Total properties:
242
Page
3
of
3
Pages:
1 2 3
|
|
Patent #:
|
|
Issue Dt:
|
08/09/2022
|
Application #:
|
16681044
|
Filing Dt:
|
11/12/2019
|
Title:
|
PASSIVATION STRUCTURE FOR SEMICONDUCTOR DEVICES
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
16750358
|
Filing Dt:
|
01/23/2020
|
Publication #:
|
|
Pub Dt:
|
11/19/2020
| | | | |
Title:
|
NONDESTRUCTIVE CHARACTERIZATION FOR CRYSTALLINE WAFERS
|
|
|
Patent #:
|
|
Issue Dt:
|
12/06/2022
|
Application #:
|
16775407
|
Filing Dt:
|
01/29/2020
|
Publication #:
|
|
Pub Dt:
|
07/29/2021
| | | | |
Title:
|
DISLOCATION DISTRIBUTION FOR SILICON CARBIDE CRYSTALLINE MATERIALS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/15/2021
|
Application #:
|
16784311
|
Filing Dt:
|
02/07/2020
|
Publication #:
|
|
Pub Dt:
|
11/19/2020
| | | | |
Title:
|
SILICON CARBIDE WAFERS WITH RELAXED POSITIVE BOW AND RELATED METHODS
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
16784857
|
Filing Dt:
|
02/07/2020
|
Publication #:
|
|
Pub Dt:
|
06/04/2020
| | | | |
Title:
|
HIGH SPEED, EFFICIENT SIC POWER MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/11/2022
|
Application #:
|
16792261
|
Filing Dt:
|
02/16/2020
|
Title:
|
LASER-ASSISTED METHOD FOR PARTING CRYSTALLINE MATERIAL
|
|
|
Patent #:
|
|
Issue Dt:
|
08/16/2022
|
Application #:
|
16801260
|
Filing Dt:
|
02/26/2020
|
Publication #:
|
|
Pub Dt:
|
06/18/2020
| | | | |
Title:
|
VERTICAL SEMICONDUCTOR DEVICE WITH IMPROVED RUGGEDNESS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/14/2022
|
Application #:
|
16804776
|
Filing Dt:
|
02/28/2020
|
Publication #:
|
|
Pub Dt:
|
09/02/2021
| | | | |
Title:
|
ALIGNMENT FOR WAFER IMAGES
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
16806489
|
Filing Dt:
|
03/02/2020
|
Publication #:
|
|
Pub Dt:
|
09/02/2021
| | | | |
Title:
|
SEMICONDUCTOR DIE HAVING A DRIFT REGION WITH A CHARGE COMPENSATION REGION FORMED THEREIN WHERE THE CHARGE COMPENSATION REGION HAS A PLURALITY OF GUARD RINGS FORMED IN FIRST AND SECOND OPPOSITE DOPING TYPE PORTIONS
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
16832918
|
Filing Dt:
|
03/27/2020
|
Publication #:
|
|
Pub Dt:
|
09/30/2021
| | | | |
Title:
|
POWER SEMICONDUCTOR PACKAGE WITH IMPROVED PERFORMANCE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/30/2024
|
Application #:
|
16851197
|
Filing Dt:
|
04/17/2020
|
Publication #:
|
|
Pub Dt:
|
07/30/2020
| | | | |
Title:
|
HIGH SPEED, EFFICIENT SIC POWER MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/22/2022
|
Application #:
|
16889981
|
Filing Dt:
|
06/02/2020
|
Publication #:
|
|
Pub Dt:
|
12/02/2021
| | | | |
Title:
|
CONTACT STRUCTURES FOR SEMICONDUCTOR DEVICES
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
16907163
|
Filing Dt:
|
06/19/2020
|
Publication #:
|
|
Pub Dt:
|
12/23/2021
| | | | |
Title:
|
POWER DEVICES WITH A HYBRID GATE STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/28/2023
|
Application #:
|
16909299
|
Filing Dt:
|
06/23/2020
|
Publication #:
|
|
Pub Dt:
|
10/08/2020
| | | | |
Title:
|
LASER-ASSISTED METHOD FOR PARTING CRYSTALLINE MATERIAL
|
|
|
Patent #:
|
|
Issue Dt:
|
12/21/2021
|
Application #:
|
16936552
|
Filing Dt:
|
07/23/2020
|
Publication #:
|
|
Pub Dt:
|
11/12/2020
| | | | |
Title:
|
HIGH VOLTAGE POWER MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/22/2023
|
Application #:
|
16937857
|
Filing Dt:
|
07/24/2020
|
Publication #:
|
|
Pub Dt:
|
10/07/2021
| | | | |
Title:
|
POWER MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/01/2022
|
Application #:
|
16938032
|
Filing Dt:
|
07/24/2020
|
Publication #:
|
|
Pub Dt:
|
11/19/2020
| | | | |
Title:
|
VERTICAL SEMICONDUCTOR DEVICE WITH IMPROVED RUGGEDNESS
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
16942082
|
Filing Dt:
|
07/29/2020
|
Publication #:
|
|
Pub Dt:
|
02/03/2022
| | | | |
Title:
|
SHIELDING ARRANGEMENTS FOR TRANSFORMER STRUCTURES
|
|
|
Patent #:
|
|
Issue Dt:
|
03/07/2023
|
Application #:
|
17031365
|
Filing Dt:
|
09/24/2020
|
Publication #:
|
|
Pub Dt:
|
03/24/2022
| | | | |
Title:
|
EDGE TERMINATION STRUCTURES FOR SEMICONDUCTOR DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
04/09/2024
|
Application #:
|
17080062
|
Filing Dt:
|
10/26/2020
|
Title:
|
VERTICAL POWER TRANSISTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
02/21/2023
|
Application #:
|
17083712
|
Filing Dt:
|
10/29/2020
|
Publication #:
|
|
Pub Dt:
|
02/11/2021
| | | | |
Title:
|
SEMICONDUCTOR DIE WITH IMPROVED RUGGEDNESS
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17087740
|
Filing Dt:
|
11/03/2020
|
Publication #:
|
|
Pub Dt:
|
05/05/2022
| | | | |
Title:
|
PROTECTION STRUCTURES FOR SEMICONDUCTOR DEVICES WITH SENSOR ARRANGEMENTS
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17088686
|
Filing Dt:
|
11/04/2020
|
Publication #:
|
|
Pub Dt:
|
05/05/2022
| | | | |
Title:
|
PASSIVATION STRUCTURES FOR SEMICONDUCTOR DEVICES HAVING PATTERNED STRUCTURES OVER EDGE TERMINATION REGIONS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/26/2023
|
Application #:
|
17110027
|
Filing Dt:
|
12/02/2020
|
Publication #:
|
|
Pub Dt:
|
06/02/2022
| | | | |
Title:
|
POWER TRANSISTOR WITH SOFT RECOVERY BODY DIODE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/30/2023
|
Application #:
|
17115359
|
Filing Dt:
|
12/08/2020
|
Publication #:
|
|
Pub Dt:
|
06/09/2022
| | | | |
Title:
|
SEMICONDUCTOR DEVICES FOR IMPROVED MEASUREMENTS AND RELATED METHODS
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17121863
|
Filing Dt:
|
12/15/2020
|
Publication #:
|
|
Pub Dt:
|
06/16/2022
| | | | |
Title:
|
LARGE DIMENSION SILICON CARBIDE SINGLE CRYSTALLINE MATERIALS WITH REDUCED CRYSTALLOGRAPHIC STRESS
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17124810
|
Filing Dt:
|
12/17/2020
|
Publication #:
|
|
Pub Dt:
|
07/01/2021
| | | | |
Title:
|
LARGE DIAMETER SILICON CARBIDE WAFERS
|
|
|
Patent #:
|
|
Issue Dt:
|
01/09/2024
|
Application #:
|
17177641
|
Filing Dt:
|
02/17/2021
|
Publication #:
|
|
Pub Dt:
|
08/18/2022
| | | | |
Title:
|
POWER SEMICONDUCTOR DEVICE WITH REDUCED STRAIN
|
|
|
Patent #:
|
|
Issue Dt:
|
01/31/2023
|
Application #:
|
17178435
|
Filing Dt:
|
02/18/2021
|
Publication #:
|
|
Pub Dt:
|
08/18/2022
| | | | |
Title:
|
INTEGRATED POWER MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/23/2023
|
Application #:
|
17178532
|
Filing Dt:
|
02/18/2021
|
Publication #:
|
|
Pub Dt:
|
06/10/2021
| | | | |
Title:
|
SILICON CARBIDE WAFERS WITH RELAXED POSITIVE BOW AND RELATED METHODS
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17201468
|
Filing Dt:
|
03/15/2021
|
Publication #:
|
|
Pub Dt:
|
07/01/2021
| | | | |
Title:
|
WIDE BANDGAP SEMICONDUCTOR DEVICE WITH SENSOR ELEMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
05/21/2024
|
Application #:
|
17208271
|
Filing Dt:
|
03/22/2021
|
Publication #:
|
|
Pub Dt:
|
06/02/2022
| | | | |
Title:
|
POWER TRANSISTOR WITH SOFT RECOVERY BODY DIODE
|
|
|
Patent #:
|
|
Issue Dt:
|
02/13/2024
|
Application #:
|
17225384
|
Filing Dt:
|
04/08/2021
|
Publication #:
|
|
Pub Dt:
|
07/22/2021
| | | | |
Title:
|
CARRIER-ASSISTED METHOD FOR PARTING CRYSTALLINE MATERIAL ALONG LASER DAMAGE REGION
|
|
|
Patent #:
|
|
Issue Dt:
|
08/08/2023
|
Application #:
|
17239418
|
Filing Dt:
|
04/23/2021
|
Publication #:
|
|
Pub Dt:
|
10/07/2021
| | | | |
Title:
|
POWER MODULE
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17350100
|
Filing Dt:
|
06/17/2021
|
Publication #:
|
|
Pub Dt:
|
12/22/2022
| | | | |
Title:
|
REDUCED OPTICAL ABSORPTION FOR SILICON CARBIDE CRYSTALLINE MATERIALS
|
|
|
Patent #:
|
|
Issue Dt:
|
01/30/2024
|
Application #:
|
17352965
|
Filing Dt:
|
06/21/2021
|
Publication #:
|
|
Pub Dt:
|
10/07/2021
| | | | |
Title:
|
PACKAGE FOR POWER ELECTRONICS
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17357103
|
Filing Dt:
|
06/24/2021
|
Publication #:
|
|
Pub Dt:
|
12/29/2022
| | | | |
Title:
|
POWER SEMICONDUCTOR DIE HAVING A COMBINATION OF ACTIVE AREA AND TERMINATION REGION AREA BEING LESS THAN 90% OF TOTAL DIE AREA
|
|
|
Patent #:
|
|
Issue Dt:
|
05/14/2024
|
Application #:
|
17459497
|
Filing Dt:
|
08/27/2021
|
Publication #:
|
|
Pub Dt:
|
03/02/2023
| | | | |
Title:
|
ARRANGEMENTS OF POWER SEMICONDUCTOR DEVICES FOR IMPROVED THERMAL PERFORMANCE
|
|
|
Patent #:
|
|
Issue Dt:
|
02/06/2024
|
Application #:
|
17482019
|
Filing Dt:
|
09/22/2021
|
Publication #:
|
|
Pub Dt:
|
03/23/2023
| | | | |
Title:
|
VERTICAL POWER DEVICES FABRICATED USING IMPLANTED METHODS
|
|
|
Patent #:
|
|
Issue Dt:
|
02/02/2021
|
Application #:
|
29663502
|
Filing Dt:
|
09/17/2018
|
Title:
|
POWER MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/26/2021
|
Application #:
|
29663505
|
Filing Dt:
|
09/17/2018
|
Title:
|
POWER MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/30/2021
|
Application #:
|
29730568
|
Filing Dt:
|
04/06/2020
|
Title:
|
POWER SEMICONDUCTOR PACKAGE
|
|