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Reel/Frame:039428/0928   Pages: 6
Recorded: 07/22/2016
Attorney Dkt #:70027
Conveyance: CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Total properties: 51
1
Patent #:
9084377
Issue Dt:
07/14/2015
Application #:
11694913
Filing Dt:
03/30/2007
Publication #:
US20080235941
Pub Dt:
10/02/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTING FEATURES FOR CLEARANCE
2
Patent #:
9202776
Issue Dt:
12/01/2015
Application #:
11754603
Filing Dt:
05/29/2007
Publication #:
US20070278643
Pub Dt:
12/06/2007
Title:
STACKABLE MULTI-CHIP PACKAGE SYSTEM
3
Patent #:
9059074
Issue Dt:
06/16/2015
Application #:
12055526
Filing Dt:
03/26/2008
Publication #:
US20090243082
Pub Dt:
10/01/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PLANAR INTERCONNECT
4
Patent #:
9236319
Issue Dt:
01/12/2016
Application #:
12056402
Filing Dt:
03/27/2008
Publication #:
US20090243072
Pub Dt:
10/01/2009
Title:
STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM
5
Patent #:
9202777
Issue Dt:
12/01/2015
Application #:
12131037
Filing Dt:
05/30/2008
Publication #:
US20090294935
Pub Dt:
12/03/2009
Title:
SEMICONDUCTOR PACKAGE SYSTEM WITH CUT MULTIPLE LEAD PADS
6
Patent #:
9177898
Issue Dt:
11/03/2015
Application #:
12146192
Filing Dt:
06/25/2008
Publication #:
US20090321913
Pub Dt:
12/31/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LOCKING TERMINAL
7
Patent #:
9293350
Issue Dt:
03/22/2016
Application #:
12260089
Filing Dt:
10/28/2008
Publication #:
US20100102458
Pub Dt:
04/29/2010
Title:
SEMICONDUCTOR PACKAGE SYSTEM WITH CAVITY SUBSTRATE AND MANUFACTURING METHOD THEREFOR
8
Patent #:
9076737
Issue Dt:
07/07/2015
Application #:
12487925
Filing Dt:
06/19/2009
Publication #:
US20100320589
Pub Dt:
12/23/2010
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BUMPS AND METHOD OF MANUFACTURE THEREOF
9
Patent #:
9093391
Issue Dt:
07/28/2015
Application #:
12561897
Filing Dt:
09/17/2009
Publication #:
US20110062602
Pub Dt:
03/17/2011
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FAN-IN PACKAGE AND METHOD OF MANUFACTURE THEREOF
10
Patent #:
9355939
Issue Dt:
05/31/2016
Application #:
12716269
Filing Dt:
03/02/2010
Publication #:
US20110215448
Pub Dt:
09/08/2011
Title:
INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM WITH SHIELDING AND METHOD OF MANUFACTURE THEREOF
11
Patent #:
9093364
Issue Dt:
07/28/2015
Application #:
13166438
Filing Dt:
06/22/2011
Publication #:
US20120326281
Pub Dt:
12/27/2012
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EXPOSED VERTICAL INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF
12
Patent #:
9324673
Issue Dt:
04/26/2016
Application #:
13167649
Filing Dt:
06/23/2011
Publication #:
US20120326286
Pub Dt:
12/27/2012
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WAFER LEVEL RECONFIGURATION AND METHOD OF MANUFACTURE THEREOF
13
Patent #:
9059151
Issue Dt:
06/16/2015
Application #:
13187505
Filing Dt:
07/20/2011
Publication #:
US20120018865
Pub Dt:
01/26/2012
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ISLAND TERMINALS AND EMBEDDED PADDLE AND METHOD OF MANUFACTURE THEREOF
14
Patent #:
9054098
Issue Dt:
06/09/2015
Application #:
13221894
Filing Dt:
08/30/2011
Publication #:
US20130049208
Pub Dt:
02/28/2013
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH REDISTRIBUTION LAYER AND METHOD OF MANUFACTURE THEREOF
15
Patent #:
9236278
Issue Dt:
01/12/2016
Application #:
13242306
Filing Dt:
09/23/2011
Publication #:
US20130075922
Pub Dt:
03/28/2013
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A SUBSTRATE EMBEDDED DUMMY-DIE PADDLE AND METHOD OF MANUFACTURE THEREOF
16
Patent #:
9202715
Issue Dt:
12/01/2015
Application #:
13298267
Filing Dt:
11/16/2011
Publication #:
US20120119360
Pub Dt:
05/17/2012
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONNECTION STRUCTURE AND METHOD OF MANUFACTURE THEREOF
17
Patent #:
9219029
Issue Dt:
12/22/2015
Application #:
13326806
Filing Dt:
12/15/2011
Publication #:
US20130154119
Pub Dt:
06/20/2013
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TERMINALS AND METHOD OF MANUFACTURE THEREOF
18
Patent #:
9059108
Issue Dt:
06/16/2015
Application #:
13407554
Filing Dt:
02/28/2012
Publication #:
US20130221543
Pub Dt:
08/29/2013
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS
19
Patent #:
9312194
Issue Dt:
04/12/2016
Application #:
13424968
Filing Dt:
03/20/2012
Publication #:
US20130249077
Pub Dt:
09/26/2013
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TERMINALS AND METHOD OF MANUFACTURE THEREOF
20
Patent #:
9324641
Issue Dt:
04/26/2016
Application #:
13425286
Filing Dt:
03/20/2012
Publication #:
US20130249068
Pub Dt:
09/26/2013
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EXTERNAL INTERCONNECT AND METHOD OF MANUFACTURE THEREOF
21
Patent #:
9257384
Issue Dt:
02/09/2016
Application #:
13488812
Filing Dt:
06/05/2012
Publication #:
US20130320566
Pub Dt:
12/05/2013
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
22
Patent #:
9142481
Issue Dt:
09/22/2015
Application #:
13489282
Filing Dt:
06/05/2012
Publication #:
US20130322023
Pub Dt:
12/05/2013
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEATSINK CAP AND METHOD OF MANUFACTURE THEREOF
23
Patent #:
9184122
Issue Dt:
11/10/2015
Application #:
13489850
Filing Dt:
06/06/2012
Publication #:
US20130328216
Pub Dt:
12/12/2013
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF MANUFACTURE THEREOF
24
Patent #:
9293351
Issue Dt:
03/22/2016
Application #:
13526802
Filing Dt:
06/19/2012
Publication #:
US20130099367
Pub Dt:
04/25/2013
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PLANARITY CONTROL AND METHOD OF MANUFACTURE THEREOF
25
Patent #:
9324584
Issue Dt:
04/26/2016
Application #:
13714865
Filing Dt:
12/14/2012
Publication #:
US20140167236
Pub Dt:
06/19/2014
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TRANSFERABLE TRACE LEAD FRAME
26
Patent #:
9054084
Issue Dt:
06/09/2015
Application #:
13716479
Filing Dt:
12/17/2012
Publication #:
US20130127061
Pub Dt:
05/23/2013
Title:
INTEGRATED CIRCUIT HAVING STAGGERED BOND PADS AND I/O CELLS
27
Patent #:
9053953
Issue Dt:
06/09/2015
Application #:
13842305
Filing Dt:
03/15/2013
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDERFILL AND METHOD OF MANUFACTURE THEREOF
28
Patent #:
9059157
Issue Dt:
06/16/2015
Application #:
13842582
Filing Dt:
03/15/2013
Publication #:
US20130320525
Pub Dt:
12/05/2013
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
29
Patent #:
9123733
Issue Dt:
09/01/2015
Application #:
13844160
Filing Dt:
03/15/2013
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE UNDERFILL AND METHOD OF MANUFACTURE THEREOF
30
Patent #:
9190349
Issue Dt:
11/17/2015
Application #:
13930261
Filing Dt:
06/28/2013
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADFRAME AND METHOD OF MANUFACTURE THEREOF
31
Patent #:
9177897
Issue Dt:
11/03/2015
Application #:
13930319
Filing Dt:
06/28/2013
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TRACE PROTECTION LAYER AND METHOD OF MANUFACTURE THEREOF
32
Patent #:
9123712
Issue Dt:
09/01/2015
Application #:
13949432
Filing Dt:
07/24/2013
Title:
LEADFRAME SYSTEM WITH WARP CONTROL MECHANISM AND METHOD OF MANUFACTURE THEREOF
33
Patent #:
9082887
Issue Dt:
07/14/2015
Application #:
13966259
Filing Dt:
08/13/2013
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POSTS AND METHOD OF MANUFACTURE THEREOF
34
Patent #:
9299650
Issue Dt:
03/29/2016
Application #:
14037274
Filing Dt:
09/25/2013
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SINGLE METAL LAYER INTERPOSER AND METHOD OF MANUFACTURE THEREOF
35
Patent #:
9076802
Issue Dt:
07/07/2015
Application #:
14037320
Filing Dt:
09/25/2013
Title:
DUAL-SIDED FILM-ASSIST MOLDING PROCESS
36
Patent #:
9048228
Issue Dt:
06/02/2015
Application #:
14037838
Filing Dt:
09/26/2013
Publication #:
US20150084172
Pub Dt:
03/26/2015
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SIDE SOLDERABLE LEADS AND METHOD OF MANUFACTURE THEREOF
37
Patent #:
9076724
Issue Dt:
07/07/2015
Application #:
14038275
Filing Dt:
09/26/2013
Title:
INTEGRATED CIRCUIT SYSTEM WITH DEBONDING ADHESIVE AND METHOD OF MANUFACTURE THEREOF
38
Patent #:
9184067
Issue Dt:
11/10/2015
Application #:
14039276
Filing Dt:
09/27/2013
Title:
METHODS OF MITIGATING DEFECTS FOR SEMICONDUCTOR PACKAGES
39
Patent #:
9281274
Issue Dt:
03/08/2016
Application #:
14040413
Filing Dt:
09/27/2013
Title:
INTEGRATED CIRCUIT THROUGH-SUBSTRATE VIA SYSTEM WITH A BUFFER LAYER AND METHOD OF MANUFACTURE THEREOF
40
Patent #:
9210816
Issue Dt:
12/08/2015
Application #:
14132539
Filing Dt:
12/18/2013
Title:
METHOD OF MANUFACTURE OF SUPPORT SYSTEM WITH FINE PITCH
41
Patent #:
9147662
Issue Dt:
09/29/2015
Application #:
14137755
Filing Dt:
12/20/2013
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FIBER-LESS SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
42
Patent #:
9202793
Issue Dt:
12/01/2015
Application #:
14140829
Filing Dt:
12/26/2013
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDER BUMP METALLIZATION AND METHOD OF MANUFACTURE THEREOF
43
Patent #:
9202742
Issue Dt:
12/01/2015
Application #:
14156271
Filing Dt:
01/15/2014
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PATTERN-THROUGH-MOLD AND METHOD OF MANUFACTURE THEREOF
44
Patent #:
9142530
Issue Dt:
09/22/2015
Application #:
14214765
Filing Dt:
03/15/2014
Publication #:
US20140284791
Pub Dt:
09/25/2014
Title:
CORELESS INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF
45
Patent #:
9331003
Issue Dt:
05/03/2016
Application #:
14229538
Filing Dt:
03/28/2014
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PRE-MOLDED LEADFRAME AND METHOD OF MANUFACTURE THEREOF
46
Patent #:
9171739
Issue Dt:
10/27/2015
Application #:
14313452
Filing Dt:
06/24/2014
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CORELESS SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
47
Patent #:
9129978
Issue Dt:
09/08/2015
Application #:
14313521
Filing Dt:
06/24/2014
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VOID PREVENTION MECHANISM AND METHOD OF MANUFACTURE THEREOF
48
Patent #:
9305809
Issue Dt:
04/05/2016
Application #:
14316461
Filing Dt:
06/26/2014
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CORELESS SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
49
Patent #:
9355983
Issue Dt:
05/31/2016
Application #:
14318061
Filing Dt:
06/27/2014
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER STRUCTURE AND METHOD OF MANUFACTURE THEREOF
50
Patent #:
9171795
Issue Dt:
10/27/2015
Application #:
14556992
Filing Dt:
12/01/2014
Publication #:
US20150171002
Pub Dt:
06/18/2015
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED COMPONENT AND METHOD OF MANUFACTURE THEREOF
51
Patent #:
9385100
Issue Dt:
07/05/2016
Application #:
14659905
Filing Dt:
03/17/2015
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SURFACE TREATMENT AND METHOD OF MANUFACTURE THEREOF
Assignor
1
STATS CHIPPAC LTD.
Exec Dt:
03/29/2016
Assignee
1
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65
#04-08/09 TECHPOINT
SINGAPORE, SINGAPORE 569059
Correspondence name and address
WONG & REES LLP
4677 OLD IRONSIDES DRIVE
SUITE 370
SANTA CLARA, CA 95054

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