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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10403535
Issue Dt:
09/03/2019
Application #:
14824229
Filing Dt:
08/12/2015
Publication #:
20160049323
Pub Dt:
02/18/2016
Inventors:
Zheng John YE, Jay D. PINSON II, Hiroji HANAWA, Jianhua ZHOU, Xing LIN, Ren-Guan DUAN et al
Title:
METHOD AND APPARATUS OF PROCESSING WAFERS WITH COMPRESSIVE OR TENSILE STRESS AT ELEVATED TEMPERATURES IN A PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION SYSTEM
Assignment: 1
Reel/Frame:
044274/0859Recorded: 12/01/2017Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
YE, ZHENG JOHN
Exec Dt:
09/25/2015
PINSON, JAY D., II
Exec Dt:
09/25/2015
HANAWA, HIROJI
Exec Dt:
11/04/2015
ZHOU, JIANHUA
Exec Dt:
08/20/2015
LIN, XING
Exec Dt:
08/28/2015
DUAN, REN-GUAN
Exec Dt:
09/15/2015
LEE, KWANGDUK DOUGLAS
Exec Dt:
09/17/2015
KIM, BOK HOEN
Exec Dt:
09/14/2015
BEHERA, SWAYAMBHU P.
Exec Dt:
08/20/2015
HA, SUNGWON
Exec Dt:
09/16/2015
BALASUBRAMANIAN, GANESH
Exec Dt:
09/25/2015
ROCHA- ALVAREZ, JUAN CARLOS
Exec Dt:
09/25/2015
KULSHRESHTHA, PRASHANT KUMAR
Exec Dt:
08/14/2015
FOSTER, JASON K.
Exec Dt:
09/17/2015
SRINIVASAN, MUKUND
Exec Dt:
10/02/2015
HALLER, UWE P.
Exec Dt:
08/20/2015
PONNEKANTI, HARI K.
Exec Dt:
09/07/2017
Assignee:
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95054
Correspondent:
PATTERSON & SHERIDAN, LLP
24 GREENWAY PLAZA, SUITE 1600
HOUSTON, TX 77046

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