Patent Assignment Details
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| Reel/Frame: | 027198/0772 | |
| Pages: | 4 |
| | Recorded: | 11/09/2011 | | |
| Attorney Dkt #: | TSM11-0792 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE SERIAL NUMBER BEING ASSIGNED PREVIOUSLY RECORDED ON REEL 027179 FRAME 0500. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNORS' INTEREST TO TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY. |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/18/2014
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Application #:
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13276184
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Filing Dt:
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10/18/2011
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Publication #:
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Pub Dt:
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04/18/2013
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Title:
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METHOD AND APPARATUS FOR DIE ASSEMBLY
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Assignee
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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SLATER & MATSIL, L.L.P.
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17950 PRESTON ROAD
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SUITE 1000
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DALLAS, TX 75252
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