Total properties:
113
Page
2
of
2
Pages:
1 2 |
|
|
|
Patent #:
|
|
Issue Dt:
|
11/05/2002
|
Application #:
|
08861649
|
Filing Dt:
|
05/22/1997
|
|
Title:
|
APPARATUS AND METHOD FOR SPUTTER DEPOSITING DIELECTRIC FILMS ON A SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/03/1998
|
Application #:
|
08861958
|
Filing Dt:
|
05/22/1997
|
|
Title:
|
METHOD AND APPARATUS FOR LOW PRESSURE SPUTTERING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/22/2000
|
Application #:
|
08866324
|
Filing Dt:
|
06/18/1997
|
|
Title:
|
METHOD FOR DEPOSITING A LOW-RESISTIVITY TITANIUM-OXYNITRIDE (TION) FILM THAT PROVIDES FOR GOOD TEXTURE OF A SUBSEQUENTLY DEPOSITED CONDUCTOR LAYER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/04/2000
|
Application #:
|
08887140
|
Filing Dt:
|
07/02/1997
|
|
Title:
|
APPARATUS AND METHOD FOR UNIFORM,LOW-DAMAGE ANISOTROPIC PLASMA PROCESSING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/02/1999
|
Application #:
|
08899500
|
Filing Dt:
|
07/19/1997
|
|
Title:
|
METHOD AND APPARATUS FOR PRODUCING THIN FILMS BY LOW TEMPERATURE PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION USING A ROTATING SUSCEPTOR REACTOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/20/1999
|
Application #:
|
08914673
|
Filing Dt:
|
08/19/1997
|
|
Title:
|
USE OF TICL4 ETCHBACK PROCESS DURING INTEGRATED CVD-TI/TIN WAFER PROCESSING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/19/2000
|
Application #:
|
08940779
|
Filing Dt:
|
09/30/1997
|
|
Title:
|
APPARATUS AND METHOD FOR PREVENTING THE PREMATURE MIXTURE OF REACTANT GASES IN CVD AND PECVD REACTIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/19/2000
|
Application #:
|
08948955
|
Filing Dt:
|
10/09/1997
|
|
Title:
|
METHOD OF IMPROVING SURFACE MORPHOLOGY AND REDUCING RESISTIVITY OF CHEMICAL VAPOR DEPOSITION-METAL FILMS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/14/2000
|
Application #:
|
08964532
|
Filing Dt:
|
11/05/1997
|
|
Title:
|
METHOD OF TITANIUM NITRIDE CONTACT PLUG FORMATION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/25/2000
|
Application #:
|
08965658
|
Filing Dt:
|
11/06/1997
|
|
Title:
|
ELIMINATION OF TITANIUM NITRIDE FILM DEPOSITION IN TUNGSTEN PLUG TECHNOLOGY USING PE-CVD-TI AND IN-SITU PLASMA NITRIDATION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/17/2000
|
Application #:
|
08971512
|
Filing Dt:
|
11/17/1997
|
|
Title:
|
IN-SITU PRE-METALLIZATION CLEAN AND METALLIZATION OF SEMICONDUCTOR WAFERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/28/2000
|
Application #:
|
09005862
|
Filing Dt:
|
01/12/1998
|
|
Title:
|
TWO-WAFER LOADLOCK WAFER PROCESSING APPARATUS AND LOADING AND UNLOADING METHOD THEREFOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/18/2000
|
Application #:
|
09009387
|
Filing Dt:
|
01/20/1998
|
|
Title:
|
METHOD OF ELIMINATING EDGE EFFECT IN CHEMICAL VAPOR DEPOSITION OF A METAL
|
|
