Total properties:
54
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Patent #:
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Issue Dt:
|
07/24/1984
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Application #:
|
06341392
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Filing Dt:
|
01/21/1982
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Title:
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SEMICONDUCTOR CASING
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Patent #:
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|
Issue Dt:
|
10/18/1983
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Application #:
|
06390095
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Filing Dt:
|
06/21/1982
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Title:
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CASING FOR AN ELECTRICAL COMPONENT HAVING IMPROVED STRENGTH AND HEAT TRANSFER CHARACTERISTIS
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Patent #:
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|
Issue Dt:
|
10/30/1984
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Application #:
|
06398497
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Filing Dt:
|
07/15/1982
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Title:
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SEMICONDUCTOR CASING
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Patent #:
|
|
Issue Dt:
|
05/02/1989
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Application #:
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06413046
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Filing Dt:
|
08/30/1982
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Title:
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MULTI-LAYER CIRCUITRY
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|
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Patent #:
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Issue Dt:
|
06/18/1985
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Application #:
|
06454409
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Filing Dt:
|
12/29/1982
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Title:
|
SEMICONDUCTOR PACKAGES
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|
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Patent #:
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|
Issue Dt:
|
06/17/1986
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Application #:
|
06639168
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Filing Dt:
|
08/09/1984
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Title:
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A METHOD OF MAKING SEMICONDUCTOR CASING
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Patent #:
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Issue Dt:
|
05/29/1990
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Application #:
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06826808
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Filing Dt:
|
02/10/1986
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Title:
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SEMICONDUCTOR DIE ATTACH SYSTEM
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Patent #:
|
|
Issue Dt:
|
10/03/1989
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Application #:
|
06928121
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Filing Dt:
|
11/07/1986
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Title:
|
SEMICONDUCTOR DIE ATTACH SYSTEM
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|
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Patent #:
|
|
Issue Dt:
|
03/14/1989
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Application #:
|
06930162
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Filing Dt:
|
11/13/1986
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Title:
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METAL ELECTRONIC PACKAGE SEALED WITH THERMOPLASTIC HAVING A GRAFTED METAL DEACTIVATOR AND ANTIOXIDANT
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|
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Patent #:
|
|
Issue Dt:
|
10/02/1990
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Application #:
|
07091470
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Filing Dt:
|
08/31/1987
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Title:
|
METAL PACKAGES HAVING IMPROVED THERMAL DISSIPATION
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|
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Patent #:
|
|
Issue Dt:
|
12/19/1989
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Application #:
|
07140859
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Filing Dt:
|
01/04/1988
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Title:
|
SEMICONDUCTOR PACKAGE
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|
|
Patent #:
|
|
Issue Dt:
|
01/30/1990
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Application #:
|
07154544
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Filing Dt:
|
02/10/1988
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Title:
|
METAL ELECTRONIC PACKAGE
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|
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Patent #:
|
|
Issue Dt:
|
10/30/1990
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Application #:
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07188322
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Filing Dt:
|
05/04/1988
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Title:
|
HERMETIC MICROMINIATURE PACKAGES
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|
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Patent #:
|
|
Issue Dt:
|
07/03/1990
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Application #:
|
07253639
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Filing Dt:
|
10/05/1988
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Title:
|
ALUMINUM ALLOY SEMICONDUCTOR PACKAGES
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|
|
Patent #:
|
|
Issue Dt:
|
05/29/1990
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Application #:
|
07270919
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Filing Dt:
|
11/14/1988
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Title:
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DIE SET FOR THE FORMATION OF CAVITIES FOR METAL PACKAGES TO HOUSE ELECTRONIC DEVICES
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|
|
Patent #:
|
|
Issue Dt:
|
12/18/1990
|
Application #:
|
07399687
|
Filing Dt:
|
08/28/1989
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Title:
|
SEMICONDUCTOR DIE ATTACH SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
12/17/1991
|
Application #:
|
07436854
|
Filing Dt:
|
11/15/1989
|
Title:
|
METHOD FOR HOUSING A TAPE-BONDED ELECTRONIC DEVICE AND THE PACKAGE EMPLOYED
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|
|
Patent #:
|
|
Issue Dt:
|
04/07/1992
|
Application #:
|
07442877
|
Filing Dt:
|
11/29/1989
|
Title:
|
METAL PIN GRID ARRAY PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/07/1991
|
Application #:
|
07461861
|
Filing Dt:
|
01/08/1990
|
Title:
|
KIT FOR THE ASSEMBLY OF A METAL ELECTRONIC PACKAGE
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|
|
Patent #:
|
|
Issue Dt:
|
06/11/1991
|
Application #:
|
07504741
|
Filing Dt:
|
04/04/1990
|
Title:
|
ALUMINUM ALLOY SEMICONDUCTOR PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/27/1991
|
Application #:
|
07548322
|
Filing Dt:
|
07/02/1990
|
Title:
|
METAL ELECTRONIC PACKAGE HAVING IMPROVED RESISTANCE TO ELECTROMAGNETIC INTERFERENCE
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|
|
Patent #:
|
|
Issue Dt:
|
11/19/1991
|
Application #:
|
07568818
|
Filing Dt:
|
08/17/1990
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Title:
|
PROCESS FOR PRODUCING BLACK INTEGRALLY COLORED ANODIZED ALUMINUM COMPONENTS
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|
|
Patent #:
|
|
Issue Dt:
|
03/24/1992
|
Application #:
|
07640794
|
Filing Dt:
|
01/14/1991
|
Title:
|
PROCESS FOR MANUFACTURING A METAL PIN GRID ARRAY PACKAGE
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|
|
Patent #:
|
|
Issue Dt:
|
07/21/1992
|
Application #:
|
07651686
|
Filing Dt:
|
02/06/1991
|
Title:
|
CARRIER RING HAVING FIRST AND SECOND RING MEANS WITH BONDED SURFACES
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|
|
Patent #:
|
|
Issue Dt:
|
09/08/1992
|
Application #:
|
07695058
|
Filing Dt:
|
05/03/1991
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Title:
|
FORMATION OF SHAPES IN A METAL WORKPIECE
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|
|
Patent #:
|
|
Issue Dt:
|
10/13/1992
|
Application #:
|
07712797
|
Filing Dt:
|
06/10/1991
|
Title:
|
ALUMINUM ALLOY SEMICONDUCTOR PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
12/28/1993
|
Application #:
|
07724259
|
Filing Dt:
|
07/01/1991
|
Title:
|
METHOD AND APPARATUS FOR FORMING AND POSITIONING A PREFORM ON A WORKPIECE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/24/1993
|
Application #:
|
07912456
|
Filing Dt:
|
07/13/1992
|
Title:
|
ELECTRONIC PACKAGE HAVING CONTROLLED EPOXY FLOW
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|
|
Patent #:
|
|
Issue Dt:
|
11/22/1994
|
Application #:
|
07946119
|
Filing Dt:
|
09/17/1992
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Title:
|
MOLDED PLASTIC SEMICONDUCTOR PACKAGE INCLUDING AN ALUMINUM ALLOY HEAT SPREADER
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|
|
Patent #:
|
|
Issue Dt:
|
06/28/1994
|
Application #:
|
07959571
|
Filing Dt:
|
10/13/1992
|
Title:
|
METAL ELECTRONIC PACKAGE WITH REDUCED SEAL WIDTH
|
|
|
Patent #:
|
|
Issue Dt:
|
08/17/1999
|
Application #:
|
07984147
|
Filing Dt:
|
11/24/1992
|
Title:
|
THERMAL PERFORMANCE PACKAGE FOR INTEGRATED CIRCUIT CHIP
|
|
|
Patent #:
|
|
Issue Dt:
|
07/17/2001
|
Application #:
|
08033596
|
Filing Dt:
|
03/19/1993
|
Title:
|
BALL GRID ARRAY ELECTRONIC PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/19/1995
|
Application #:
|
08060284
|
Filing Dt:
|
05/12/1993
|
Title:
|
MULTI-PHASE BACK CONTACTS FOR CIS SOLAR CELLS
|
|
|
Patent #:
|
|
Issue Dt:
|
04/04/1995
|
Application #:
|
08114994
|
Filing Dt:
|
08/31/1993
|
Title:
|
"ANODIZED ALUMINUM ELECTRONIC PACKAGE COMPONENTS"
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|
|
Patent #:
|
|
Issue Dt:
|
03/21/1995
|
Application #:
|
08126860
|
Filing Dt:
|
09/27/1993
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Title:
|
METAL ELECTRONIC PACKAGE WITH REDUCED SEAL WIDTH
|
|
|
Patent #:
|
|
Issue Dt:
|
11/01/1994
|
Application #:
|
08153240
|
Filing Dt:
|
11/16/1993
|
Title:
|
MULTI-CHIP ELECTRONIC PACKAGE MODULE UTILIZING AN ADHESIVE SHEET
|
|
|
Patent #:
|
|
Issue Dt:
|
10/03/1995
|
Application #:
|
08181687
|
Filing Dt:
|
01/14/1994
|
Title:
|
CHAMFERED ELECTRONIC PACKAGE COMPONENT
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|
|
Patent #:
|
|
Issue Dt:
|
10/19/1999
|
Application #:
|
08249104
|
Filing Dt:
|
05/25/1994
|
Title:
|
SEMICONDUCTOR PACKAGE WITH MOLDED PLASTIC BODY
|
|
|
Patent #:
|
|
Issue Dt:
|
03/04/1997
|
Application #:
|
08276381
|
Filing Dt:
|
07/18/1994
|
Title:
|
MOLDED PLASTIC SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER
|
|
|
Patent #:
|
|
Issue Dt:
|
05/13/1997
|
Application #:
|
08277387
|
Filing Dt:
|
07/19/1994
|
Title:
|
METAL BALL GRID ARRAY PACKAGE WITH IMPROVED THERMAL CONDUCTIVITY
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|
|
Patent #:
|
|
Issue Dt:
|
04/02/1996
|
Application #:
|
08353741
|
Filing Dt:
|
12/12/1994
|
Title:
|
ADHESIVELY SEALED METAL ELECTRONIC PACKAGE INCORPORATING A MULTI-CHIP MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/13/1996
|
Application #:
|
08373138
|
Filing Dt:
|
01/13/1995
|
Title:
|
GUARD RING FOR INTEGRATED CIRCUIT PACKAGE
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|
|
Patent #:
|
|
Issue Dt:
|
11/26/1996
|
Application #:
|
08413149
|
Filing Dt:
|
03/29/1995
|
Title:
|
COMPONENTS FOR HOUSING AN INTEGRATED CIRCUIT DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/09/1996
|
Application #:
|
08427921
|
Filing Dt:
|
04/26/1995
|
Title:
|
ANODIZED ALUMINUM SUBSTRATE HAVING INCREASED BREAKDOWN VOLTAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/09/2001
|
Application #:
|
08435237
|
Filing Dt:
|
05/05/1995
|
Title:
|
EDGE CONNECTABLE METAL PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/09/1996
|
Application #:
|
08450292
|
Filing Dt:
|
05/25/1995
|
Title:
|
ELECTRONIC PACKAGE HAVING IMPROVED WIRE BONDING CAPABILITY
|
|
|
Patent #:
|
|
Issue Dt:
|
07/22/1997
|
Application #:
|
08497836
|
Filing Dt:
|
07/03/1995
|
Title:
|
ELECTRONIC PACKAGE WITH IMPROVED THERMAL PROPERTIES
|
|
|
Patent #:
|
|
Issue Dt:
|
09/24/1996
|
Application #:
|
08540835
|
Filing Dt:
|
10/11/1995
|
Title:
|
ELECTRONIC PACKAGE WITH IMPROVED ELECTRICAL PERFORMANCE
|
|
|
Patent #:
|
|
Issue Dt:
|
09/08/1998
|
Application #:
|
08601415
|
Filing Dt:
|
02/14/1996
|
Title:
|
BALL GRID ARRAY ELECTRONIC PACKAGE STANDOFF DESIGN
|
|
|
Patent #:
|
|
Issue Dt:
|
11/18/1997
|
Application #:
|
08633256
|
Filing Dt:
|
04/18/1996
|
Title:
|
ANODIZED ALUMINUM SUBSTRATE HAVING INCREASED BREAKDOWN VOLTAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/09/1998
|
Application #:
|
08749259
|
Filing Dt:
|
11/15/1996
|
Title:
|
GROUND RING FOR A METAL ELECTRONIC PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/02/1999
|
Application #:
|
08752193
|
Filing Dt:
|
11/18/1996
|
Title:
|
SEMICONDUCTOR PACKAGE HAVING A GROUND OR POWER RING AND A METAL SUBSTRATE
|
|
|
Patent #:
|
|
Issue Dt:
|
09/14/1999
|
Application #:
|
08891446
|
Filing Dt:
|
07/10/1997
|
Title:
|
METAL BALL GRID ELECTRONIC PACKAGE HAVING IMPROVED SOLDER JOINT
|
|
|
Patent #:
|
|
Issue Dt:
|
09/14/1999
|
Application #:
|
08955191
|
Filing Dt:
|
10/21/1997
|
Title:
|
ALUMINUM ALLOYS FOR ELECTRONIC COMPONENTS
|
|