Patent Assignment Details
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| Reel/Frame: | 054573/0748 | |
| Pages: | 13 |
| | Recorded: | 12/08/2020 | | |
| Attorney Dkt #: | 1884.934US1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/13/2024
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Application #:
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16832851
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Filing Dt:
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03/27/2020
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Publication #:
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Pub Dt:
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09/30/2021
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Title:
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EMBEDDED DIE ARCHITECTURE AND METHOD OF MAKING
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Assignee
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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SCHWEGMAN, LUNDBERG & WOESSNER/INTEL
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PO BOX 2938
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MINNEAPOLIS, MN 55402
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05/23/2024 10:46 PM
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