Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/02/2021
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Application #:
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16351757
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Filing Dt:
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03/13/2019
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Publication #:
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Pub Dt:
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09/17/2020
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Inventors:
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Fee Li Lie, Ravi K. Bonam, Dario Goldfarb, Dinesh Gupta, Kamal K. Sikka, Kevin Winstel et al
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Title:
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THREE-DIMENSIONAL MICROELECTRONIC PACKAGE WITH EMBEDDED COOLING CHANNELS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| AMIN, TUROCY & WATSON, LLP - IBM |
| 200 PARK AVENUE |
| SUITE 300 |
| BEACHWOOD, OH 44122 |
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