Patent Assignment Details
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Reel/Frame: | 044501/0767 | |
| Pages: | 4 |
| | Recorded: | 12/28/2017 | | |
Attorney Dkt #: | XRPS920170123-US-NP |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/23/2018
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Application #:
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15857129
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Filing Dt:
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12/28/2017
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Title:
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MOUNTING ELECTRONIC DEVICE TO THERMALLY CONDUCTIVE PAD OF LIQUID-COOLING MECHANISM IN TRANSLATIONAL MOVEMENT-MINIMIZING MANNER
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Assignee
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151 LORONG CHUAN, #02-07 |
NEW TECH PARK, SINGAPORE 556741 |
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Correspondence name and address
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LAW OFFICES (LENOVO)
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24 ROY ST., #447
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SEATTLE, WA 98109
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