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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/21/2020
Application #:
16176167
Filing Dt:
10/31/2018
Inventors:
Kathryn R. Lange, Tuhin Sinha, Jeffrey A. Zitz, Marcus E. Interrante, Kamal K. Sikka et al
Title:
Multi Integrated Circuit Chip Carrier Package
Assignment: 1
Reel/Frame:
047369/0136Recorded: 10/31/2018Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/30/2018
Exec Dt:
10/30/2018
Exec Dt:
10/30/2018
Exec Dt:
10/30/2018
Exec Dt:
10/30/2018
Exec Dt:
10/30/2018
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
ZIP GROUP PLLC - IBM FIS
610 KINGSVIEW LN N
MINNEAPOLIS, MN 55447

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