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Patent #:
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Issue Dt:
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10/04/2016
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Application #:
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11691332
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Filing Dt:
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03/26/2007
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Publication #:
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Pub Dt:
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10/02/2008
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Title:
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SEMICONDUCTOR DEVICE HAVING STRUCTURE WITH FRACTIONAL DIMENSION OF THE MINIMUM DIMENSION OF A LITHOGRAPHY SYSTEM
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Patent #:
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Issue Dt:
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05/02/2017
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Application #:
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11781664
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Filing Dt:
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07/23/2007
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Publication #:
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Pub Dt:
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01/29/2009
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Title:
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INTEGRATED CIRCUIT EMPLOYING VARIABLE THICKNESS FILM
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Patent #:
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Issue Dt:
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12/22/2015
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Application #:
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12039980
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Filing Dt:
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02/29/2008
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Publication #:
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Pub Dt:
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02/05/2009
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Title:
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TWO-DIMENSIONAL TRANSFER STATION USED AS INTERFACE BETWEEN A PROCESS TOOL AND A TRANSPORT SYSTEM AND A METHOD OF OPERATING THE SAME
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Patent #:
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Issue Dt:
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07/19/2016
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Application #:
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12551960
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Filing Dt:
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09/01/2009
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Publication #:
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Pub Dt:
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03/03/2011
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Title:
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METHOD OF JOINING A CHIP ON A SUBSTRATE
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Patent #:
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Issue Dt:
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05/03/2016
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Application #:
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12760688
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Filing Dt:
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04/15/2010
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Publication #:
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Pub Dt:
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10/20/2011
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Title:
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METHOD FOR IMPROVING DEVICE PERFORMANCE USING EPITAXIALLY GROWN SILICON CARBON (SiC) OR SILICON-GERMANIUM (SiGe)
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Patent #:
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Issue Dt:
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10/04/2016
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Application #:
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12789792
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Filing Dt:
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05/28/2010
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Publication #:
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Pub Dt:
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12/01/2011
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Title:
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DEVICE AND METHOD FOR FABRICATING THIN SEMICONDUCTOR CHANNEL AND BURIED STRAIN MEMORIZATION LAYER
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Patent #:
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Issue Dt:
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09/20/2016
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Application #:
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12846020
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Filing Dt:
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07/29/2010
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Publication #:
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Pub Dt:
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02/02/2012
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Title:
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METHOD OF FORMING SEMICONDUCTOR STRUCTURES WITH CONTACT HOLES
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Patent #:
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01/12/2016
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Application #:
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12878787
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Filing Dt:
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09/09/2010
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Pub Dt:
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03/15/2012
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Title:
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Zinc Thin Films Plating Chemistry and Methods
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Patent #:
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Issue Dt:
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08/02/2016
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Application #:
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13005883
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Filing Dt:
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01/13/2011
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Publication #:
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Pub Dt:
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07/19/2012
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Title:
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INTEGRATED CIRCUIT AND DESIGN STRUCTURE HAVING REDUCED THROUGH SILICON VIA-INDUCED STRESS
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Patent #:
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Issue Dt:
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02/23/2016
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Application #:
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13108138
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Filing Dt:
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05/16/2011
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Publication #:
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Pub Dt:
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11/22/2012
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Title:
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SELF-ALIGNED METAL GATE CMOS WITH METAL BASE LAYER AND DUMMY GATE STRUCTURE
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Patent #:
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Issue Dt:
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03/08/2016
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13189997
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Filing Dt:
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07/25/2011
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Publication #:
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Pub Dt:
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06/21/2012
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Title:
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ENHANCED PATTERNING UNIFORMITY OF GATE ELECTRODES OF A SEMICONDUCTOR DEVICE BY LATE GATE DOPING
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Patent #:
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Issue Dt:
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04/19/2016
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Application #:
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13253210
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Filing Dt:
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10/05/2011
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Pub Dt:
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04/11/2013
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Title:
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Enhancing Transistor Performance by Reducing Exposure to Oxygen Plasma in a Dual Stress Liner Approach
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Patent #:
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Issue Dt:
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04/11/2017
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13348894
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01/12/2012
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Publication #:
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Pub Dt:
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07/18/2013
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Title:
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BORDERLESS CONTACT STRUCTURE
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Patent #:
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Issue Dt:
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01/17/2017
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Application #:
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13369856
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Filing Dt:
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02/09/2012
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Publication #:
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Pub Dt:
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08/15/2013
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Title:
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EPITAXIAL CHANNEL FORMATION METHODS AND STRUCTURES
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Patent #:
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Issue Dt:
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07/19/2016
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13414875
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Filing Dt:
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03/08/2012
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Publication #:
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Pub Dt:
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09/12/2013
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Title:
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MOISTURE AND/OR ELECTRICALLY CONDUCTIVE REMAINS DETECTION FOR WAFERS AFTER RINSE / DRY PROCESS
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Patent #:
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01/12/2016
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13433659
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03/29/2012
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Publication #:
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Pub Dt:
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07/19/2012
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Title:
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HIGH-K/METAL GATE STACK USING CAPPING LAYER METHODS, IC AND RELATED TRANSISTORS
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Patent #:
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Issue Dt:
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12/29/2015
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Application #:
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13440546
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Filing Dt:
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04/05/2012
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Publication #:
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Pub Dt:
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10/10/2013
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Title:
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DEVICE AND METHOD FOR FORMING SHARP EXTENSION REGION WITH CONTROLLABLE JUNCTION DEPTH AND LATERAL OVERLAP
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Patent #:
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Issue Dt:
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11/17/2015
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Application #:
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13446350
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Filing Dt:
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04/13/2012
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Publication #:
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Pub Dt:
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10/17/2013
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Title:
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SEMICONDUCTOR STRUCTURE HAVING A SOURCE AND A DRAIN WITH REVERSE FACETS
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Patent #:
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Issue Dt:
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08/30/2016
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Application #:
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13602496
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Filing Dt:
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09/04/2012
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Publication #:
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Pub Dt:
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12/27/2012
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Title:
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INTERCONNECT STRUCTURE INCLUDING A MODIFIED PHOTORESIST AS A PERMANENT INTERCONNECT DIELECTRIC AND METHOD OF FABRICATING SAME
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Patent #:
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Issue Dt:
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09/06/2016
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Application #:
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13604739
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Filing Dt:
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09/06/2012
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Publication #:
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Pub Dt:
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12/27/2012
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Title:
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Deposition On A Nanowire Using Atomic Layer Deposition
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Patent #:
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Issue Dt:
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03/15/2016
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Application #:
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13606873
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Filing Dt:
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09/07/2012
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Publication #:
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Pub Dt:
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02/07/2013
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Title:
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FINFET FIELD-EFFECT TRANSISTORS WITH ATOMIC LAYER DOPING
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Patent #:
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Issue Dt:
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03/28/2017
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13610262
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Filing Dt:
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09/11/2012
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Publication #:
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Pub Dt:
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03/13/2014
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Title:
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EXTRUSION-RESISTANT SOLDER INTERCONNECT STRUCTURES AND METHODS OF FORMING
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Patent #:
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Issue Dt:
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03/01/2016
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13612812
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09/12/2012
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03/13/2014
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Title:
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DIRECT INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON WAFERS
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01/26/2016
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13614492
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09/13/2012
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Pub Dt:
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01/03/2013
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Title:
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FORMATION OF ALLOY LINER BY REACTION OF DIFFUSION BARRIER AND SEED LAYER FOR INTERCONNECT APPLICATION
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Patent #:
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Issue Dt:
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11/03/2015
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13615770
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09/14/2012
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Pub Dt:
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01/10/2013
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Title:
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SELECTIVE ETCHING BATH METHODS
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Patent #:
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11/24/2015
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13616394
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09/14/2012
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01/03/2013
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Title:
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SELF-ALIGNED PERMANENT ON-CHIP INTERCONNECT STRUCTURES
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03/01/2016
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13650591
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10/12/2012
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04/17/2014
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Title:
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HYBRID ORIENTATION FIN FIELD EFFECT TRANSISTOR AND PLANAR FIELD EFFECT TRANSISTOR
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08/09/2016
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13658856
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10/24/2012
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04/24/2014
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Title:
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WAFER BONDING FOR 3D DEVICE PACKAGING FABRICATION
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01/19/2016
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13659292
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10/24/2012
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04/24/2014
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Title:
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BULK FINFET WELL CONTACTS WITH FIN PATTERN UNIFORMITY
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11/17/2015
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13682331
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11/20/2012
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05/22/2014
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INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS WITH REDUCED PARASITIC CAPACITANCE
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03/29/2016
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13707003
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12/06/2012
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06/12/2014
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PATTERNING TRANSITION METALS IN INTEGRATED CIRCUITS
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01/31/2017
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13729180
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12/28/2012
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07/03/2014
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03/15/2016
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13732482
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01/02/2013
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07/03/2014
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04/12/2016
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13732825
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01/02/2013
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07/03/2014
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03/29/2016
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13734524
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01/04/2013
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06/12/2014
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PATTERNING TRANSITION METALS IN INTEGRATED CIRCUITS
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05/10/2016
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13744756
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01/18/2013
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07/24/2014
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METAL LINES HAVING ETCH-BIAS INDEPENDENT HEIGHT
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01/12/2016
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13749330
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01/24/2013
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10/24/2013
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LASER-INITIATED EXFOLIATION OF GROUP III-NITRIDE FILMS AND APPLICATIONS FOR LAYER TRANSFER AND PATTERNING
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08/09/2016
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13749830
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01/25/2013
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07/31/2014
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SEMICONDUCTOR DEVICE INCLUDING SUBSTRATE CONTACT AND RELATED METHOD
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05/24/2016
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13770464
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02/19/2013
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08/21/2014
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INTEGRATED CIRCUITS AND METHODS OF FORMING THE SAME WITH MULTI-LEVEL ELECTRICAL CONNECTION
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05/31/2016
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02/19/2013
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06/20/2013
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MOSFETs WITH REDUCED CONTACT RESISTANCE
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05/03/2016
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13773014
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02/21/2013
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08/29/2013
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Title:
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CMOS STRUCTURE ON REPLACEMENT SUBSTRATE
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03/22/2016
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13780003
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02/28/2013
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07/11/2013
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REPLACEMENT METAL GATE STRUCTURES FOR EFFECTIVE WORK FUNCTION CONTROL
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12/15/2015
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13788689
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03/07/2013
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11/28/2013
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STRUCTURE AND METHOD TO MODULATE THRESHOLD VOLTAGE FOR HIGH-K METAL GATE FIELD EFFECT TRANSISTORS (FETs)
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11/24/2015
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13798643
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03/13/2013
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08/08/2013
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USE OF CONTACTS TO CREATE DIFFERENTIAL STRESSES ON DEVICES
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03/15/2016
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13798764
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03/13/2013
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09/18/2014
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METHODS OF FORMING A PROTECTION LAYER TO PROTECT A METAL HARD MASK LAYER DURING LITHOGRAPHY REWORKING PROCESSES
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02/02/2016
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13833932
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03/15/2013
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09/18/2014
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METHODS AND SYSTEMS FOR FABRICATING INTEGRATED CIRCUITS UTILIZING UNIVERSAL AND LOCAL PROCESSING MANAGEMENT
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08/02/2016
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03/15/2013
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09/18/2014
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METHODS FOR FABRICATING INTEGRATED CIRCUITS WITH SEMICONDUCTOR SUBSTRATE PROTECTION
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05/10/2016
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04/10/2013
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08/27/2015
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METHOD OF FORMING MICROELECTRONIC OR MICROMECHANICAL STRUCTURES
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12/27/2016
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04/15/2013
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10/16/2014
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FINFET FIN HEIGHT CONTROL
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06/28/2016
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05/01/2013
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09/26/2013
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ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES
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02/23/2016
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13890776
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05/09/2013
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11/13/2014
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TEMPORARY LIQUID THERMAL INTERFACE MATERIAL FOR SURFACE TENSION ADHESION AND THERMAL CONTROL
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01/05/2016
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05/21/2013
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11/27/2014
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ELEMENTAL SEMICONDUCTOR MATERIAL CONTACTFOR HIGH ELECTRON MOBILITY TRANSISTOR
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03/08/2016
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13900808
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05/23/2013
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11/27/2014
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METHOD OF FABRICATING A SEMICONDUCTOR DEVICE INCLUDING EMBEDDED CRYSTALLINE BACK-GATE BIAS PLANES
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10/27/2015
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13901739
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05/24/2013
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11/27/2014
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METHOD INCLUDING AN ETCHING OF A PORTION OF AN INTERLAYER DIELECTRIC IN A SEMICONDUCTOR STRUCTURE, A DEGAS PROCESS AND A PRECLEAN PROCESS
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04/05/2016
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13910152
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06/05/2013
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12/11/2014
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CONSTRAINED DIE ADHESION CURE PROCESS
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12/01/2015
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13912448
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06/07/2013
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12/11/2014
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SELF-ALIGNED CHANNEL DRIFT DEVICE AND METHODS OF MAKING SUCH A DEVICE
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11/17/2015
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13914808
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06/11/2013
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Pub Dt:
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12/11/2014
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Title:
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RETROGRADE DOPED LAYER FOR DEVICE ISOLATION
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Patent #:
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Issue Dt:
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05/09/2017
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Application #:
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13916669
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Filing Dt:
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06/13/2013
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Publication #:
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Pub Dt:
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12/18/2014
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Title:
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MAKING AN EFUSE
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Patent #:
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Issue Dt:
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07/05/2016
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Application #:
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13927698
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Filing Dt:
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06/26/2013
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Publication #:
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Pub Dt:
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01/01/2015
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Title:
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BULK FINFET WITH PARTIAL DIELECTRIC ISOLATION FEATURING A PUNCH-THROUGH STOPPING LAYER UNDER THE OXIDE
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Patent #:
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Issue Dt:
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12/29/2015
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Application #:
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13931205
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Filing Dt:
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06/28/2013
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Publication #:
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Pub Dt:
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01/01/2015
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Title:
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INTEGRATED CIRCUITS HAVING IMPROVED HIGH-K DIELECTRIC LAYERS AND METHODS FOR FABRICATION OF SAME
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Patent #:
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Issue Dt:
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03/01/2016
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Application #:
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13945678
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Filing Dt:
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07/18/2013
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Publication #:
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Pub Dt:
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11/21/2013
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Title:
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CURVILINEAR WIRING STRUCTURE TO REDUCE AREAS OF HIGH FIELD DENSITY IN AN INTEGRATED CIRCUIT
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Patent #:
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Issue Dt:
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12/08/2015
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Application #:
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13947316
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Filing Dt:
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07/22/2013
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Publication #:
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Pub Dt:
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01/22/2015
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Title:
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Low Temperature Salicide for Replacement Gate Nanowires
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Patent #:
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Issue Dt:
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12/08/2015
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Application #:
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13952993
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Filing Dt:
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07/29/2013
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Publication #:
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Pub Dt:
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01/29/2015
| | | | |
Title:
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FIN FIELD EFFECT TRANSISTOR WITH DIELECTRIC ISOLATION AND ANCHORED STRESSOR ELEMENTS
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Patent #:
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Issue Dt:
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10/18/2016
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Application #:
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13955693
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Filing Dt:
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07/31/2013
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Publication #:
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Pub Dt:
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02/05/2015
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Title:
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INTEGRATED CIRCUITS HAVING FINFET SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME TO RESIST SUB-FIN CURRENT LEAKAGE
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Patent #:
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Issue Dt:
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08/16/2016
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Application #:
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13958938
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Filing Dt:
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08/05/2013
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Publication #:
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Pub Dt:
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02/05/2015
| | | | |
Title:
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DEVICE AND METHOD FOR A LDMOS DESIGN FOR A FINFET INTEGRATED CIRCUIT
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Patent #:
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Issue Dt:
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06/21/2016
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Application #:
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13961282
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Filing Dt:
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08/07/2013
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Publication #:
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Pub Dt:
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02/12/2015
| | | | |
Title:
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TRANSISTOR WITH BONDED GATE DIELECTRIC
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Patent #:
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Issue Dt:
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01/17/2017
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Application #:
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13964286
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Filing Dt:
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08/12/2013
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Publication #:
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Pub Dt:
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02/12/2015
| | | | |
Title:
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METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING A SELF-ALIGNED OPL REPLACEMENT CONTACT AND PATTERNED HSQ AND A SEMICONDUCTOR DEVICE FORMED BY SAME
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Patent #:
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Issue Dt:
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11/03/2015
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Application #:
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14012563
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Filing Dt:
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08/28/2013
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Publication #:
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Pub Dt:
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03/05/2015
| | | | |
Title:
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METHOD OF FORMING A SEMICONDUCTOR DEVICE EMPLOYING AN OPTICAL PLANARIZATION LAYER
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Patent #:
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Issue Dt:
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08/30/2016
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Application #:
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14014906
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Filing Dt:
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08/30/2013
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Publication #:
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Pub Dt:
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03/05/2015
| | | | |
Title:
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METHODS OF FORMING INTEGRATED CIRCUITS AND MULTIPLE CRITICAL DIMENSION SELF-ALIGNED DOUBLE PATTERNING PROCESSES
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Patent #:
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Issue Dt:
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03/01/2016
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Application #:
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14015640
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Filing Dt:
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08/30/2013
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Publication #:
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Pub Dt:
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03/05/2015
| | | | |
Title:
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METHODS FOR FABRICATING INTEGRATED CIRCUITS USING CHEMICAL MECHANICAL PLANARIZATION TO RECESS METAL
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Patent #:
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Issue Dt:
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10/18/2016
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Application #:
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14017461
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Filing Dt:
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09/04/2013
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Publication #:
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Pub Dt:
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03/05/2015
| | | | |
Title:
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SPACERLESS FIN DEVICE WITH REDUCED PARASITIC RESISTANCE AND CAPACITANCE AND METHOD TO FABRICATE SAME
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Patent #:
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Issue Dt:
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12/29/2015
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Application #:
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14020098
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Filing Dt:
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09/06/2013
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Publication #:
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Pub Dt:
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03/12/2015
| | | | |
Title:
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FLEXIBLE ACTIVE MATRIX DISPLAY
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Patent #:
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Issue Dt:
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12/29/2015
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Application #:
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14023007
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Filing Dt:
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09/10/2013
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Publication #:
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Pub Dt:
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03/12/2015
| | | | |
Title:
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HIGH PERCENTAGE SILICON GERMANIUM ALLOY FIN FORMATION
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Patent #:
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Issue Dt:
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04/05/2016
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Application #:
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14024694
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Filing Dt:
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09/12/2013
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Publication #:
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Pub Dt:
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11/13/2014
| | | | |
Title:
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E-FUSE WITH HYBRID METALLIZATION
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Patent #:
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Issue Dt:
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05/10/2016
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Application #:
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14027331
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Filing Dt:
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09/16/2013
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Publication #:
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Pub Dt:
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03/05/2015
| | | | |
Title:
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SPACERLESS FIN DEVICE WITH REDUCED PARASITIC RESISTANCE AND CAPACITANCE AND METHOD TO FABRICATE SAME
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Patent #:
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Issue Dt:
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12/22/2015
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Application #:
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14028724
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Filing Dt:
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09/17/2013
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Publication #:
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Pub Dt:
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03/19/2015
| | | | |
Title:
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OVERLAY PERFORMANCE FOR A FIN FIELD EFFECT TRANSISTOR DEVICE
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Patent #:
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Issue Dt:
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03/22/2016
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Application #:
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14030019
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Filing Dt:
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09/18/2013
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Publication #:
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Pub Dt:
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03/19/2015
| | | | |
Title:
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Pressure Transfer Process for Thin Film Solar Cell Fabrication
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Patent #:
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Issue Dt:
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07/26/2016
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Application #:
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14031563
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Filing Dt:
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09/19/2013
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Publication #:
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Pub Dt:
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03/19/2015
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Title:
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FEATURE ETCHING USING VARYING SUPPLY OF POWER PULSES
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Patent #:
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Issue Dt:
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05/31/2016
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Application #:
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14042951
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Filing Dt:
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10/01/2013
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Publication #:
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Pub Dt:
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04/02/2015
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Title:
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LATERAL HETEROJUNCTION BIPOLAR TRANSISTOR WITH LOW TEMPERATURE RECESSED CONTACTS
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Patent #:
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Issue Dt:
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11/24/2015
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Application #:
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14043017
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Filing Dt:
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10/01/2013
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Publication #:
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Pub Dt:
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04/02/2015
| | | | |
Title:
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INTEGRATED CIRCUITS WITH DUAL SILICIDE CONTACTS AND METHODS FOR FABRICATING SAME
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Patent #:
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Issue Dt:
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03/01/2016
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Application #:
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14045340
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Filing Dt:
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10/03/2013
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Publication #:
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Pub Dt:
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04/09/2015
| | | | |
Title:
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METHOD AND APPARATUS FOR HIGH YIELD CONTACT INTEGRATION SCHEME
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Patent #:
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Issue Dt:
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04/11/2017
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Application #:
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14050472
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Filing Dt:
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10/10/2013
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Publication #:
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Pub Dt:
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04/16/2015
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Title:
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FACILITATING ETCH PROCESSING OF A THIN FILM VIA PARTIAL IMPLANTATION THEREOF
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Patent #:
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Issue Dt:
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08/16/2016
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Application #:
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14050661
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Filing Dt:
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10/10/2013
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Publication #:
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Pub Dt:
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04/16/2015
| | | | |
Title:
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FORMING ISOLATED FINS FROM A SUBSTRATE
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Patent #:
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Issue Dt:
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09/13/2016
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Application #:
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14052366
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Filing Dt:
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10/11/2013
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Publication #:
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Pub Dt:
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04/16/2015
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Title:
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METHOD OF ELIMINATING POOR REVEAL OF THROUGH SILICON VIAS
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Patent #:
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Issue Dt:
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02/16/2016
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Application #:
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14052924
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Filing Dt:
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10/14/2013
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Pub Dt:
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04/16/2015
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Title:
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INTEGRATED FINFET-BJT REPLACEMENT METAL GATE
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Patent #:
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Issue Dt:
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04/04/2017
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14057649
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Filing Dt:
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10/18/2013
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Pub Dt:
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04/23/2015
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Title:
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STRUCTURE TO PREVENT SOLDER EXTRUSION
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Patent #:
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Issue Dt:
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06/14/2016
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Application #:
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14073581
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Filing Dt:
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11/06/2013
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Pub Dt:
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03/06/2014
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Title:
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SILICON-ON-INSULATOR TRANSISTOR WITH SELF-ALIGNED BORDERLESS SOURCE/DRAIN CONTACTS
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Issue Dt:
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02/16/2016
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14074981
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11/08/2013
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Pub Dt:
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05/14/2015
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Title:
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PRINTING MINIMUM WIDTH SEMICONDUCTOR FEATURES AT NON-MINIMUM PITCH AND RESULTING DEVICE
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Patent #:
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Issue Dt:
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05/17/2016
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14075228
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11/08/2013
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Pub Dt:
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05/14/2015
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Title:
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method to etch cu/Ta/TaN selectively using dilute aqueous Hf/h2so4 solution
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Issue Dt:
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11/22/2016
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Application #:
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14079733
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11/14/2013
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Pub Dt:
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05/14/2015
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Title:
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FinFET DEVICE INCLUDING FINS HAVING A SMALLER THICKNESS IN A CHANNEL REGION, AND A METHOD OF MANUFACTURING SAME
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Issue Dt:
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05/24/2016
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14080533
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11/14/2013
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Pub Dt:
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05/14/2015
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Title:
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METHODS OF SCALING THICKNESS OF A GATE DIELECTRIC STRUCTURE, METHODS OF FORMING AN INTEGRATED CIRCUIT, AND INTEGRATED CIRCUITS
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Issue Dt:
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06/21/2016
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14081749
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11/15/2013
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Pub Dt:
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05/21/2015
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Title:
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INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS WITH IMPROVED CONTACT STRUCTURES
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Issue Dt:
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02/02/2016
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Application #:
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14083164
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11/18/2013
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Pub Dt:
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05/21/2015
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Title:
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FINFET SEMICONDUCTOR DEVICE HAVING LOCAL BURIED OXIDE
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Issue Dt:
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02/14/2017
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14084756
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11/20/2013
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Pub Dt:
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05/21/2015
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Title:
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FABRICATION METHODS FACILITATING INTEGRATION OF DIFFERENT DEVICE ARCHITECTURES
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Issue Dt:
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11/24/2015
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14085969
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11/21/2013
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Pub Dt:
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05/21/2015
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Title:
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ACHIEVING UNIFORM CAPACITANCE BETWEEN AN ELECTROSTATIC CHUCK AND A SEMICONDUCTOR WAFER
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Issue Dt:
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04/12/2016
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14092081
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11/27/2013
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Pub Dt:
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05/28/2015
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Title:
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IMPLEMENTING BURIED FET UTILIZING DRAIN OF FINFET AS GATE OF BURIED FET
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Issue Dt:
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10/04/2016
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Application #:
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14092232
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Filing Dt:
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11/27/2013
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Publication #:
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Pub Dt:
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05/28/2015
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Title:
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INTEGRATED CIRCUITS WITH SHALLOW TRENCH ISOLATIONS, AND METHODS FOR PRODUCING THE SAME
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Issue Dt:
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04/26/2016
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Application #:
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14135716
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Filing Dt:
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12/20/2013
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Publication #:
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Pub Dt:
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06/25/2015
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Title:
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BURIED LOCAL INTERCONNECT IN FINFET STRUCTURE AND METHOD OF FABRICATING SAME
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Patent #:
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Issue Dt:
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11/03/2015
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Application #:
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14143362
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Filing Dt:
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12/30/2013
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Pub Dt:
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07/02/2015
| | | | |
Title:
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BALANCING ASYMMETRIC SPACERS
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Issue Dt:
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11/10/2015
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Application #:
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14143468
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Filing Dt:
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12/30/2013
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Publication #:
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Pub Dt:
|
07/02/2015
| | | | |
Title:
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METHODS OF FORMING GATE STRUCTURES FOR SEMICONDUCTOR DEVICES USING A REPLACEMENT GATE TECHNIQUE AND THE RESULTING DEVICES
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