Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/15/2023
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Application #:
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16863632
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Filing Dt:
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04/30/2020
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Inventors:
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Kei-Wei CHEN, Kuo-Hsiu WEI, Yuan-Hsuan CHEN, Ying-Lang WANG
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Title:
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WAFER THINNING APPARATUS HAVING FEEDBACK CONTROL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300 |
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HAUPTMAN HAM, LLP (TSMC) |
2318 MILL ROAD |
SUITE 1400 |
ALEXANDRIA, VA 22314 |
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05/26/2024 07:03 AM
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