Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/20/2018
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Application #:
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15433866
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Filing Dt:
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02/15/2017
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Publication #:
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Pub Dt:
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06/08/2017
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Inventors:
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MinKyung Kang, YoungDal Roh, Dong Ju Jeon, KyoungHee Park
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED PAD ON LAYERED SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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10 ANG MO KIO STREET 65 |
#05-17/20 TECHPOINT |
SINGAPORE, SINGAPORE 569059 |
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WONG & REES LLP |
4340 STEVENS CREEK BLVD. |
SUITE 106 |
SAN JOSE, CA 95129 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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10 ANG MO KIO STREET 65 |
#04-08/09 TECHPOINT |
SINGAPORE, SINGAPORE 569059 |
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WONG & REES LLP |
4340 STEVENS CREEK BLVD. |
SUITE 106 |
SAN JOSE, CA 95129 |
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