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Patent Assignment Details
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Reel/Frame:009173/0944   Pages: 4
Recorded: 04/28/1998
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/06/2000
Application #:
09067395
Filing Dt:
04/28/1998
Title:
INTEGRATED CIRCUIT SOCKET WITH BUILT IN EMC GROUNDING FOR A HEAT SINK
Assignors
1
Exec Dt:
04/27/1998
2
Exec Dt:
04/27/1998
Assignee
1
OLD ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondence name and address
IBM CORPORATION
JOHN D. FLYNN
INTELLECTUAL PROPERTY LAW
3039 CORNWALLIS ROAD, P.O. BOX 12195
RTP, NC 27709

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