Patent Assignment Details
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| Reel/Frame: | 059124/0873 | |
| Pages: | 10 |
| | Recorded: | 03/01/2022 | | |
| Attorney Dkt #: | HFCP0033USA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17683382
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Filing Dt:
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03/01/2022
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Publication #:
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Pub Dt:
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09/07/2023
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Title:
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SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
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Assignee
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| ROOM 3A, 12TH FLOOR, KAISER CENTRE, NO.18 CENTRE STREET |
| SAI YING PUN, HONG KONG |
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Correspondence name and address
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WINSTON HSU
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5F., NO.389, FUHE RD., YONGHE DIST.,
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NEW TAIPEI CITY, TAIWAN
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