Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/17/2019
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Application #:
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15919401
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Filing Dt:
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03/13/2018
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Publication #:
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Pub Dt:
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09/19/2019
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Inventors:
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Pandi Chelvam Marimuthu, Won Kyoung Choi
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Title:
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METHOD OF PACKAGING THIN DIE AND SEMICONDUCTOR DEVICE INCLUDING THIN DIE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10 ANG MO KIO STREET 65 |
| TECHPOINT #04-08/09 |
| SINGAPORE, SINGAPORE 569059 |
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| STATS CHIPPAC/PATENT LAW GROUP: ATKINS A |
| 55 N. ARIZONA PLACE, SUITE 104 |
| CHANDLER, AZ 85225 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 500 LINJIANG ROAD |
| YUECHENG DISTRICT |
| SHAOXING, CHINA |
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| ROBERT D. ATKINS |
| 123 W. CHANDLER HEIGHTS ROAD, #12535 |
| CHANDLER, AZ 85248 |
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