Total properties:
711
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6
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Patent #:
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Issue Dt:
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10/18/2022
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Application #:
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16356234
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Filing Dt:
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03/18/2019
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Publication #:
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Pub Dt:
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09/24/2020
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Title:
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Structures for Reducing Electron Concentration and Process for Reducing Electron Concentration
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Patent #:
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Issue Dt:
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08/18/2020
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Application #:
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16360333
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Filing Dt:
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03/21/2019
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Publication #:
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Pub Dt:
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02/13/2020
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Title:
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HIGH VOLTAGE POWER MODULE
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Patent #:
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Issue Dt:
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01/12/2021
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Application #:
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16376596
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Filing Dt:
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04/05/2019
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Publication #:
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Pub Dt:
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08/01/2019
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Title:
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GROUP III-NITRIDE HIGH-ELECTRON MOBILITY TRANSISTORS WITH BURIED P-TYPE LAYERS AND PROCESS FOR MAKING THE SAME
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Patent #:
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Issue Dt:
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11/02/2021
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Application #:
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16381629
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Filing Dt:
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04/11/2019
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Publication #:
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Pub Dt:
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10/15/2020
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Title:
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TRANSISTOR SEMICONDUCTOR DIE WITH INCREASED ACTIVE AREA
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Patent #:
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Issue Dt:
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08/16/2022
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Application #:
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16393280
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Filing Dt:
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04/24/2019
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Publication #:
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Pub Dt:
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10/29/2020
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Title:
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HIGH POWER TRANSISTOR WITH INTERIOR-FED FINGERS
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Patent #:
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Issue Dt:
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01/05/2021
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Application #:
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16400109
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Filing Dt:
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05/01/2019
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Publication #:
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Pub Dt:
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08/22/2019
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Title:
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SEMICONDUCTOR DIE WITH IMPROVED RUGGEDNESS
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Patent #:
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Issue Dt:
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02/18/2020
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Application #:
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16410487
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Filing Dt:
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05/13/2019
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Title:
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LASER-ASSISTED METHOD FOR PARTING CRYSTALLINE MATERIAL
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Patent #:
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Issue Dt:
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05/04/2021
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Application #:
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16413921
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Filing Dt:
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05/16/2019
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Publication #:
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Pub Dt:
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11/19/2020
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Title:
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POWER SEMICONDUCTOR DEVICES HAVING REFLOWED INTER-METAL DIELECTRIC LAYERS
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Patent #:
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Issue Dt:
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04/07/2020
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Application #:
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16415721
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Filing Dt:
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05/17/2019
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Title:
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SILICON CARBIDE WAFERS WITH RELAXED POSITIVE BOW AND RELATED METHODS
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Patent #:
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Issue Dt:
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11/01/2022
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Application #:
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16421824
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Filing Dt:
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05/24/2019
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Publication #:
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Pub Dt:
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11/26/2020
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Title:
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HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
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Patent #:
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Issue Dt:
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03/29/2022
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Application #:
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16440063
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Filing Dt:
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06/13/2019
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Publication #:
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Pub Dt:
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12/17/2020
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Title:
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Methods for Dicing Semiconductor Wafers and Semiconductor Devices Made by the Methods
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Patent #:
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Issue Dt:
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02/16/2021
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Application #:
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16440427
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Filing Dt:
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06/13/2019
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Publication #:
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Pub Dt:
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12/17/2020
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Title:
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HIGH ELECTRON MOBILITY TRANSISTORS HAVING IMPROVED CONTACT SPACING AND/OR IMPROVED CONTACT VIAS
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Patent #:
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Issue Dt:
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07/20/2021
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Application #:
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16441925
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Filing Dt:
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06/14/2019
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Publication #:
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Pub Dt:
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12/17/2020
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Title:
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PACKAGE FOR POWER ELECTRONICS
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Patent #:
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Issue Dt:
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02/14/2023
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Application #:
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16448538
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Filing Dt:
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06/21/2019
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Publication #:
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Pub Dt:
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12/24/2020
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Title:
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DEVICE DESIGN FOR SHORT-CIRCUITRY PROTECTION CIRCUITRY WITHIN TRANSISTORS
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Patent #:
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Issue Dt:
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03/15/2022
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Application #:
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16451817
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Filing Dt:
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06/25/2019
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Publication #:
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Pub Dt:
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12/31/2020
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Title:
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Composite-Channel High Electron Mobility Transistor
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Patent #:
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Issue Dt:
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02/08/2022
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Application #:
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16502771
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Filing Dt:
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07/03/2019
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Publication #:
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Pub Dt:
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10/31/2019
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Title:
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DEPLETION MODE SEMICONDUCTOR DEVICES INCLUDING CURRENT DEPENDENT RESISTANCE
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Patent #:
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Issue Dt:
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07/06/2021
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Application #:
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16504908
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Filing Dt:
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07/08/2019
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Publication #:
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Pub Dt:
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12/31/2020
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Title:
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HYBRID POWER MODULE
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Patent #:
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Issue Dt:
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10/05/2021
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Application #:
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16524726
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Filing Dt:
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07/29/2019
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Publication #:
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Pub Dt:
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02/04/2021
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Title:
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OVERCURRENT PROTECTION FOR POWER TRANSISTORS
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Patent #:
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Issue Dt:
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11/02/2021
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Application #:
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16538229
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Filing Dt:
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08/12/2019
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Publication #:
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Pub Dt:
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12/05/2019
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Title:
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POWER SILICON CARBIDE BASED MOSFET TRANSISTORS WITH IMPROVED SHORT CIRCUIT CAPABILITIES AND METHODS OF MAKING SUCH DEVICES
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Patent #:
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Issue Dt:
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10/19/2021
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Application #:
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16548241
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Filing Dt:
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08/22/2019
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Publication #:
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Pub Dt:
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02/25/2021
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Title:
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CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVICES AND RELATED METHODS OF SPUTTERING EUTECTIC ALLOYS
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Patent #:
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Issue Dt:
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09/06/2022
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Application #:
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16589624
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Filing Dt:
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10/01/2019
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Publication #:
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Pub Dt:
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01/30/2020
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Title:
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Multi-Cavity Package Having Single Metal Flange
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Patent #:
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Issue Dt:
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08/18/2020
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Application #:
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16596240
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Filing Dt:
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10/08/2019
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Publication #:
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Pub Dt:
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02/06/2020
| | | | |
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Title:
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HIGH POWER TRANSISTOR WITH INTERIOR-FED GATE FINGERS
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Patent #:
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Issue Dt:
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03/29/2022
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Application #:
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16597224
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Filing Dt:
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10/09/2019
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Publication #:
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Pub Dt:
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04/15/2021
| | | | |
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Title:
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Systems and Processes for Increasing Semiconductor Device Reliability
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Patent #:
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Issue Dt:
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04/19/2022
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Application #:
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16598646
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Filing Dt:
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10/10/2019
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Publication #:
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Pub Dt:
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04/15/2021
| | | | |
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Title:
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SEMICONDUCTOR DEVICE WITH IMPROVED SHORT CIRCUIT WITHSTAND TIME AND METHODS FOR MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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07/27/2021
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Application #:
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16600825
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Filing Dt:
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10/14/2019
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Publication #:
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Pub Dt:
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04/15/2021
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Title:
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STEPPED FIELD PLATES WITH PROXIMITY TO CONDUCTION CHANNEL AND RELATED FABRICATION METHODS
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Patent #:
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Issue Dt:
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02/09/2021
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Application #:
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16658630
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Filing Dt:
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10/21/2019
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Publication #:
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Pub Dt:
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02/13/2020
| | | | |
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Title:
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High Power Multilayer Module Having Low Inductance and Fast Switching for Paralleling Power Devices
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Patent #:
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Issue Dt:
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08/09/2022
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Application #:
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16681044
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Filing Dt:
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11/12/2019
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Title:
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PASSIVATION STRUCTURE FOR SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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05/23/2023
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Application #:
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16688344
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Filing Dt:
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11/19/2019
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Publication #:
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Pub Dt:
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05/20/2021
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Title:
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Semiconductors with Improved Thermal Budget and Process of Making Semiconductors with Improved Thermal Budget
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16704644
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Filing Dt:
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12/05/2019
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Publication #:
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Pub Dt:
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06/10/2021
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Title:
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Semiconductors Having Die Pads with Environmental Protection and Process of Making Semiconductors Having Die Pads with Environmental Protection
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Patent #:
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Issue Dt:
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08/29/2023
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Application #:
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16706028
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Filing Dt:
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12/06/2019
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Publication #:
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Pub Dt:
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06/10/2021
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Title:
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Methods and Systems for Matching Both Dynamic and Static Parameters in Dies, Discretes, and/or Modules, and Methods and Systems Based on the Same
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16750358
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Filing Dt:
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01/23/2020
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Publication #:
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Pub Dt:
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11/19/2020
| | | | |
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Title:
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NONDESTRUCTIVE CHARACTERIZATION FOR CRYSTALLINE WAFERS
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Patent #:
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Issue Dt:
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06/28/2022
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Application #:
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16751246
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Filing Dt:
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01/24/2020
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Publication #:
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Pub Dt:
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05/21/2020
| | | | |
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Title:
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STABILIZED, HIGH-DOPED SILICON CARBIDE
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Patent #:
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Issue Dt:
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12/06/2022
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Application #:
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16775407
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Filing Dt:
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01/29/2020
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Publication #:
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Pub Dt:
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07/29/2021
| | | | |
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Title:
|
DISLOCATION DISTRIBUTION FOR SILICON CARBIDE CRYSTALLINE MATERIALS
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|
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Patent #:
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|
Issue Dt:
|
06/15/2021
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Application #:
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16784311
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Filing Dt:
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02/07/2020
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Publication #:
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Pub Dt:
|
11/19/2020
| | | | |
|
Title:
|
SILICON CARBIDE WAFERS WITH RELAXED POSITIVE BOW AND RELATED METHODS
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|
|
|
|
Patent #:
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NONE
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Issue Dt:
|
|
Application #:
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16784857
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Filing Dt:
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02/07/2020
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Publication #:
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Pub Dt:
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06/04/2020
| | | | |
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Title:
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HIGH SPEED, EFFICIENT SIC POWER MODULE
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Patent #:
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Issue Dt:
|
01/11/2022
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Application #:
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16792261
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Filing Dt:
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02/16/2020
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Title:
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LASER-ASSISTED METHOD FOR PARTING CRYSTALLINE MATERIAL
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Patent #:
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|
Issue Dt:
|
08/16/2022
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Application #:
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16801260
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Filing Dt:
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02/26/2020
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Publication #:
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Pub Dt:
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06/18/2020
| | | | |
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Title:
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VERTICAL SEMICONDUCTOR DEVICE WITH IMPROVED RUGGEDNESS
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Patent #:
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Issue Dt:
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06/14/2022
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Application #:
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16804776
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Filing Dt:
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02/28/2020
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Publication #:
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Pub Dt:
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09/02/2021
| | | | |
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Title:
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ALIGNMENT FOR WAFER IMAGES
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16806489
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Filing Dt:
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03/02/2020
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Publication #:
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Pub Dt:
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09/02/2021
| | | | |
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Title:
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SEMICONDUCTOR DIE HAVING A DRIFT REGION WITH A CHARGE COMPENSATION REGION FORMED THEREIN WHERE THE CHARGE COMPENSATION REGION HAS A PLURALITY OF GUARD RINGS FORMED IN FIRST AND SECOND OPPOSITE DOPING TYPE PORTIONS
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Patent #:
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Issue Dt:
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11/16/2021
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Application #:
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16806754
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Filing Dt:
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03/02/2020
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Publication #:
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Pub Dt:
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09/02/2021
| | | | |
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Title:
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System and Process for Implementing Accelerated Test Conditions for High Voltage Lifetime Evaluation of Semiconductor Power Devices
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Patent #:
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Issue Dt:
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11/23/2021
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Application #:
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16811526
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Filing Dt:
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03/06/2020
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Publication #:
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Pub Dt:
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07/02/2020
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Title:
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POWER SWITCHING DEVICES WITH HIGH DV/DT CAPABILITY AND METHODS OF MAKING SUCH DEVICES
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16832918
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Filing Dt:
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03/27/2020
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Publication #:
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Pub Dt:
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09/30/2021
| | | | |
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Title:
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POWER SEMICONDUCTOR PACKAGE WITH IMPROVED PERFORMANCE
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Patent #:
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|
Issue Dt:
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01/30/2024
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Application #:
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16851197
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Filing Dt:
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04/17/2020
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Publication #:
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Pub Dt:
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07/30/2020
| | | | |
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Title:
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HIGH SPEED, EFFICIENT SIC POWER MODULE
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|
|
|
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Patent #:
|
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Issue Dt:
|
01/11/2022
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Application #:
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16854959
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Filing Dt:
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04/22/2020
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Publication #:
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Pub Dt:
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10/28/2021
| | | | |
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Title:
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SEMICONDUCTOR POWER DEVICES HAVING GATE DIELECTRIC LAYERS WITH IMPROVED BREAKDOWN CHARACTERISTICS AND METHODS OF FORMING SUCH DEVICES
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|
|
|
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Patent #:
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|
Issue Dt:
|
03/15/2022
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Application #:
|
16855161
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Filing Dt:
|
04/22/2020
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|
Publication #:
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Pub Dt:
|
10/28/2021
| | | | |
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Title:
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INTERFACE LAYER CONTROL METHODS FOR SEMICONDUCTOR POWER DEVICES AND SEMICONDUCTOR DEVICES FORMED THEREOF
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|
|
|
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Patent #:
|
|
Issue Dt:
|
01/24/2023
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Application #:
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16863399
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Filing Dt:
|
04/30/2020
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|
Publication #:
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Pub Dt:
|
11/04/2021
| | | | |
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Title:
|
TRENCHED POWER DEVICE WITH SEGMENTED TRENCH AND SHIELDING
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Patent #:
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NONE
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Issue Dt:
|
|
Application #:
|
16863642
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Filing Dt:
|
04/30/2020
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|
Publication #:
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Pub Dt:
|
11/04/2021
| | | | |
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Title:
|
SEMICONDUCTOR DEVICE HAVING A FIRST BARRIER LAYER FORMED ON A GATE PAD AND GATE ELECTRODE AND AN ISOLATION LAYER PROVIDED BETWEEN THE FIRST BARRIER LAYER AND A SECOND BARRIER LAYER FORMED THEREON
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Patent #:
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NONE
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Issue Dt:
|
|
Application #:
|
16863797
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Filing Dt:
|
04/30/2020
|
|
Publication #:
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Pub Dt:
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11/04/2021
| | | | |
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Title:
|
CONDUCTION ENHANCEMENT LAYERS FOR ELECTRICAL CONTACT REGIONS IN POWER DEVICES
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|
|
|
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Patent #:
|
|
Issue Dt:
|
08/23/2022
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Application #:
|
16868639
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Filing Dt:
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05/07/2020
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|
Publication #:
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|
Pub Dt:
|
11/11/2021
| | | | |
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Title:
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Integrated Circuit Having Die Attach Materials with Channels and Process of Implementing the Same
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16876752
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Filing Dt:
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05/18/2020
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|
Publication #:
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Pub Dt:
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11/18/2021
| | | | |
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Title:
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Group III-Nitride High-Electron Mobility Transistors Configured with Recessed Source and/or Drain Contacts for Reduced On State Resistance and Process for Implementing the Same
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Patent #:
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Issue Dt:
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03/22/2022
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Application #:
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16889981
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Filing Dt:
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06/02/2020
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Publication #:
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Pub Dt:
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12/02/2021
| | | | |
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Title:
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CONTACT STRUCTURES FOR SEMICONDUCTOR DEVICES
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Patent #:
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NONE
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Issue Dt:
|
06/11/2024
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Application #:
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16890503
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Filing Dt:
|
06/02/2020
|
|
Publication #:
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Pub Dt:
|
09/24/2020
| | | | |
|
Title:
|
High Power Multilayer Module Having Low Inductance and Fast Switching for Paralleling Power Devices
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/22/2022
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Application #:
|
16892604
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Filing Dt:
|
06/04/2020
|
|
Publication #:
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Pub Dt:
|
12/09/2021
| | | | |
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Title:
|
SEMICONDUCTOR POWER DEVICES HAVING GRADED LATERAL DOPING IN THE SOURCE REGION
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|
|
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Patent #:
|
NONE
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Issue Dt:
|
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Application #:
|
16907163
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Filing Dt:
|
06/19/2020
|
|
Publication #:
|
|
Pub Dt:
|
12/23/2021
| | | | |
|
Title:
|
POWER DEVICES WITH A HYBRID GATE STRUCTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/28/2023
|
Application #:
|
16909299
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Filing Dt:
|
06/23/2020
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|
Publication #:
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Pub Dt:
|
10/08/2020
| | | | |
|
Title:
|
LASER-ASSISTED METHOD FOR PARTING CRYSTALLINE MATERIAL
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/24/2023
|
Application #:
|
16922192
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Filing Dt:
|
07/07/2020
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|
Publication #:
|
|
Pub Dt:
|
01/13/2022
| | | | |
|
Title:
|
POWER SEMICONDUCTOR DEVICES HAVING MULTILAYER GATE DIELECTRIC LAYERS THAT INCLUDE AN ETCH STOP/FIELD CONTROL LAYER AND METHODS OF FORMING SUCH DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/21/2021
|
Application #:
|
16936552
|
Filing Dt:
|
07/23/2020
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|
Publication #:
|
|
Pub Dt:
|
11/12/2020
| | | | |
|
Title:
|
HIGH VOLTAGE POWER MODULE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/22/2023
|
Application #:
|
16937857
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Filing Dt:
|
07/24/2020
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|
Publication #:
|
|
Pub Dt:
|
10/07/2021
| | | | |
|
Title:
|
POWER MODULE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/01/2022
|
Application #:
|
16938032
|
Filing Dt:
|
07/24/2020
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|
Publication #:
|
|
Pub Dt:
|
11/19/2020
| | | | |
|
Title:
|
VERTICAL SEMICONDUCTOR DEVICE WITH IMPROVED RUGGEDNESS
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
16942082
|
Filing Dt:
|
07/29/2020
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|
Publication #:
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|
Pub Dt:
|
02/03/2022
| | | | |
|
Title:
|
SHIELDING ARRANGEMENTS FOR TRANSFORMER STRUCTURES
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
16950414
|
Filing Dt:
|
11/17/2020
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|
Publication #:
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Pub Dt:
|
03/04/2021
| | | | |
|
Title:
|
METHODS AND APPARATUSES RELATED TO SHAPING WAFERS FABRICATED BY ION IMPLANTATION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/05/2023
|
Application #:
|
16952757
|
Filing Dt:
|
11/19/2020
|
|
Publication #:
|
|
Pub Dt:
|
04/01/2021
| | | | |
|
Title:
|
POWER SEMICONDUCTOR DEVICES HAVING GATE TRENCHES AND BURIED EDGE TERMINATIONS AND RELATED METHODS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
16993680
|
Filing Dt:
|
08/14/2020
|
|
Publication #:
|
|
Pub Dt:
|
02/17/2022
| | | | |
|
Title:
|
SIDEWALL DOPANT SHIELDING METHODS AND APPROACHES FOR TRENCHED SEMICONDUCTOR DEVICE STRUCTURES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/12/2023
|
Application #:
|
17004531
|
Filing Dt:
|
08/27/2020
|
|
Publication #:
|
|
Pub Dt:
|
03/03/2022
| | | | |
|
Title:
|
POWER SILICON CARBIDE BASED SEMICONDUCTOR DEVICES WITH IMPROVED SHORT CIRCUIT CAPABILITIES AND METHODS OF MAKING SUCH DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/07/2022
|
Application #:
|
17018305
|
Filing Dt:
|
09/11/2020
|
|
Publication #:
|
|
Pub Dt:
|
03/17/2022
| | | | |
|
Title:
|
TRENCH BOTTOM SHIELDING METHODS AND APPROACHES FOR TRENCHED SEMICONDUCTOR DEVICE STRUCTURES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/05/2023
|
Application #:
|
17018721
|
Filing Dt:
|
09/11/2020
|
|
Publication #:
|
|
Pub Dt:
|
03/17/2022
| | | | |
|
Title:
|
PACKAGING FOR RF TRANSISTOR AMPLIFIERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/07/2023
|
Application #:
|
17031365
|
Filing Dt:
|
09/24/2020
|
|
Publication #:
|
|
Pub Dt:
|
03/24/2022
| | | | |
|
Title:
|
EDGE TERMINATION STRUCTURES FOR SEMICONDUCTOR DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/07/2023
|
Application #:
|
17034815
|
Filing Dt:
|
09/28/2020
|
|
Publication #:
|
|
Pub Dt:
|
03/31/2022
| | | | |
|
Title:
|
Power Module Having an Elevated Power Plane with an Integrated Signal Board and Process of Implementing the Same
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/29/2023
|
Application #:
|
17078456
|
Filing Dt:
|
10/23/2020
|
|
Publication #:
|
|
Pub Dt:
|
04/28/2022
| | | | |
|
Title:
|
ELECTRONIC DEVICE PACKAGES WITH INTERNAL MOISTURE BARRIERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/09/2024
|
Application #:
|
17080062
|
Filing Dt:
|
10/26/2020
|
|
Title:
|
VERTICAL POWER TRANSISTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/02/2023
|
Application #:
|
17080956
|
Filing Dt:
|
10/27/2020
|
|
Publication #:
|
|
Pub Dt:
|
04/28/2022
| | | | |
|
Title:
|
POWER SEMICONDUCTOR DEVICES INCLUDING A TRENCHED GATE AND METHODS OF FORMING SUCH DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/15/2022
|
Application #:
|
17081476
|
Filing Dt:
|
10/27/2020
|
|
Publication #:
|
|
Pub Dt:
|
04/28/2022
| | | | |
|
Title:
|
FIELD EFFECT TRANSISTOR WITH AT LEAST PARTIALLY RECESSED FIELD PLATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/21/2023
|
Application #:
|
17082647
|
Filing Dt:
|
10/28/2020
|
|
Publication #:
|
|
Pub Dt:
|
04/28/2022
| | | | |
|
Title:
|
GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING IMPROVED DEEP SHIELD CONNECTION PATTERNS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/21/2023
|
Application #:
|
17083712
|
Filing Dt:
|
10/29/2020
|
|
Publication #:
|
|
Pub Dt:
|
02/11/2021
| | | | |
|
Title:
|
SEMICONDUCTOR DIE WITH IMPROVED RUGGEDNESS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17085386
|
Filing Dt:
|
10/30/2020
|
|
Publication #:
|
|
Pub Dt:
|
05/05/2022
| | | | |
|
Title:
|
TRANSISTOR PACKAGES WITH IMPROVED DIE ATTACH
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/28/2023
|
Application #:
|
17085433
|
Filing Dt:
|
10/30/2020
|
|
Publication #:
|
|
Pub Dt:
|
11/11/2021
| | | | |
|
Title:
|
PACKAGED TRANSISTOR HAVING DIE ATTACH MATERIALS WITH CHANNELS AND PROCESS OF IMPLEMENTING THE SAME
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17087740
|
Filing Dt:
|
11/03/2020
|
|
Publication #:
|
|
Pub Dt:
|
05/05/2022
| | | | |
|
Title:
|
PROTECTION STRUCTURES FOR SEMICONDUCTOR DEVICES WITH SENSOR ARRANGEMENTS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17088647
|
Filing Dt:
|
11/04/2020
|
|
Publication #:
|
|
Pub Dt:
|
05/05/2022
| | | | |
|
Title:
|
POWER SEMICONDUCTOR DEVICES WITH IMPROVED OVERCOAT ADHESION AND/OR PROTECTION
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17088686
|
Filing Dt:
|
11/04/2020
|
|
Publication #:
|
|
Pub Dt:
|
05/05/2022
| | | | |
|
Title:
|
PASSIVATION STRUCTURES FOR SEMICONDUCTOR DEVICES HAVING PATTERNED STRUCTURES OVER EDGE TERMINATION REGIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/19/2023
|
Application #:
|
17092923
|
Filing Dt:
|
11/09/2020
|
|
Publication #:
|
|
Pub Dt:
|
05/12/2022
| | | | |
|
Title:
|
GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING IMPROVED DEEP SHIELD CONNECTION PATTERNS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17096147
|
Filing Dt:
|
11/12/2020
|
|
Publication #:
|
|
Pub Dt:
|
05/12/2022
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICES INCLUDING AN OFFSET METAL TO POLYSILICON GATE CONTACT
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17097294
|
Filing Dt:
|
11/13/2020
|
|
Publication #:
|
|
Pub Dt:
|
05/19/2022
| | | | |
|
Title:
|
PACKAGED RF POWER DEVICE WITH PCB ROUTING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/30/2023
|
Application #:
|
17097617
|
Filing Dt:
|
11/13/2020
|
|
Publication #:
|
|
Pub Dt:
|
05/19/2022
| | | | |
|
Title:
|
SEMICONDUCTOR POWER DEVICES HAVING MULTIPLE GATE TRENCHES AND METHODS OF FORMING SUCH DEVICES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
06/04/2024
|
Application #:
|
17101888
|
Filing Dt:
|
11/23/2020
|
|
Publication #:
|
|
Pub Dt:
|
05/26/2022
| | | | |
|
Title:
|
METHODS AND SYSTEMS FOR COMPONENT ANALYSIS, SORTING, AND SEQUENCING BASED ON COMPONENT PARAMETERS AND DEVICES UTILIZING THE METHODS AND SYSTEMS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17108505
|
Filing Dt:
|
12/01/2020
|
|
Publication #:
|
|
Pub Dt:
|
06/02/2022
| | | | |
|
Title:
|
FINFET POWER SEMICONDUCTOR DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/26/2023
|
Application #:
|
17110027
|
Filing Dt:
|
12/02/2020
|
|
Publication #:
|
|
Pub Dt:
|
06/02/2022
| | | | |
|
Title:
|
POWER TRANSISTOR WITH SOFT RECOVERY BODY DIODE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/30/2023
|
Application #:
|
17115359
|
Filing Dt:
|
12/08/2020
|
|
Publication #:
|
|
Pub Dt:
|
06/09/2022
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICES FOR IMPROVED MEASUREMENTS AND RELATED METHODS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17121863
|
Filing Dt:
|
12/15/2020
|
|
Publication #:
|
|
Pub Dt:
|
06/16/2022
| | | | |
|
Title:
|
LARGE DIMENSION SILICON CARBIDE SINGLE CRYSTALLINE MATERIALS WITH REDUCED CRYSTALLOGRAPHIC STRESS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/02/2024
|
Application #:
|
17123727
|
Filing Dt:
|
12/16/2020
|
|
Publication #:
|
|
Pub Dt:
|
04/08/2021
| | | | |
|
Title:
|
Group III-Nitride High-Electron Mobility Transistors with Buried P-Type Layers and Process for Making the Same
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17124810
|
Filing Dt:
|
12/17/2020
|
|
Publication #:
|
|
Pub Dt:
|
07/01/2021
| | | | |
|
Title:
|
LARGE DIAMETER SILICON CARBIDE WAFERS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17138193
|
Filing Dt:
|
12/30/2020
|
|
Publication #:
|
|
Pub Dt:
|
06/30/2022
| | | | |
|
Title:
|
PROCESS, SYSTEM, AND DEVICE FOR DETERMINING A RELATED PRODUCT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/17/2023
|
Application #:
|
17144346
|
Filing Dt:
|
01/08/2021
|
|
Publication #:
|
|
Pub Dt:
|
07/14/2022
| | | | |
|
Title:
|
RADIO FREQUENCY TRANSISTOR AMPLIFIERS HAVING WIDENED AND/OR ASYMMETRIC SOURCE/DRAIN REGIONS FOR IMPROVED ON-RESISTANCE PERFORMANCE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/20/2024
|
Application #:
|
17145794
|
Filing Dt:
|
01/11/2021
|
|
Publication #:
|
|
Pub Dt:
|
07/14/2022
| | | | |
|
Title:
|
DEVICES INCORPORATING STACKED BONDS AND METHODS OF FORMING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/07/2022
|
Application #:
|
17148688
|
Filing Dt:
|
01/14/2021
|
|
Publication #:
|
|
Pub Dt:
|
05/06/2021
| | | | |
|
Title:
|
HIGH ELECTRON MOBILITY TRANSISTORS HAVING IMPROVED DRAIN CURRENT DRIFT AND/OR LEAKAGE CURRENT PERFORMANCE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/13/2022
|
Application #:
|
17149815
|
Filing Dt:
|
01/15/2021
|
|
Publication #:
|
|
Pub Dt:
|
05/06/2021
| | | | |
|
Title:
|
HIGH POWER MULTILAYER MODULE HAVING LOW INDUCTANCE AND FAST SWITCHING FOR PARALLELING POWER DEVICES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17159925
|
Filing Dt:
|
01/27/2021
|
|
Publication #:
|
|
Pub Dt:
|
07/28/2022
| | | | |
|
Title:
|
PACKAGED ELECTRONIC DEVICES HAVING DIELECTRIC SUBSTRATES WITH THERMALLY CONDUCTIVE ADHESIVE LAYERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/26/2023
|
Application #:
|
17172481
|
Filing Dt:
|
02/10/2021
|
|
Publication #:
|
|
Pub Dt:
|
04/28/2022
| | | | |
|
Title:
|
GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING IMPROVED DEEP SHIELD CONNECTION PATTERNS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17172669
|
Filing Dt:
|
02/10/2021
|
|
Publication #:
|
|
Pub Dt:
|
06/03/2021
| | | | |
|
Title:
|
GROUP III-NITRIDE HIGH-ELECTRON MOBILITY TRANSISTORS WITH GATE CONNECTED BURIED P-TYPE LAYERS AND PROCESS FOR MAKING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/09/2024
|
Application #:
|
17177641
|
Filing Dt:
|
02/17/2021
|
|
Publication #:
|
|
Pub Dt:
|
08/18/2022
| | | | |
|
Title:
|
POWER SEMICONDUCTOR DEVICE WITH REDUCED STRAIN
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/31/2023
|
Application #:
|
17178435
|
Filing Dt:
|
02/18/2021
|
|
Publication #:
|
|
Pub Dt:
|
08/18/2022
| | | | |
|
Title:
|
INTEGRATED POWER MODULE
|
|
