Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/05/2022
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Application #:
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16725511
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Filing Dt:
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12/23/2019
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Publication #:
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Pub Dt:
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04/30/2020
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Inventor:
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You-Wei LIN
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Title:
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CIRCUIT BOARD AND PACKAGED CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4F-1, NO.26, TAI-YUAN ST. |
| CHUPEI CITY, HSINCHU HSIEN, TAIWAN 302 |
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| MCCLURE, QUALEY & RODACK, LLP |
| 280 INTERSTATE NORTH CIRCLE SE |
| SUITE 550 |
| ATLANTA, GA 30339 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| NO. 1, DUSING 1ST RD. , HSINCHU SCIENCE PARK |
| HSINCHU CITY, TAIWAN 30078 |
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| MCCLURE, QUALEY & RODACK, LLP |
| 280 INTERSTATE NORTH CIRCLE SE |
| SUITE 550 |
| ATLANTA, GA 30339 |
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