Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
02/25/2020
|
Application #:
|
15925790
|
Filing Dt:
|
03/20/2018
|
|
Publication #:
|
|
Pub Dt:
|
09/26/2019
| | | | |
|
Inventors:
|
Chun-Jen Chen, Kuo-Chio Liu, Yi-Jen Lai, Sheng-Huan Chiu, Chen-Shien Chen, Kuo-Hui Chang et al
|
|
Title:
|
PACKAGE AND PACKAGE-ON-PACKAGE STRUCTURE HAVING ELLIPTICAL CONDUCTIVE COLUMNS
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 300-78 |
|
|
|
|
| JCIPRNET |
| P.O. BOX 600 TAIPEI GUTING |
| TAIPEI CITY, 10099 TAIWAN |
|
|
Search Results as of:
05/28/2024 04:28 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
