Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/29/2023
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Application #:
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17731843
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Filing Dt:
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04/28/2022
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Inventors:
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Venkateshwar R. Aitharaju, Selina X. Zhao, Ritesh Dixit, Terrence Wathen et al
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Title:
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MOLD FOR FORMING COMPOSITE PREFORMS WITH HIGH PRECISION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 300 |
| MAIL CODE 482-C23-B21 |
| DETROIT, MICHIGAN 48265-3000 |
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| QUINN IP LAW |
| 21500 HAGGERTY ROAD, STE 300 |
| NORTHVILLE, MI 48167 |
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05/29/2024 03:24 PM
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