Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/08/2021
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Application #:
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16707411
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Filing Dt:
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12/09/2019
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Publication #:
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Pub Dt:
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06/11/2020
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Inventors:
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Byong Woo Cho, Jin Seong Kim, Cha Gyu Song
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE FOR IMPROVING DIE WARPAGE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2045 E. INNOVATION CIRCLE |
| TEMPE, ARIZONA 85284 |
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| MCANDREWS, HELD & MALLOY, LTD. |
| 500 WEST MADISON STREET |
| 34TH FLOOR |
| CHICAGO, IL 60661 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 491 B RIVER VALLEY ROAD |
| VALLEY POINT #12/03 |
| SINGAPORE, SINGAPORE 248373 |
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| MCANDREWS, HELD & MALLOY, LTD. |
| 500 WEST MADISON STRET |
| SUITE 3400 |
| CHICAGO, IL 60661 |
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