Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/24/2023
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Application #:
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17553519
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Filing Dt:
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12/16/2021
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Publication #:
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Pub Dt:
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06/22/2023
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Inventors:
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Eric Zhu, Michael Zhai, Shuo Zhang, Minto Zheng, Town Zhang, Jie Ma
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Title:
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Staggered Dual-Side Multi-Chip Interconnect
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2788 SAN TOMAS EXPRESSWAY |
| SANTA CLARA, CALIFORNIA 95051 |
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| CHARLES A. MIRHO |
| 431 H STREET |
| CRESCENT CITY, CA 95531 |
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05/23/2024 01:06 AM
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