Patent Assignment Details
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| Reel/Frame: | 006168/0910 | |
| Pages: | 3 |
| | Recorded: | 06/26/1992 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/07/1995
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Application #:
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07904729
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Filing Dt:
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06/26/1992
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Title:
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METHOD FOR CONTROLLING SILICON ETCH DEPTH
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Assignee
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| A CORPORATION OF NEW YORK |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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BLANEY HARPER
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INTELLECTUAL PROPERTY LAW DEPARTMENT
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IBM CORP.
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P.O. BOX 218
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YORKTOWN HEIGHTS, NY 10598
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