Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/10/2023
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Application #:
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17889807
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Filing Dt:
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08/17/2022
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Publication #:
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Pub Dt:
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08/03/2023
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Inventors:
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Jianfeng Wang, Zhisong Chai, Wei Xu, Qi Lu, Congjie Wang
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Title:
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STAMPED COMPONENTS WITH REDUCED HOT-FORMING CYCLE TIME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 300 |
| MAIL CODE 482-C23-B21 |
| DETROIT, MICHIGAN 48265-3000 |
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| QUINN IP LAW |
| 21500 HAGGERTY ROAD, STE 300 |
| NORTHVILLE, MI 48167 |
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05/23/2024 06:26 PM
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