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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
06/28/1988
Application #:
06856926
Filing Dt:
04/28/1986
Inventors:
ROBERT L. COMSTOCK, STEVEN L. BABUREK
Title:
INTEGRATED CIRCUIT DIE-TO-LEAD FRAME INTERCONNECTION ASSEMBLY AND METHOD
Assignment: 1
Reel/Frame:
004545/0290Recorded: 04/28/1986Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
04/25/1986
Exec Dt:
04/25/1986
Assignee:
2175 MISSION COLLEGE BLVD.,
SANTA CLARA, CALIFORNIA 95054
Correspondent:
THOMAS S. MAC DONALD
SKJERVEN, MORRILL, MAC PHERSON
FRANKLIN & FRIEL
3600 PRUNERIDGE, STE. 100
SANTA CLARA, CA 95051
Assignment: 2
Reel/Frame:
004854/0897Recorded: 03/28/1988Pages: 7
Conveyance:
MERGER, SEE DOCUMENT FOR DETAILS.
Assignor:
Exec Dt:
02/05/1988
Assignee:
A DELAWARE CORPORATION
Correspondent:
SKJERVEN, MORRILL, MACPHERSON
FRANKLIN 6 FRIEL
3600 PRUNERIDGE SUITE 100
SANTA CLARA, CA 95051

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