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Total properties:
18
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Patent #:
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Issue Dt:
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11/08/2005
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Application #:
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09746018
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Filing Dt:
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12/26/2000
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Publication #:
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Pub Dt:
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09/06/2001
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Title:
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STRUCTURE OF HEAT SLUG-EQUIPPED PACKAGES AND THE PACKAGING METHOD OF THE SAME
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Patent #:
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Issue Dt:
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01/24/2006
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Application #:
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09758325
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Filing Dt:
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01/10/2001
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Publication #:
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Pub Dt:
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12/13/2001
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Title:
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PATTERN RECOGNITION METHOD
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Patent #:
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Issue Dt:
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01/10/2006
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Application #:
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09758332
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Filing Dt:
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01/10/2001
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Publication #:
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Pub Dt:
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12/20/2001
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Title:
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CLAMP FOR PATTERN RECOGNITION
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Patent #:
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Issue Dt:
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11/22/2005
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Application #:
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09884193
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Filing Dt:
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06/19/2001
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Title:
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IMPRINTED INTEGRATED CIRCUIT SUBSTRATE AND METHOD FOR IMPRINTING AN INTEGRATED CIRCUIT SUBSTRATE
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Patent #:
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Issue Dt:
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01/03/2006
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Application #:
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10076701
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Filing Dt:
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02/13/2002
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Title:
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STACKING STRUCTURE FOR SEMICONDUCTOR CHIPS AND A SEMICONDUCTOR PACKAGE USING IT
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Patent #:
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Issue Dt:
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11/08/2005
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Application #:
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10150400
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Filing Dt:
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05/17/2002
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Publication #:
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Pub Dt:
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11/14/2002
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Title:
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METHOD OF MAKING NEAR CHIP SIZE INTEGRATED CIRCUIT PACKAGE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10156889
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Filing Dt:
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05/30/2002
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Publication #:
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Pub Dt:
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10/10/2002
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Title:
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Method of making an integrated circuit package
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Patent #:
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Issue Dt:
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12/05/2006
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Application #:
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10227051
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Filing Dt:
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08/23/2002
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Publication #:
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Pub Dt:
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02/26/2004
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Title:
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OPTIC SEMICONDUCTOR MODULE AND MANUFACTURING METHOD
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Patent #:
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Issue Dt:
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11/15/2005
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Application #:
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10356997
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Filing Dt:
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02/03/2003
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Title:
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REINFORCED LEAD-FRAME ASSEMBLY FOR INTERCONNECTING CIRCUITS WITHIN A CIRCUIT MODULE
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Patent #:
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Issue Dt:
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01/03/2006
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Application #:
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10600931
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Filing Dt:
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06/20/2003
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Publication #:
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Pub Dt:
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01/15/2004
| | | | |
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
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Patent #:
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Issue Dt:
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11/22/2005
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Application #:
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10688138
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Filing Dt:
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10/17/2003
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Title:
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MOUNTING FOR A PACKAGE CONTAINING A CHIP
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Patent #:
|
|
Issue Dt:
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12/20/2005
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Application #:
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10702274
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Filing Dt:
|
11/05/2003
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Title:
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STACKABLE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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|
|
|
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Patent #:
|
|
Issue Dt:
|
11/15/2005
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Application #:
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10737572
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Filing Dt:
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12/16/2003
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Title:
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SEMICONDUCTOR PACKAGE WITH EXPOSED DIE PAD AND BODY-LOCKING LEADFRAME
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|
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Patent #:
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|
Issue Dt:
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03/13/2007
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Application #:
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10785528
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Filing Dt:
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02/24/2004
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Publication #:
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Pub Dt:
|
08/26/2004
| | | | |
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Title:
|
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
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|
|
|
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Patent #:
|
|
Issue Dt:
|
06/13/2006
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Application #:
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10803333
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Filing Dt:
|
03/17/2004
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Publication #:
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Pub Dt:
|
09/09/2004
| | | | |
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Title:
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STACKABLE SEMICONDUCTOR PACKAGE HAVING SEMICONDUCTOR CHIP WITHIN CENTRAL THROUGH HOLE OF SUBSTRATE
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|
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Patent #:
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|
Issue Dt:
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04/18/2006
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Application #:
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10884082
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Filing Dt:
|
07/01/2004
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Publication #:
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Pub Dt:
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01/06/2005
| | | | |
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Title:
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SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND WIRE BONDING METHOD USING THEREOF
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|
|
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Patent #:
|
|
Issue Dt:
|
10/18/2005
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Application #:
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10928475
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Filing Dt:
|
08/26/2004
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Publication #:
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Pub Dt:
|
02/03/2005
| | | | |
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Title:
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IMAGE SENSOR PACKAGE FABRICATION METHOD
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|
|
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Patent #:
|
|
Issue Dt:
|
10/11/2005
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Application #:
|
10944241
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Filing Dt:
|
09/17/2004
|
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Publication #:
|
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Pub Dt:
|
03/24/2005
| | | | |
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Title:
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SEMICONDUCTOR PACKAGE
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