Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/21/2018
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Application #:
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15483417
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Filing Dt:
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04/10/2017
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Inventors:
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Mikko HEIKKINEN, Antti KERÄNEN, Jarmo SÄÄSKI, Ronald H. HAAG
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Title:
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MULTILAYER STRUCTURE AND RELATED METHOD OF MANUFACTURE FOR ELECTRONICS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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AUTOMAATIOTIE 1, |
OULUNSALO, FINLAND 90460 |
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CARTER, DELUCA, FARRELL & SCHMIDT, LLP |
445 BROAD HOLLOW ROAD |
SUITE 420 |
MELVILLE, NY 11747 |
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05/29/2024 01:44 PM
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