Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/31/2018
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Application #:
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15447831
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Filing Dt:
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03/02/2017
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Inventors:
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Yeoung Beom Ko, Jae Jin Lee, Dong Jean Kim, Hee Sung Kim, Dae Byoung Kang, Joon Dong Kim
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Title:
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SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2045 E. INNOVATION CIRCLE |
TEMPE, ARIZONA 85284 |
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MCANDREWS, HELD & MALLOY, LTD. |
500 WEST MADISON STREET |
34TH FLOOR |
CHICAGO, IL 60661 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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491 B RIVER VALLEY ROAD |
#15-02/04 |
VALLEY POINT, SINGAPORE 248373 |
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MCANDREWS, HELD & MALLOY, LTD. |
500 WEST MADISON STREET |
34TH FLOOR |
CHICAGO, IL 60661 |
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05/23/2024 08:41 AM
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