Patent Assignment Details
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| Reel/Frame: | 008513/0870 | |
| Pages: | 4 |
| | Recorded: | 04/28/1997 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/02/1997
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Application #:
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08496722
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Filing Dt:
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06/29/1995
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Title:
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METHOD TO THERMALLY FORM HEMISPHERICAL GRAIN (HSG) SILICON TO ENHANCE CAPACITANCE FOR APPLICATION IN HIGH DENSITY DRAMS
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Assignee
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| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83706 |
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Correspondence name and address
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MICRON TECHNOLOGY, INC.
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DAVID J. PAUL
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8000 S. FEDERAL WAY
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PATENT DEPT., MAIL STOP 525
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BOISE, ID 83706-9632
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