Patent Assignment Details
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Reel/Frame: | 004358/0862 | |
| Pages: | 1 |
| | Recorded: | 01/17/1985 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/25/1986
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Application #:
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06692088
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Filing Dt:
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01/17/1985
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Title:
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METHOD OF MAKING INTEGRATED CIRCUIT SILICON DIE COMPOSITE HAVING HOT MELT ADHESIVE ON ITS SILICON BASE
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Assignee
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A CORP OF NY |
MT. VERNON, INDIANA 47620 |
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Correspondence name and address
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GENERAL ELECTRIC COMPANY
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CRD PATENT DOCKET RM 4A59
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BLDG. K-1-SALAMONE
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P. O. BOX 8
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SCHENECTADY, NY 12301
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