06/08/2010
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Application #:
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11744182
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Filing Dt:
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05/03/2007
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Publication #:
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Pub Dt:
|
02/14/2008
| | | | |
|
Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING PACKAGE STACKED OVER DIE-UP FLIP CHIP BALL GRID ARRAY PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
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Patent #:
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Issue Dt:
|
08/04/2009
|
Application #:
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11744657
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Filing Dt:
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05/04/2007
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Publication #:
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Pub Dt:
|
11/06/2008
| | | | |
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Title:
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THROUGH-HOLE VIA ON SAW STREETS
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Patent #:
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Issue Dt:
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07/12/2011
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Application #:
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11744697
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Filing Dt:
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05/04/2007
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Publication #:
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Pub Dt:
|
11/06/2008
| | | | |
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERFERENCE-FIT FEATURE
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Patent #:
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Issue Dt:
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03/30/2010
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Application #:
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11744743
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Filing Dt:
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05/04/2007
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Publication #:
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Pub Dt:
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11/06/2008
| | | | |
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Title:
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EXTENDED REDISTRIBUTION LAYERS BUMPED WAFER
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Patent #:
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Issue Dt:
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11/23/2010
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Application #:
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11745045
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Filing Dt:
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05/07/2007
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Publication #:
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Pub Dt:
|
11/13/2008
| | | | |
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Title:
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ULTRA THIN BUMPED WAFER WITH UNDER-FILM
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Patent #:
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Issue Dt:
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10/18/2011
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Application #:
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11749693
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Filing Dt:
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05/16/2007
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Publication #:
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Pub Dt:
|
11/22/2007
| | | | |
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DIFFERENT MOLD LOCKING FEATURES
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Patent #:
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NONE
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Issue Dt:
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|
Application #:
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11749712
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Filing Dt:
|
05/16/2007
|
|
Publication #:
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|
Pub Dt:
|
11/20/2008
| | | | |
|
Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PERIMETER PADDLE
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|
Patent #:
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Issue Dt:
|
10/07/2014
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Application #:
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11749717
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Filing Dt:
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05/16/2007
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Publication #:
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|
Pub Dt:
|
11/20/2008
| | | | |
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING RESILIENT MEMBER MOLD SYSTEM TECHNOLOGY
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Patent #:
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Issue Dt:
|
02/14/2012
|
Application #:
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11750218
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Filing Dt:
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05/17/2007
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|
Publication #:
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|
Pub Dt:
|
11/20/2008
| | | | |
|
Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH THIN PROFILE
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|
Patent #:
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|
Issue Dt:
|
05/15/2012
|
Application #:
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11750715
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Filing Dt:
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05/18/2007
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Publication #:
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|
Pub Dt:
|
11/20/2008
| | | | |
|
Title:
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ELECTRONIC SYSTEM WITH EXPANSION FEATURE
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|
Patent #:
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|
Issue Dt:
|
11/10/2009
|
Application #:
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11751440
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Filing Dt:
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05/21/2007
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|
Publication #:
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Pub Dt:
|
11/27/2008
| | | | |
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Title:
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STANDOFF HEIGHT IMPROVEMENT FOR BUMPING TECHNOLOGY USING SOLDER RESIST
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Patent #:
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Issue Dt:
|
01/31/2012
|
Application #:
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11757869
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Filing Dt:
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06/04/2007
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|
Publication #:
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|
Pub Dt:
|
12/04/2008
| | | | |
|
Title:
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SEMICONDUCTOR PACKAGING SYSTEM WITH STACKING AND METHOD OF MANUFACTURE THEREOF
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|
Patent #:
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|
Issue Dt:
|
04/29/2014
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Application #:
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11758635
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Filing Dt:
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06/05/2007
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Publication #:
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Pub Dt:
|
12/11/2008
| | | | |
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Title:
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ELECTRONIC SYSTEM WITH VERTICAL INTERMETALLIC COMPOUND
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|
Patent #:
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Issue Dt:
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05/25/2010
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Application #:
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11759227
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Filing Dt:
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06/07/2007
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|
Publication #:
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|
Pub Dt:
|
12/11/2008
| | | | |
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONTOURED DIE
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Patent #:
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Issue Dt:
|
12/08/2009
|
Application #:
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11760207
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Filing Dt:
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06/08/2007
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Publication #:
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Pub Dt:
|
12/11/2008
| | | | |
|
Title:
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MINIATURIZED WIDE-BAND BALUNS FOR RF APPLICATIONS
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Patent #:
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|
Issue Dt:
|
08/31/2010
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Application #:
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11760690
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Filing Dt:
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06/08/2007
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Publication #:
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Pub Dt:
|
10/04/2007
| | | | |
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Title:
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INTEGRATED CIRCUIT DIE WITH PEDESTAL
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|
Patent #:
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|
Issue Dt:
|
11/24/2009
|
Application #:
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11760712
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Filing Dt:
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06/08/2007
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|
Publication #:
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|
Pub Dt:
|
10/04/2007
| | | | |
|
Title:
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STACKED SEMICONDUCTOR PACKAGES AND METHOD THEREFOR
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|
Patent #:
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|
Issue Dt:
|
02/25/2014
|
Application #:
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11762055
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Filing Dt:
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06/12/2007
|
|
Publication #:
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|
Pub Dt:
|
12/27/2007
| | | | |
|
Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OFFSET STACK
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|
Patent #:
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|
Issue Dt:
|
06/30/2009
|
Application #:
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11765930
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Filing Dt:
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06/20/2007
|
|
Publication #:
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|
Pub Dt:
|
12/25/2008
| | | | |
|
Title:
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METHOD OF MAKING A WAFER LEVEL INTEGRATION PACKAGE
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|
Patent #:
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|
Issue Dt:
|
08/19/2008
|
Application #:
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11766095
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Filing Dt:
|
06/20/2007
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|
Publication #:
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|
Pub Dt:
|
10/18/2007
| | | | |
|
Title:
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ETCHED LEADFRAME FLIPCHIP PACKAGE SYSTEM
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|
Patent #:
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|
Issue Dt:
|
06/01/2010
|
Application #:
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11766710
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Filing Dt:
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06/21/2007
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|
Publication #:
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Pub Dt:
|
12/25/2008
| | | | |
|
Title:
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GROOVING BUMPED WAFER PRE-UNDERFILL SYSTEM
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|
Patent #:
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|
Issue Dt:
|
02/04/2014
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Application #:
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11766771
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Filing Dt:
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06/21/2007
|
|
Publication #:
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|
Pub Dt:
|
12/25/2008
| | | | |
|
Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM HAVING PERIMETER PADDLE
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Patent #:
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|
Issue Dt:
|
11/22/2011
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Application #:
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11766785
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Filing Dt:
|
06/21/2007
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|
Publication #:
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|
Pub Dt:
|
01/10/2008
| | | | |
|
Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH GROUND BONDS
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|
Patent #:
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|
Issue Dt:
|
11/09/2010
|
Application #:
|
11766787
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Filing Dt:
|
06/21/2007
|
|
Publication #:
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|
Pub Dt:
|
12/25/2008
| | | | |
|
Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING
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|
Patent #:
|
NONE
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Issue Dt:
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|
Application #:
|
11767820
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Filing Dt:
|
06/25/2007
|
|
Publication #:
|
|
Pub Dt:
|
12/25/2008
| | | | |
|
Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CAVITY SUBSTRATE
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|
Patent #:
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|
Issue Dt:
|
02/08/2011
|
Application #:
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11768640
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Filing Dt:
|
06/26/2007
|
|
Publication #:
|
|
Pub Dt:
|
01/01/2009
| | | | |
|
Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION
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|
Patent #:
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|
Issue Dt:
|
07/27/2010
|
Application #:
|
11768730
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Filing Dt:
|
06/26/2007
|
|
Publication #:
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|
Pub Dt:
|
01/01/2009
| | | | |
|
Title:
|
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH TOP AND BOTTOM TERMINALS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/17/2015
|
Application #:
|
11768790
|
Filing Dt:
|
06/26/2007
|
|
Publication #:
|
|
Pub Dt:
|
01/01/2009
| | | | |
|
Title:
|
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OVERHANG DIE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/21/2013
|
Application #:
|
11768825
|
Filing Dt:
|
06/26/2007
|
|
Publication #:
|
|
Pub Dt:
|
11/06/2008
| | | | |
|
Title:
|
PACKAGE-IN-PACKAGE USING THROUGH-HOLE VIA DIE ON SAW STREETS
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|
|
|
|
Patent #:
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|
Issue Dt:
|
05/25/2010
|
Application #:
|
11768844
|
Filing Dt:
|
06/26/2007
|
|
Publication #:
|
|
Pub Dt:
|
11/06/2008
| | | | |
|
Title:
|
PACKAGE-ON-PACKAGE USING THROUGH-HOLE VIA DIE ON SAW STREETS
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|
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|
|
Patent #:
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|
Issue Dt:
|
07/06/2010
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11768869
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Filing Dt:
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06/26/2007
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Pub Dt:
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11/06/2008
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Title:
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SAME SIZE DIE STACKED PACKAGE HAVING THROUGH-HOLE VIAS FORMED IN ORGANIC MATERIAL
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03/12/2013
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11769296
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06/27/2007
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01/01/2009
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Title:
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CIRCUIT SYSTEM WITH CIRCUIT ELEMENT AND REFERENCE PLANE
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01/04/2011
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11769512
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06/27/2007
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Pub Dt:
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01/01/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OVERHANGING CONNECTION STACK
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07/23/2013
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11769520
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06/27/2007
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01/01/2009
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Title:
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PACKAGING SYSTEM WITH HOLLOW PACKAGE AND METHOD FOR THE SAME
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06/19/2012
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11769691
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06/27/2007
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Pub Dt:
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01/01/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE IN PACKAGE SYSTEM WITH ADHESIVELESS PACKAGE ATTACH
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01/04/2011
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11770690
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06/28/2007
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01/01/2009
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Title:
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CIRCUIT SYSTEM WITH CIRCUIT ELEMENT
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Issue Dt:
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09/21/2010
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11771086
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06/29/2007
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Pub Dt:
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01/01/2009
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Title:
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STACKABLE PACKAGE BY USING INTERNAL STACKING MODULES
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09/13/2011
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11772044
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06/29/2007
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Pub Dt:
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01/01/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SIDE SUBSTRATE HAVING A TOP LAYER
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04/06/2010
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11772776
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07/02/2007
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Publication #:
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Pub Dt:
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12/06/2007
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Title:
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SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING DIE AND INVERTED LAND GRID ARRAY PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE
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04/06/2010
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11772776
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Filing Dt:
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07/02/2007
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Publication #:
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Pub Dt:
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12/06/2007
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Title:
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SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING DIE AND INVERTED LAND GRID ARRAY PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE
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01/28/2014
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11773886
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07/05/2007
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Pub Dt:
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01/08/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLEX BUMP
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09/25/2012
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11773951
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07/05/2007
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Pub Dt:
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01/08/2009
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Title:
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SEMICONDUCTOR PACKAGE SYSTEM WITH PATTERNED MASK OVER THERMAL RELIEF
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01/04/2011
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11833646
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08/03/2007
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Pub Dt:
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02/07/2008
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOLDING VENTS
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04/20/2010
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11833882
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08/03/2007
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Pub Dt:
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02/05/2009
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM FOR FINE PITCH SUBSTRATES
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04/05/2011
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11833898
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08/03/2007
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Pub Dt:
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02/05/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DEVICES
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01/11/2011
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11839020
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08/15/2007
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Pub Dt:
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11/29/2007
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Title:
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WIRE BONDING STRUCTURE AND METHOD THAT ELIMINATES SPECIAL WIRE BONDABLE FINISH AND REDUCES BONDING PITCH ON SUBSTRATES
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05/29/2012
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11843649
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08/23/2007
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Pub Dt:
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12/13/2007
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH POST-PASSIVATION INTERCONNECTION AND INTEGRATION
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Issue Dt:
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03/09/2010
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11844354
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08/24/2007
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Pub Dt:
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12/13/2007
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Title:
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STACKED DIE PACKAGE SYSTEM
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Patent #:
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Issue Dt:
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10/12/2010
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11849087
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08/31/2007
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Pub Dt:
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03/05/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH SIDE-BY-SIDE AND OFFSET STACKING
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03/27/2012
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11849112
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Filing Dt:
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08/31/2007
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Pub Dt:
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12/20/2007
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Title:
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METHOD OF FABRICATING A SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
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02/09/2010
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11849127
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Filing Dt:
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08/31/2007
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Pub Dt:
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03/05/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH CARRIER INTERPOSER
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05/01/2012
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11849263
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08/31/2007
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Pub Dt:
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12/20/2007
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Title:
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NESTED INTEGRATED CIRCUIT PACKAGE ON PACKAGE SYSTEM
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07/28/2009
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11850197
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Filing Dt:
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09/05/2007
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Pub Dt:
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03/05/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH ANTI-MOLD FLASH FEATURE
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Issue Dt:
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02/22/2011
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11852771
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Filing Dt:
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09/10/2007
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Pub Dt:
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03/12/2009
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Title:
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METHOD FOR DIRECTIONAL GRINDING ON BACKSIDE OF A SEMICONDUCTOR WAFER
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01/11/2011
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11854934
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Filing Dt:
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09/13/2007
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Pub Dt:
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03/19/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH LEADS
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10/02/2012
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11854989
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09/13/2007
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Pub Dt:
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03/19/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADS SEPARATED FROM A DIE PADDLE
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03/06/2012
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11855114
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09/13/2007
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Pub Dt:
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03/19/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE ENCAPSULATION HAVING RECESS
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04/16/2013
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11856841
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09/18/2007
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Pub Dt:
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03/19/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH EXTERNAL INTERCONNECTS AT HIGH DENSITY
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04/20/2010
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11856879
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09/18/2007
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Pub Dt:
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03/27/2008
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM FOR CHIP ON LEAD
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Issue Dt:
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05/03/2016
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11857188
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09/18/2007
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Pub Dt:
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03/19/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTI-CHIP MODULE
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08/30/2011
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11857206
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09/18/2007
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Pub Dt:
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03/19/2009
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DELAMINATION PREVENTION STRUCTURE
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02/21/2012
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11857402
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09/18/2007
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03/19/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL CONNECTIVITY
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02/22/2011
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11858554
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09/20/2007
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Pub Dt:
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03/26/2009
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Title:
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METHOD OF MANUFACTURING INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WARP-FREE CHIP
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07/20/2010
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11858588
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09/20/2007
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Pub Dt:
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03/26/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DEVICE UNITS
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02/23/2010
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11858749
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09/20/2007
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Pub Dt:
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03/26/2009
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Title:
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SEMICONDUCTOR PACKAGE WITH PASSIVATION ISLAND FOR REDUCING STRESS ON SOLDER BUMPS
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07/13/2010
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11858861
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09/20/2007
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Pub Dt:
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01/10/2008
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Title:
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INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
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Issue Dt:
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02/28/2012
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11859359
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09/21/2007
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Pub Dt:
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03/26/2009
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER
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Issue Dt:
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10/18/2011
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11859416
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09/21/2007
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Pub Dt:
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03/26/2009
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Title:
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SOLDER BUMP WITH INNER CORE PILLAR IN SEMICONDUCTOR PACKAGE
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Issue Dt:
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03/16/2010
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11859462
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09/21/2007
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Pub Dt:
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03/26/2009
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PASSIVE COMPONENTS
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Issue Dt:
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04/20/2010
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11860377
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09/24/2007
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Pub Dt:
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03/26/2009
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD OF REDUCING ELECTROMAGNETIC INTERFERENCE BETWEEN DEVICES
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Issue Dt:
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03/20/2012
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11860460
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Filing Dt:
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09/24/2007
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Pub Dt:
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03/27/2008
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKED DIE
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Issue Dt:
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09/08/2009
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Application #:
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11861233
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Filing Dt:
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09/25/2007
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Publication #:
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Pub Dt:
|
11/06/2008
| | | | |
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Title:
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SEMICONDUCTOR PACKAGE HAVING THROUGH-HOLE VIA ON SAW STREETS FORMED WITH PARTIAL SAW
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Patent #:
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Issue Dt:
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11/09/2010
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11861244
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Filing Dt:
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09/25/2007
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Publication #:
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Pub Dt:
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11/06/2008
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Title:
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SEMICONDUCTOR WAFER HAVING THROUGH-HOLE VIAS ON SAW STREETS WITH BACKSIDE REDISTRIBUTION LAYER
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Issue Dt:
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03/08/2011
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11861251
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Filing Dt:
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09/25/2007
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Publication #:
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Pub Dt:
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11/06/2008
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Title:
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SEMICONDUCTOR DIE WITH THROUGH-HOLE VIA ON SAW STREETS AND THROUGH-HOLE VIA IN ACTIVE AREA OF DIE
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Issue Dt:
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08/02/2011
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11861926
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09/26/2007
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Publication #:
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Pub Dt:
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03/26/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH UNDER PADDLE LEADFINGERS
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Patent #:
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Issue Dt:
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03/29/2011
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Application #:
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11862406
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09/27/2007
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Publication #:
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Pub Dt:
|
04/02/2009
| | | | |
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFRAME ARRAY
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