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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/25/2018
Application #:
15461713
Filing Dt:
03/17/2017
Publication #:
Pub Dt:
07/06/2017
Inventors:
Kian Meng Heng, Jose Alvin Caparas, Seng Guan Chow, Hin Hwa Goh, Kang Chen, Yaojian Lin
Title:
Semiconductor Device and Method of Controlling Warpage in Reconstituted Wafer
Assignment: 1
Reel/Frame:
041606/0758Recorded: 03/17/2017Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/10/2017
Exec Dt:
03/10/2017
Exec Dt:
03/10/2017
Exec Dt:
03/10/2017
Exec Dt:
03/06/2017
Exec Dt:
03/16/2017
Assignee:
10 ANG MO KIO STREET 65
TECHPOINT #04-08/09
SINGAPORE, SINGAPORE 569059
Correspondent:
PATENT LAW GROUP: ATKINS AND ASSOCIATES
55 N. ARIZONA PLACE
SUITE 104
CHANDLER, AZ 85225

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