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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/03/2021
Application #:
16534052
Filing Dt:
08/07/2019
Publication #:
Pub Dt:
11/28/2019
Inventors:
Alan B. BOTULA, Max L. LIFSON, James A. SLINKMAN, Theodore G. VAN KESSEL, Randy L. WOLF
Title:
INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
Assignment: 1
Reel/Frame:
049990/0615Recorded: 08/07/2019Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/19/2014
Exec Dt:
02/19/2014
Exec Dt:
02/19/2014
Exec Dt:
02/19/2014
Exec Dt:
02/19/2014
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
ROBERTS MLOTKOWSKI SAFRAN COLE & CALDERON, P.C.
7918 JONES BRANCH DRIVE, SUITE 500
MCLEAN, VA 22102

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