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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
07/25/1989
Application #:
07067838
Filing Dt:
06/29/1987
Inventors:
JOHN P. SHORT, GEORGE V. ROUSE
Title:
DIELECTRIC ISOLATION PROCESS USING DOUBLE WAFER BONDING
Assignment: 1
Reel/Frame:
004753/0764Recorded: 06/29/1987Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
06/26/1987
Exec Dt:
06/26/1987
Assignee:
1025 WEST NASA BOULEVARD
A CORP. OF DE
MELBOURNE, FLORIDA 32919
Correspondent:
WILLIAM A. TRONER
HARRIS SEMICONDUCTOR
P.O. BOX 883, M/S 53-055
MELBOURNE, FL 32901-0101
Assignment: 2
Reel/Frame:
010247/0043Recorded: 09/27/1999Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/13/1999
Assignee:
2401 PALM BAY ROAD, N.E.
PALM BAY, FLORIDA 32905
Correspondent:
FISH & RICHARDSON P.C.
TIMOTHY A. FRENCH
225 FRANKLIN STREET
BOSTON, MA 02110-2804
Assignment: 3
Reel/Frame:
010351/0410Recorded: 11/08/1999Pages: 122
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/13/1999
Assignee:
11 MADISON AVENUE
NEW YORK, NEW YORK 10010
Correspondent:
CRAVATH, SWAINE & MOORE
CHIANN BAO
WORLDWIDE PLAZA, 44TH FLOOR
825 EIGHTH AVENUE
NEW YORK, NY 10019

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