Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/15/1991
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Application #:
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07539769
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Filing Dt:
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06/18/1990
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Inventor:
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BRADLEY H. NELSON
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Title:
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METHOD OF ASSEMBLING STACKS OF INTEGRATED CIRCUIT DIES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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DAVID SIGMOND |
MICROELECTRONICS & COMPUTER TECH. CORP. |
3500 WEST BALCONES CENTER DRIVE |
AUSTIN, TX 78759-6509 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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250 2-KA TAEPYUNG-RO |
CHUNG-KU |
SEOUL, KOREA, REPUBLIC OF |
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VOLENTINE FRANCOS, P.L.L.C. |
ANDREW J. TELESZ, JR. |
12200 SUNRISE VALLEY DRIVE |
SUITE 150 |
RESTON, VA 20191 |
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