Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/16/2023
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Application #:
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16911153
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Filing Dt:
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06/24/2020
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Publication #:
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Pub Dt:
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03/25/2021
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Inventors:
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Kishore N. Renjan, Bilal Mohamed Ibrahim Kani, Kyusang Kim, Manoj Vadeentavida et al
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Title:
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Embedded Packaging Concepts for Integration of ASICs and Optical Components
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE APPLE PARK WAY |
| CUPERTINO, CALIFORNIA 95014 |
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| APPLE-J /JAFFERY WATSON MENDONSA & HAMIL |
| 7501 VILLAGE SQUARE DRIVE |
| SUITE 206 |
| CASTLE PINES, CO 80108 |
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