Total properties:
524
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Patent #:
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Issue Dt:
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07/28/1998
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Application #:
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08778909
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Filing Dt:
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01/03/1997
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Title:
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METHOD OF MOUNTING A FLIP-CHIP
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Patent #:
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Issue Dt:
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07/14/1998
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Application #:
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08803474
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Filing Dt:
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02/20/1997
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Title:
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CLEANING SOLDER-BONDED FLIP-CHIP ASSEMBLIES
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Patent #:
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Issue Dt:
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04/27/1999
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Application #:
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08818813
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Filing Dt:
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03/14/1997
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Title:
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METHOD FOR FORMING INTEGRATED COMPOSITE SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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09/28/1999
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Application #:
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08819299
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Filing Dt:
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03/18/1997
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Title:
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SEMICONDUCTOR DIE HAVING ON-DIE DE-COUPLING CAPACITANCE
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Patent #:
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Issue Dt:
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11/02/1999
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Application #:
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08824574
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Filing Dt:
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03/26/1997
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Title:
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APPARATUS FOR VISUALLY READING SEMICONDUCTOR WAFER IDENTIFICATION INDICIA
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Patent #:
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Issue Dt:
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05/18/1999
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Application #:
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08825923
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Filing Dt:
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04/02/1997
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Title:
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FLIP CHIP METALLIZATION
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Patent #:
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Issue Dt:
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07/21/1998
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Application #:
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08826606
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Filing Dt:
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04/03/1997
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Title:
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COMPLIANT BUMP TECHNOLOGY
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Patent #:
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Issue Dt:
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11/24/1998
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Application #:
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08837530
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Filing Dt:
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04/21/1997
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Title:
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BALL GRID ARRAY PACKAGE EMPLOYING RAISED METAL CONTACT RINGS
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Patent #:
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Issue Dt:
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11/24/1998
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Application #:
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08837685
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Filing Dt:
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04/21/1997
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Title:
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BALL GRID ARRAY PACKAGE EMPLOYING SOLID CORE SOLDER BALLS
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Patent #:
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Issue Dt:
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08/28/2001
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Application #:
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08838536
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Filing Dt:
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04/09/1997
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Title:
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CIRCUIT AND METHOD FOR PROVIDING INTERCONNECTIONS AMONG INDIVIDUAL INTEGRATED CIRCUIT CHIPS IN A MULTI- CHIP MODULE
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Patent #:
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Issue Dt:
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05/02/2000
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Application #:
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08842379
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Filing Dt:
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04/23/1997
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Title:
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HIGH POWER DISSIPATING TAPE BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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11/02/1999
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Application #:
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08845696
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Filing Dt:
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04/25/1997
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Title:
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STIFFENER WITH SLOTS FOR CLIP-ON HEAT SINK ATTACHMENT
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Patent #:
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Issue Dt:
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08/17/1999
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Application #:
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08850076
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Filing Dt:
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05/02/1997
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Title:
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STIFFENER WITH INTEGRATED HEAT SINK ATTACHMENT
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Patent #:
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Issue Dt:
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01/04/2000
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Application #:
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08850292
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Filing Dt:
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05/05/1997
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Title:
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STIFFENER RING ATTACHMENT WITH HOLES AND REMOVABLE SNAP-IN HEAT SINK OR HEATSPREADER/LID
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Patent #:
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Issue Dt:
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10/26/1999
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Application #:
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08852597
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Filing Dt:
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05/07/1997
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Title:
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PBGA STIFFENER PACKAGE
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Patent #:
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Issue Dt:
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09/12/2000
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Application #:
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08853154
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Filing Dt:
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05/08/1997
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Title:
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MISREGISTRATION FIDUTIAL
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Patent #:
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Issue Dt:
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02/09/1999
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Application #:
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08854780
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Filing Dt:
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05/12/1997
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Title:
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POWDERED METAL HEAT SINK WITH INCREASED SURFACE AREA
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Patent #:
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Issue Dt:
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05/30/2000
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Application #:
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08859751
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Filing Dt:
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05/21/1997
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Title:
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FIXTURE FOR LID-ATTACHMENT FOR ENCAPSULATED PACKAGES
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Patent #:
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Issue Dt:
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11/10/1998
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Application #:
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08861884
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Filing Dt:
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05/22/1997
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Title:
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PRESERVING CLEARANCE BETWEEN ENCAPSULANT AND PCB FOR CAVITY-DOWN SINGLE-TIER PACKAGE ASSEMBLY
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Patent #:
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Issue Dt:
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05/25/1999
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Application #:
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08864994
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Filing Dt:
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05/29/1997
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Title:
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CONFORMAL DIAMOND COATING FOR THERMAL IMPROVEMENT OF ELECTRONIC PACKAGES
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Patent #:
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Issue Dt:
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06/01/1999
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Application #:
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08868316
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Filing Dt:
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06/03/1997
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Title:
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HIGH PERFORMANCE HEAT SPREADER FOR FLIP CHIP PACKAGES
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Patent #:
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Issue Dt:
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05/01/2001
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Application #:
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08869796
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Filing Dt:
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06/05/1997
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Title:
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GROOVED SEMICONDUCTOR DIE FOR FLIP-CHIP HEAT SINK ATTACHMENT
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Patent #:
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Issue Dt:
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06/30/1998
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Application #:
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08884095
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Filing Dt:
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06/27/1997
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Title:
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MOLDED ENCAPSULATED ELECTRONIC COMPONENT
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Patent #:
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Issue Dt:
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12/28/1999
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Application #:
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08903241
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Filing Dt:
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07/24/1997
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Title:
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ELECTRONIC SYSTEM INCLUDING PACKAGED INTEGRATED CIRCUITS WITH HEAT SPREADING STANDOFF SUPPORT MEMBERS
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Patent #:
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Issue Dt:
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06/08/1999
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Application #:
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08904530
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Filing Dt:
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08/01/1997
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Title:
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METHOD AND APPARATUS FOR FORMING ELECTRICAL CONNECTIONS BETWEEN A SEMICONDUCTOR DIE AND A SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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11/23/1999
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Application #:
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08908404
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Filing Dt:
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08/07/1997
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Title:
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REFRAMED CHIP-ON-TAPE DIE
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Patent #:
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Issue Dt:
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03/23/1999
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Application #:
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08909312
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Filing Dt:
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08/11/1997
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Title:
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METHOD FOR DISTRIBUTING CONNECTION PADS ON A SEMICONDUCTOR DIE
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Patent #:
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Issue Dt:
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07/04/2000
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Application #:
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08911418
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Filing Dt:
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08/14/1997
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Title:
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SYSTEM AND METHOD FOR PACKAGING AN INTEGRATED CIRCUIT USING ENCAPSULANT INJECTION
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Patent #:
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Issue Dt:
|
10/03/2000
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Application #:
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08911515
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Filing Dt:
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08/14/1997
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Title:
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INTEGRATED CIRCUIT PACKAGING APPARATUS AND METHOD
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Patent #:
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Issue Dt:
|
02/16/1999
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Application #:
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08916025
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Filing Dt:
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08/21/1997
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Title:
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PROCESS OF FABRICATING AN INTERGRATED CIRCIUIT DIE PACKAGE HAVING A PLURALITY OF PINS
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Patent #:
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Issue Dt:
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11/23/1999
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Application #:
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08918451
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Filing Dt:
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08/26/1997
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Title:
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METHOD FOR COMPENSAATING FOR BOTTOM WARPAGE OF A BGA INTEGRATED CIRCUIT
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Patent #:
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Issue Dt:
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07/27/1999
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Application #:
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08920430
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Filing Dt:
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08/29/1997
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Title:
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IMPROVED OVER MOLED PACKAGE BODY ON A SUBSTRATE
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Patent #:
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Issue Dt:
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07/28/1998
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Application #:
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08922141
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Filing Dt:
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08/29/1997
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Title:
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AN INTEGRATED CIRCUIT COMPRISING SOLDER BUMPS
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Patent #:
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Issue Dt:
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09/05/2000
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Application #:
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08927704
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Filing Dt:
|
09/10/1997
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Title:
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MOLDED ARRAY INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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08/05/2003
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Application #:
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08928826
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Filing Dt:
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09/12/1997
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Title:
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INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
|
11/10/1998
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Application #:
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08934529
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Filing Dt:
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09/22/1997
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Title:
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TAPE BALL GRID ARRAY PACKAGE WITH PERFORATED METAL STIFFENER
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Patent #:
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Issue Dt:
|
06/01/1999
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Application #:
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08935424
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Filing Dt:
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09/23/1997
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Title:
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INTEGRATED HEAT SPREADER/STIFFENER WITH APERTURES FOR SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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12/26/2000
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Application #:
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08935583
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Filing Dt:
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09/23/1997
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Title:
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DIE CLIP AND METHOD OF ASSEMBLY FOR SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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12/14/1999
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Application #:
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08935834
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Filing Dt:
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09/23/1997
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Title:
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INTEGRATED HEAT SPREADER/STIFFENER ASSEMBLY AND METHOD OF ASSEMBLY FOR SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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10/19/1999
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Application #:
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08936829
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Filing Dt:
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09/25/1997
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Title:
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A METHOD OF FABRICATING A MICROELECTRONIC PACKAGE HAVING POLYMER ESD PROTECTION
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Patent #:
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Issue Dt:
|
09/07/1999
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Application #:
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08938100
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Filing Dt:
|
09/26/1997
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|
Title:
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STIFFENER RING AND HEAT SPREADER FOR USE WITH FLIP CHIP PACKAGING ASSEMBLIES
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Patent #:
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|
Issue Dt:
|
01/27/2004
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Application #:
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08946693
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Filing Dt:
|
10/08/1997
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|
Title:
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IMPROVED AIR ISOLATED CROSSOVERS
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|
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Patent #:
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|
Issue Dt:
|
04/27/1999
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Application #:
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08946980
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Filing Dt:
|
10/08/1997
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|
Title:
|
CHIP-ON-CHIP IC PACKAGES
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|
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Patent #:
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|
Issue Dt:
|
11/02/1999
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Application #:
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08956527
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Filing Dt:
|
10/23/1997
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|
Title:
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SOLDER BONDING OF ELECTRICAL COMPONENTS
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Patent #:
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Issue Dt:
|
12/07/1999
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Application #:
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08958776
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Filing Dt:
|
10/27/1997
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|
Title:
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VACUUM ASSISTED UNDERFILL PROCESS AND APPARATUS FOR SEMICONDUCTOR PACKAGE FABRICATION
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Patent #:
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|
Issue Dt:
|
07/18/2000
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Application #:
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08960831
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Filing Dt:
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10/30/1997
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Title:
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METHOD FOR PLANARIZING AN ARRAY OF SOLDER BALLS
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Patent #:
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Issue Dt:
|
09/12/2000
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Application #:
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08963553
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Filing Dt:
|
11/03/1997
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|
Title:
|
SEMICONDUCTOR DIE METAL LAYOUT FOR FLIP CHIP PACKAGING
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Patent #:
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Issue Dt:
|
11/30/1999
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Application #:
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08971769
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Filing Dt:
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11/17/1997
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|
Title:
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METHOD AND APPARATUS FOR MAKING ELECTRICAL INTERCONNECTIONS BETWEEN LAYERS OF AN IC PACKAGE
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Patent #:
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Issue Dt:
|
03/07/2000
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Application #:
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08979063
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Filing Dt:
|
11/26/1997
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|
Title:
|
OVERCAST SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
|
03/28/2000
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Application #:
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08991867
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Filing Dt:
|
12/16/1997
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|
Title:
|
METHOD FOR TESTING INTEGRATED CIRCUITS
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|
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Patent #:
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|
Issue Dt:
|
08/29/2000
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Application #:
|
09005491
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Filing Dt:
|
01/12/1998
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|
Title:
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AN INTEGRATED CIRCUIT PACKAGE HAVING A STIFFENER DIMENSIONED TO RECEIVE HEAT TRANSFERRED LATERALLY FROM THE INTEGRATED CIRCUIT
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Patent #:
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Issue Dt:
|
04/25/2000
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Application #:
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09006584
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Filing Dt:
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01/13/1998
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|
Title:
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PROGRAMMABLE SUBSTRATE FOR ARRAY-TYPE PACKAGES
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Patent #:
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Issue Dt:
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03/21/2000
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Application #:
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09006784
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Filing Dt:
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01/14/1998
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Title:
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MULTIPLE SIZED DIE
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Patent #:
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Issue Dt:
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09/05/2000
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Application #:
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09009580
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Filing Dt:
|
01/20/1998
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Title:
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THERMALLY-ENHANCED FLIP CHIP IC PACKAGE WITH EXTRUDED HEATSPREADER
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Patent #:
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Issue Dt:
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06/13/2000
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Application #:
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09012304
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Filing Dt:
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01/23/1998
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Title:
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MCM WITH HIGH Q OVERLAPPING RESONATOR
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Patent #:
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Issue Dt:
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01/18/2000
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Application #:
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09032338
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Filing Dt:
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02/27/1998
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|
Title:
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MANUFACTURE OF FLIP-CHIP DEVICE
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Patent #:
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Issue Dt:
|
08/15/2000
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Application #:
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09045062
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Filing Dt:
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03/19/1998
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Title:
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CORROSION SENSITIVITY STRUCTURES FOR VIAS AND CONTACT HOLES IN INTEGRATED CIRCUITS
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Patent #:
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Issue Dt:
|
07/04/2000
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Application #:
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09052884
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Filing Dt:
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03/31/1998
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Title:
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REMOVING SOLDER FROM INTEGRATED CIRCUITS FOR FAILURE ANALYSIS
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|
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Patent #:
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|
Issue Dt:
|
10/02/2001
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Application #:
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09053357
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Filing Dt:
|
04/01/1998
|
|
Title:
|
BONDABLE ANODIZED ALUMINUM HEATSPREADER FOR SEMICONDUCTOR PACKAGES
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Patent #:
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|
Issue Dt:
|
09/26/2000
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Application #:
|
09058505
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Filing Dt:
|
04/10/1998
|
|
Title:
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BALL GRID ARRAY SEMICONDUCTOR PACKAGE HAVING IMPORVED EMI CHARACTERISTICS
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|
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Patent #:
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|
Issue Dt:
|
05/11/1999
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Application #:
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09070671
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Filing Dt:
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04/30/1998
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|
Title:
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SEMICONDUCTOR PACKAGE HAVING CAPACITIVE EXTENSION SPOKES AND METHOD FOR MAKING THE SAME
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|
|
|
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Patent #:
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|
Issue Dt:
|
11/16/1999
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Application #:
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09072369
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Filing Dt:
|
05/04/1998
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|
Title:
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BOND PAD DESIGN FOR INTEGRATED CIRCUITS
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Patent #:
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Issue Dt:
|
05/02/2000
|
Application #:
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09073279
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Filing Dt:
|
05/06/1998
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|
Title:
|
PRESSURE CONTROLLED ALIGNMENT FIXTURE
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Patent #:
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Issue Dt:
|
09/12/2000
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Application #:
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09075300
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Filing Dt:
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05/08/1998
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Title:
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APPARATUS AND METHOD FOR TESTING A FLIP CHIP INTEGRATED CIRCUIT PACKAGE ADHESIVE LAYER
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|
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Patent #:
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Issue Dt:
|
05/30/2000
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Application #:
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09078093
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Filing Dt:
|
05/13/1998
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Title:
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APPARATUS AND METHOD FOR SEPARATING A STIFFENER MEMBER FROM A FLIP CHIP INTEGRATED CIRCUIT PACKAGE SUBSTRATE
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Patent #:
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Issue Dt:
|
04/09/2002
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Application #:
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09081448
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Filing Dt:
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05/19/1998
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Title:
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PACKAGING SILICON ON SILICON MULTICHIP MODULES
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Patent #:
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Issue Dt:
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11/07/2000
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Application #:
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09097882
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Filing Dt:
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06/15/1998
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Title:
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ELECTROSTATIC PROTECTED SUBSTRATE
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Patent #:
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Issue Dt:
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12/14/1999
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Application #:
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09097883
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Filing Dt:
|
06/15/1998
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Title:
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THERMALLY ENHANCED TAPE BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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05/16/2000
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Application #:
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09100665
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Filing Dt:
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06/19/1998
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Title:
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DEVICE AND METHOD FOR REMOVING HEATSPREADER FROM AN INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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08/29/2000
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Application #:
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09103291
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Filing Dt:
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06/23/1998
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Title:
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ELECTROPLATING FIXTURE FOR HIGH DENSITY SUBSTRATES
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|
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Patent #:
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Issue Dt:
|
11/09/1999
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Application #:
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09104838
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Filing Dt:
|
06/25/1998
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|
Title:
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PROCESS FOR USING A REMOVEABLE PLATING BUS LAYER FOR HIGH DENSITY SUBSTRATES
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Patent #:
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Issue Dt:
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11/28/2000
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Application #:
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09120148
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Filing Dt:
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07/21/1998
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Title:
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RECESSED FLIP-CHIP PACKAGE
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Patent #:
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Issue Dt:
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08/10/1999
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Application #:
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09123370
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Filing Dt:
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07/27/1998
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Title:
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TEXT FIXTURE RETAINER FOR AN INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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06/05/2001
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Application #:
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09127486
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Filing Dt:
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07/31/1998
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Title:
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UNIVERSAL I/O PAD STRUCTURE FOR IN-LINE OR STAGGERED WIRE BONDING OR ARRAYED FLIP-CHIP ASSEMBLY
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Patent #:
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Issue Dt:
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02/22/2000
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Application #:
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09133606
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Filing Dt:
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08/13/1998
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Title:
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ELECTRONIC ASSEMBLY HAVING IMPROVED RESISTANCE TO DELAMINATION
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Patent #:
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Issue Dt:
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01/30/2001
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Application #:
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09135969
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Filing Dt:
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08/18/1998
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Title:
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ARRANGEMENT FOR REDUCING BENDING STRESS IN AN ELECTRONICS PACKAGE
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Patent #:
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Issue Dt:
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04/04/2006
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Application #:
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09138146
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Filing Dt:
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08/21/1998
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Title:
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INTEGRATED CIRCUIT CARRIER AND METHOD OF MANUFACTURING AND INTERGRATED CIRCUIT
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Patent #:
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Issue Dt:
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07/17/2001
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Application #:
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09143083
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Filing Dt:
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08/28/1998
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Title:
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BACKSIDE FAILURE ANALYSIS CAPABLE INTEGRATED CIRCUIT PACKAGING
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Patent #:
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Issue Dt:
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01/16/2001
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Application #:
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09149803
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Filing Dt:
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09/08/1998
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Title:
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INTERPOSER FOR RECESSED FLIP-CHIP PACKAGE
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Patent #:
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Issue Dt:
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12/12/2000
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Application #:
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09149804
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Filing Dt:
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09/08/1998
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Title:
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TRANSLATOR FOR RECESSED FLIP-CHIP PACKAGE
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Patent #:
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Issue Dt:
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07/11/2000
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Application #:
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09162247
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Filing Dt:
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09/28/1998
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Title:
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BOND PAD FOR A FLIP-CHIP PACKAGE, AND METHOD OF FORMING THE SAME
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Patent #:
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Issue Dt:
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03/28/2000
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Application #:
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09168638
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Filing Dt:
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10/08/1998
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Title:
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METHOD AND APPARATUS FOR DETECTING A SOLDER BRIDGE IN A BALL GRID ARRAY
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Patent #:
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Issue Dt:
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09/21/1999
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Application #:
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09169117
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Filing Dt:
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10/08/1998
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Title:
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METHOD AND APPARATUS FOR DETECTING A SOLDER BRIDGE IN A BALL GRID ARRAY
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Patent #:
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Issue Dt:
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10/10/2000
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Application #:
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09172467
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Filing Dt:
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10/14/1998
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Title:
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FLIP CHIP METALLIZATION
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Patent #:
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Issue Dt:
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08/29/2000
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Application #:
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09173502
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Filing Dt:
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10/16/1998
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Title:
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ARTICLE COMPRISING MOLDED CIRCUIT
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Patent #:
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Issue Dt:
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10/12/1999
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Application #:
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09187885
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Filing Dt:
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11/06/1998
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Title:
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ARTICLE COMPRISING FINE-GRAINED SOLDER COMPOSITIONS WITH DISPERSOID PARTICLES
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Patent #:
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Issue Dt:
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09/12/2000
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Application #:
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09193832
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Filing Dt:
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11/17/1998
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Title:
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HEATSPREADER FOR A FLIP CHIP DEVICE, AND METHOD FOR CONNECTING THE HEATSPREADER
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Patent #:
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Issue Dt:
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01/29/2002
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Application #:
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09197074
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Filing Dt:
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11/20/1998
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|
Title:
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KINETICALLY CONTROLLED SOLDER BONDING
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|
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Patent #:
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Issue Dt:
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11/21/2000
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Application #:
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09212366
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Filing Dt:
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12/15/1998
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Title:
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COPPER CONTAMINATION CONTROL OF IN-LINE PROBE INSTRUMENTS
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|
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Patent #:
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Issue Dt:
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11/14/2000
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Application #:
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09221726
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Filing Dt:
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12/29/1998
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Title:
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MEASUREMENT OF MECHANICAL FASTENER CLAMPING FORCE
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|
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Patent #:
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Issue Dt:
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02/20/2001
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Application #:
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09235011
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Filing Dt:
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01/21/1999
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Title:
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FLIP CHIP ASSEMBLY OF SEMICONDUCTOR IC CHIPS
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|
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Patent #:
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Issue Dt:
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01/23/2001
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Application #:
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09235795
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Filing Dt:
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01/22/1999
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Title:
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ELECTRONIC APPARATUS
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|
|
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Patent #:
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Issue Dt:
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06/13/2000
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Application #:
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09238706
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Filing Dt:
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01/28/1999
|
|
Title:
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INTEGRATED CIRCUIT BONDING METHOD AND APPARATUS
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|
|
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Patent #:
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Issue Dt:
|
05/30/2000
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Application #:
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09244857
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Filing Dt:
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02/05/1999
|
|
Title:
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DEVICE AND METHOD FOR PROTECTING ELECTRONIC COMPONENT
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|
|
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Patent #:
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Issue Dt:
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05/15/2001
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Application #:
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09256443
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Filing Dt:
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02/23/1999
|
|
Title:
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FLIP CHIP BUMP BONDING
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|
|
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Patent #:
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Issue Dt:
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05/15/2001
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Application #:
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09261093
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Filing Dt:
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03/02/1999
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|
Title:
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FABRICATING HIGH-Q RF COMPONENTS
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|
|
|
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Patent #:
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|
Issue Dt:
|
11/28/2000
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Application #:
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09263075
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Filing Dt:
|
03/08/1999
|
|
Title:
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INTEGRATED CIRCUIT HAVING REDUCED PROBABILITY OF WIRE-BOND FAILURE
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|
|
|
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Patent #:
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Issue Dt:
|
10/24/2000
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Application #:
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09288746
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Filing Dt:
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04/08/1999
|
|
Title:
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METHOD OF MANUFACTURE FOR AN INTEGRATED CIRCUIT HAVING A BIST CIRCUIT AND BOND PADS INCORPORATED THEREIN
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|
|
|
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Patent #:
|
|
Issue Dt:
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10/31/2000
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Application #:
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09305732
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Filing Dt:
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05/05/1999
|
|
Title:
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POWER AND GROUND AND SIGNAL LAYOUT FOR HIGHER DENSITY INTEGRATED CIRCUIT CONNECTIONS WITH FLIP-CHIP BONDING
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|
|
|
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Patent #:
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Issue Dt:
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03/27/2001
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Application #:
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09305766
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Filing Dt:
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05/05/1999
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Title:
|
BOND PAD DESIGN FOR INTEGRATED CIRCUITS
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|
