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Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:009781/0951   Pages: 11
Recorded: 02/23/1999
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 54
1
Patent #:
Issue Dt:
07/24/1984
Application #:
06341392
Filing Dt:
01/21/1982
Title:
SEMICONDUCTOR CASING
2
Patent #:
Issue Dt:
10/18/1983
Application #:
06390095
Filing Dt:
06/21/1982
Title:
CASING FOR AN ELECTRICAL COMPONENT HAVING IMPROVED STRENGTH AND HEAT TRANSFER CHARACTERISTIS
3
Patent #:
Issue Dt:
10/30/1984
Application #:
06398497
Filing Dt:
07/15/1982
Title:
SEMICONDUCTOR CASING
4
Patent #:
Issue Dt:
05/02/1989
Application #:
06413046
Filing Dt:
08/30/1982
Title:
MULTI-LAYER CIRCUITRY
5
Patent #:
Issue Dt:
06/18/1985
Application #:
06454409
Filing Dt:
12/29/1982
Title:
SEMICONDUCTOR PACKAGES
6
Patent #:
Issue Dt:
06/17/1986
Application #:
06639168
Filing Dt:
08/09/1984
Title:
A METHOD OF MAKING SEMICONDUCTOR CASING
7
Patent #:
Issue Dt:
05/29/1990
Application #:
06826808
Filing Dt:
02/10/1986
Title:
SEMICONDUCTOR DIE ATTACH SYSTEM
8
Patent #:
Issue Dt:
10/03/1989
Application #:
06928121
Filing Dt:
11/07/1986
Title:
SEMICONDUCTOR DIE ATTACH SYSTEM
9
Patent #:
Issue Dt:
03/14/1989
Application #:
06930162
Filing Dt:
11/13/1986
Title:
METAL ELECTRONIC PACKAGE SEALED WITH THERMOPLASTIC HAVING A GRAFTED METAL DEACTIVATOR AND ANTIOXIDANT
10
Patent #:
Issue Dt:
10/02/1990
Application #:
07091470
Filing Dt:
08/31/1987
Title:
METAL PACKAGES HAVING IMPROVED THERMAL DISSIPATION
11
Patent #:
Issue Dt:
12/19/1989
Application #:
07140859
Filing Dt:
01/04/1988
Title:
SEMICONDUCTOR PACKAGE
12
Patent #:
Issue Dt:
01/30/1990
Application #:
07154544
Filing Dt:
02/10/1988
Title:
METAL ELECTRONIC PACKAGE
13
Patent #:
Issue Dt:
10/30/1990
Application #:
07188322
Filing Dt:
05/04/1988
Title:
HERMETIC MICROMINIATURE PACKAGES
14
Patent #:
Issue Dt:
07/03/1990
Application #:
07253639
Filing Dt:
10/05/1988
Title:
ALUMINUM ALLOY SEMICONDUCTOR PACKAGES
15
Patent #:
Issue Dt:
05/29/1990
Application #:
07270919
Filing Dt:
11/14/1988
Title:
DIE SET FOR THE FORMATION OF CAVITIES FOR METAL PACKAGES TO HOUSE ELECTRONIC DEVICES
16
Patent #:
Issue Dt:
12/18/1990
Application #:
07399687
Filing Dt:
08/28/1989
Title:
SEMICONDUCTOR DIE ATTACH SYSTEM
17
Patent #:
Issue Dt:
12/17/1991
Application #:
07436854
Filing Dt:
11/15/1989
Title:
METHOD FOR HOUSING A TAPE-BONDED ELECTRONIC DEVICE AND THE PACKAGE EMPLOYED
18
Patent #:
Issue Dt:
04/07/1992
Application #:
07442877
Filing Dt:
11/29/1989
Title:
METAL PIN GRID ARRAY PACKAGE
19
Patent #:
Issue Dt:
05/07/1991
Application #:
07461861
Filing Dt:
01/08/1990
Title:
KIT FOR THE ASSEMBLY OF A METAL ELECTRONIC PACKAGE
20
Patent #:
Issue Dt:
06/11/1991
Application #:
07504741
Filing Dt:
04/04/1990
Title:
ALUMINUM ALLOY SEMICONDUCTOR PACKAGES
21
Patent #:
Issue Dt:
08/27/1991
Application #:
07548322
Filing Dt:
07/02/1990
Title:
METAL ELECTRONIC PACKAGE HAVING IMPROVED RESISTANCE TO ELECTROMAGNETIC INTERFERENCE
22
Patent #:
Issue Dt:
11/19/1991
Application #:
07568818
Filing Dt:
08/17/1990
Title:
PROCESS FOR PRODUCING BLACK INTEGRALLY COLORED ANODIZED ALUMINUM COMPONENTS
23
Patent #:
Issue Dt:
03/24/1992
Application #:
07640794
Filing Dt:
01/14/1991
Title:
PROCESS FOR MANUFACTURING A METAL PIN GRID ARRAY PACKAGE
24
Patent #:
Issue Dt:
07/21/1992
Application #:
07651686
Filing Dt:
02/06/1991
Title:
CARRIER RING HAVING FIRST AND SECOND RING MEANS WITH BONDED SURFACES
25
Patent #:
Issue Dt:
09/08/1992
Application #:
07695058
Filing Dt:
05/03/1991
Title:
FORMATION OF SHAPES IN A METAL WORKPIECE
26
Patent #:
Issue Dt:
10/13/1992
Application #:
07712797
Filing Dt:
06/10/1991
Title:
ALUMINUM ALLOY SEMICONDUCTOR PACKAGES
27
Patent #:
Issue Dt:
12/28/1993
Application #:
07724259
Filing Dt:
07/01/1991
Title:
METHOD AND APPARATUS FOR FORMING AND POSITIONING A PREFORM ON A WORKPIECE
28
Patent #:
Issue Dt:
08/24/1993
Application #:
07912456
Filing Dt:
07/13/1992
Title:
ELECTRONIC PACKAGE HAVING CONTROLLED EPOXY FLOW
29
Patent #:
Issue Dt:
11/22/1994
Application #:
07946119
Filing Dt:
09/17/1992
Title:
MOLDED PLASTIC SEMICONDUCTOR PACKAGE INCLUDING AN ALUMINUM ALLOY HEAT SPREADER
30
Patent #:
Issue Dt:
06/28/1994
Application #:
07959571
Filing Dt:
10/13/1992
Title:
METAL ELECTRONIC PACKAGE WITH REDUCED SEAL WIDTH
31
Patent #:
Issue Dt:
08/17/1999
Application #:
07984147
Filing Dt:
11/24/1992
Title:
THERMAL PERFORMANCE PACKAGE FOR INTEGRATED CIRCUIT CHIP
32
Patent #:
Issue Dt:
07/17/2001
Application #:
08033596
Filing Dt:
03/19/1993
Title:
BALL GRID ARRAY ELECTRONIC PACKAGE
33
Patent #:
Issue Dt:
12/19/1995
Application #:
08060284
Filing Dt:
05/12/1993
Title:
MULTI-PHASE BACK CONTACTS FOR CIS SOLAR CELLS
34
Patent #:
Issue Dt:
04/04/1995
Application #:
08114994
Filing Dt:
08/31/1993
Title:
"ANODIZED ALUMINUM ELECTRONIC PACKAGE COMPONENTS"
35
Patent #:
Issue Dt:
03/21/1995
Application #:
08126860
Filing Dt:
09/27/1993
Title:
METAL ELECTRONIC PACKAGE WITH REDUCED SEAL WIDTH
36
Patent #:
Issue Dt:
11/01/1994
Application #:
08153240
Filing Dt:
11/16/1993
Title:
MULTI-CHIP ELECTRONIC PACKAGE MODULE UTILIZING AN ADHESIVE SHEET
37
Patent #:
Issue Dt:
10/03/1995
Application #:
08181687
Filing Dt:
01/14/1994
Title:
CHAMFERED ELECTRONIC PACKAGE COMPONENT
38
Patent #:
Issue Dt:
10/19/1999
Application #:
08249104
Filing Dt:
05/25/1994
Title:
SEMICONDUCTOR PACKAGE WITH MOLDED PLASTIC BODY
39
Patent #:
Issue Dt:
03/04/1997
Application #:
08276381
Filing Dt:
07/18/1994
Title:
MOLDED PLASTIC SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER
40
Patent #:
Issue Dt:
05/13/1997
Application #:
08277387
Filing Dt:
07/19/1994
Title:
METAL BALL GRID ARRAY PACKAGE WITH IMPROVED THERMAL CONDUCTIVITY
41
Patent #:
Issue Dt:
04/02/1996
Application #:
08353741
Filing Dt:
12/12/1994
Title:
ADHESIVELY SEALED METAL ELECTRONIC PACKAGE INCORPORATING A MULTI-CHIP MODULE
42
Patent #:
Issue Dt:
08/13/1996
Application #:
08373138
Filing Dt:
01/13/1995
Title:
GUARD RING FOR INTEGRATED CIRCUIT PACKAGE
43
Patent #:
Issue Dt:
11/26/1996
Application #:
08413149
Filing Dt:
03/29/1995
Title:
COMPONENTS FOR HOUSING AN INTEGRATED CIRCUIT DEVICE
44
Patent #:
Issue Dt:
07/09/1996
Application #:
08427921
Filing Dt:
04/26/1995
Title:
ANODIZED ALUMINUM SUBSTRATE HAVING INCREASED BREAKDOWN VOLTAGE
45
Patent #:
Issue Dt:
10/09/2001
Application #:
08435237
Filing Dt:
05/05/1995
Title:
EDGE CONNECTABLE METAL PACKAGE
46
Patent #:
Issue Dt:
04/09/1996
Application #:
08450292
Filing Dt:
05/25/1995
Title:
ELECTRONIC PACKAGE HAVING IMPROVED WIRE BONDING CAPABILITY
47
Patent #:
Issue Dt:
07/22/1997
Application #:
08497836
Filing Dt:
07/03/1995
Title:
ELECTRONIC PACKAGE WITH IMPROVED THERMAL PROPERTIES
48
Patent #:
Issue Dt:
09/24/1996
Application #:
08540835
Filing Dt:
10/11/1995
Title:
ELECTRONIC PACKAGE WITH IMPROVED ELECTRICAL PERFORMANCE
49
Patent #:
Issue Dt:
09/08/1998
Application #:
08601415
Filing Dt:
02/14/1996
Title:
BALL GRID ARRAY ELECTRONIC PACKAGE STANDOFF DESIGN
50
Patent #:
Issue Dt:
11/18/1997
Application #:
08633256
Filing Dt:
04/18/1996
Title:
ANODIZED ALUMINUM SUBSTRATE HAVING INCREASED BREAKDOWN VOLTAGE
51
Patent #:
Issue Dt:
06/09/1998
Application #:
08749259
Filing Dt:
11/15/1996
Title:
GROUND RING FOR A METAL ELECTRONIC PACKAGE
52
Patent #:
Issue Dt:
03/02/1999
Application #:
08752193
Filing Dt:
11/18/1996
Title:
SEMICONDUCTOR PACKAGE HAVING A GROUND OR POWER RING AND A METAL SUBSTRATE
53
Patent #:
Issue Dt:
09/14/1999
Application #:
08891446
Filing Dt:
07/10/1997
Title:
METAL BALL GRID ELECTRONIC PACKAGE HAVING IMPROVED SOLDER JOINT
54
Patent #:
Issue Dt:
09/14/1999
Application #:
08955191
Filing Dt:
10/21/1997
Title:
ALUMINUM ALLOYS FOR ELECTRONIC COMPONENTS
Assignor
1
Exec Dt:
02/19/1999
Assignee
1
555 CARNEGIE STREET, P.O. BOX 952
MANTECA, CALIFORNIA 95336
Correspondence name and address
WIGGIN & DANA
GREGORY S. ROSENBLATT
ONE CENTURY TOWER
NEW HAVEN, CT 06508-1832

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