Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/29/2021
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Application #:
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16458554
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Filing Dt:
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07/01/2019
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Publication #:
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Pub Dt:
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01/07/2021
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Inventors:
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Ravi K. Bonam, Dinesh Gupta, Kamal K. Sikka, Mukta Ghate Farooq, James Kelly et al
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Title:
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SEMICONDUCTOR WAFER HAVING TRENCHES WITH VARIED DIMENSIONS FOR MULTI-CHIP MODULES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| CANTOR COLBURN LLP |
| 20 CHURCH STREET |
| 22ND FLOOR |
| HARTFORD, CT 06103 |
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