Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/19/2022
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Application #:
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17010221
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Filing Dt:
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09/02/2020
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Publication #:
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Pub Dt:
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12/24/2020
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Inventors:
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OhHan Kim, KyungHwan Kim, WoonJae Beak, HunTeak Lee, InSang Yoon
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Title:
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Semiconductor Device and Method of Forming SIP Module Over Film Layer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5 YISHUN STREET 23 |
SINGAPORE, SINGAPORE 768442 |
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PATENT LAW GROUP: ATKINS AND ASSOCIATES |
123 W. CHANDLER HEIGHTS ROAD, #12535 |
CHANDLER, AZ 85248 |
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