Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/13/2023
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Application #:
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17462505
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Filing Dt:
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08/31/2021
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Publication #:
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Pub Dt:
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03/02/2023
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Inventors:
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Yu-Sheng LIN, Shu-Shen YEH, Chin-Hua WANG, Po-Yao LIN, Shin-Puu JENG
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Title:
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SEMICONDUCTOR DIE PACKAGE WITH RING STRUCTURE FOR CONTROLLING WARPAGE OF A PACKAGE SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| 8110 GATEHOUSE ROAD, SUITE 100 EAST |
| FALLS CHURCH, VA 22042 |
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