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Reel/Frame:020875/0816   Pages: 4
Recorded: 04/30/2008
Attorney Dkt #:YOR920060309US1
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/17/2012
Application #:
11669076
Filing Dt:
01/30/2007
Publication #:
Pub Dt:
07/31/2008
Title:
MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL VOID FORMATION IN SOLDER JOINTS
Assignors
1
Exec Dt:
08/20/2007
2
Exec Dt:
08/17/2007
3
Exec Dt:
08/20/2007
4
Exec Dt:
08/20/2007
Assignee
1
NORTH CASTLE DRIVE
ARMONK, NEW YORK 10504
Correspondence name and address
DAVID AKER
23 SOUTHERN ROAD
HARTSDALE, NY 10530

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