Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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11/01/2022
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Application #:
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16927454
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Filing Dt:
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07/13/2020
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Publication #:
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Pub Dt:
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06/03/2021
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Inventors:
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Roger D. St. Amand, Woon Kab Jung, Robert F. Darveaux, Louis W. Nicholls, Jin Seong Kim et al
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Title:
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METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2045 E. INNOVATION CIRCLE |
| TEMPE, ARIZONA 85284 |
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| AMKOR TECHNOLOGY, INC. C/O MCANDREWS, HE |
| 500 WEST MADISON ST., FLOOR 34 |
| CHICAGO, IL 60661 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE SECOND INVENTOR'S EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 053193 FRAME: 0338. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT .
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| 2045 E. INNOVATION CIRCLE |
| TEMPE, ARIZONA 85284 |
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| MCANDREWS HELD & MALLOY, LTD |
| 500 WEST MADISON STREET |
| SUITE 3400 |
| CHICAGO, IL 60661 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 491B RIVER VALLEY ROAD |
| VALLEY POINT #12/03, SINGAPORE 248373 |
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| MCANDREWS HELD & MALLOY, LTD |
| 500 WEST MADISON STREET |
| SUITE 3400 |
| CHICAGO, IL 60661 |
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