Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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11/07/1989
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Application #:
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07264749
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Filing Dt:
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10/31/1988
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Inventors:
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JERRY I. TUSTANIWSKYJ, KYLE G. HALKOLA
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Title:
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LIQUID COOLED MULTI-CHIP INTEGRATED CIRCUIT MODULE INCORPORATING A SEAMLESS COMPLIANT MEMBER FOR LEAKPROOF OPERATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| CHARLES J. FASSBENDER |
| UNISYS CORPORATION |
| 10850 VIA FRONTERA |
| SAN DIEGO, CA 92127 |
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Assignment:
2
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PATENT SECURITY AGREEMENT (PRIORITY LIEN)
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| 60 WALL STREET |
| MS-NYC60-2710 |
| NEW YORK, NEW YORK 10005 |
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| LATHAM & WATKINS LLP |
| 650 TOWN CENTER DRIVE, 20TH FLOOR |
| COSTA MESA, CA 92626 |
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Assignment:
3
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PATENT SECURITY AGREEMENT (JUNIOR LIEN)
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| 60 WALL STREET |
| MS-NYC60-2710 |
| NEW YORK, NEW YORK 10005 |
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| LATHAM & WATKINS LLP |
| 650 TOWN CENTER DRIVE, 20TH FLOOR |
| COSTA MESA, CA 92626 |
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