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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
08/22/2023
Application #:
16792633
Filing Dt:
02/17/2020
Publication #:
Pub Dt:
08/19/2021
Inventor:
Fabian Radulescu
Title:
Semiconductor Having a Backside Wafer Cavity for Radio Frequency (RF) Passive Device Integration and/or Improved Cooling and Process of Implementing the Same
Assignment: 1
Reel/Frame:
051832/0923Recorded: 02/17/2020Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/17/2020
Assignee:
4600 SILICON DRIVE
DURHAM, NORTH CAROLINA 27703
Correspondent:
BAKERHOSTETLER
WASHINGTON SQUARE, SUITE 1100
1050 CONNECTICUT AVE. N.W.
WASHINGTON, DC 20036-5304
Assignment: 2
Reel/Frame:
059085/0667Recorded: 02/14/2022Pages: 7
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/04/2021
Assignee:
4600 SILICON DRIVE
DURHAM, NORTH CAROLINA 27703
Correspondent:
BAKERHOSTETLER
1050 CONNECTICUT AVENUE, NW
SUITE 1100
WASHINGTON, DC 20036
Assignment: 3
Reel/Frame:
066236/0086Recorded: 12/29/2023Pages: 65
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/06/2023
Assignee:
100 CHELMSFORD STREET
LOWELL, MASSACHUSETTS 01851
Correspondent:
ROB WINDER
4000 MACARTHUR BLVD
NEWPORT BEACH, CA 92660

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