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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
09/01/2020
Application #:
16296384
Filing Dt:
03/08/2019
Publication #:
Pub Dt:
07/25/2019
Inventors:
Hee Hwan JI, Tae Ho KIM
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
066548/0250Recorded: 02/23/2024Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/20/2014
Exec Dt:
05/21/2014
Assignee:
1 HYANGJEONG-DONG, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO
CHEONGJU-SI, KOREA, REPUBLIC OF 361-728
Correspondent:
NSIP LAW
P.O. BOX 65745
WASHINGTON, DC 20035
Assignment: 2
Reel/Frame:
053703/0227Recorded: 09/03/2020Pages: 19
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/28/2020
Assignee:
215 DAESIN-RO (HYANGJEONG-DONG), HEUNGDEOK-GU
CHEONGJU-SI, CHUNGBUK, KOREA, REPUBLIC OF
Correspondent:
HYUN KYU LEE
SEED IP LAW GROUP LLP
701 FIFTH AVENUE, SUITE 5400
SEATTLE, WA 98104
Assignment: 3
Reel/Frame:
066794/0290Recorded: 03/12/2024Pages: 25
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/30/2024
Assignee:
215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO
CHEONGJU-SI, KOREA, REPUBLIC OF 28429
Correspondent:
NSIP LAW
P.O. BOX 65745
WASHINGTON, DC 20035

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