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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
09/11/1990
Application #:
07267223
Filing Dt:
11/04/1988
Inventor:
FLOYD EIDE
Title:
INTEGRATED CIRCUIT CHIP STACKING
Assignment: 1
Reel/Frame:
004973/0132Recorded: 11/04/1988Pages: 1
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignor:
Exec Dt:
11/03/1988
Assignee:
7321 LINCOLN WAY
GARDEN GROVE, CALIFORNIA 92641
Correspondent:
SPENSLEY, HORN, JUBAS & LUBITZ
1880 CENTURY PARK EAST, SUITE 500
LOS ANGELES, CA 90067
Assignment: 2
Reel/Frame:
007175/0946Recorded: 10/28/1994Pages: 12
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/12/1994
Assignees:
H. HENNEAULAAN 366
1930 ZAVENTEM, BELGIUM
747 E. GREEN STREET, SUITE 309
PASADENA, CALIFORNIA 91001
Correspondent:
JOHN P. SCHERLACHER, ESQ.
SPENSLEY HORN JUBAS & LUBITZ
1880 CENTURY PARK EAST
FIFTH FLOOR
LOS ANGELES, CALIFORNIA 90067-1605
Assignment: 3
Reel/Frame:
016026/0630Recorded: 05/20/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/06/2004
Assignee:
2923 SATUM STREET
BREA, CALIFORNIA 92821
Correspondent:
RYAN M. PATCH, ESQ.
YOCCA PATCH & YOCCA, LLP
19900 MACURTHUR BLVD.
SUITE 650
IRVINE, CA 92612

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